Abstract: A mold release composition comprising at least one siloxane polymer having functional terminal groups; at least one siloxane polymer having at least one functional pendent group; and a crosslinking agent. The mold release agent is ready to mold composite parts in less than 30 minutes under room temperature curing conditions.

Abstract: The present invention relates to curable coating compositions which when cured are substantially transparent and exhibit resistance to markings such as graffiti and scuffing and particulate buildup. In particular, the compositions of the present invention when cured provide protective coatings to surfaces to prevent absorption and/or wetting of ink compositions. The invention composition may also be used as mold release agents.

Abstract: The present invention relates to a composition designed to be a release agent applied to the surface of a molding apparatus and method of using the composition in molding operations. The composition includes a siloxane composition, hydrophilic matting particles, a cross linking agent, a binding agent having hydrophobic and hydrophilic characteristics. The composition may optionally include a carrier. The composition is designed to be applied to the surface of a mold, allowing for repeated use without the need for re-applying the composition between uses.

Abstract: An adhesive composition having thermal conductivity as well as excellent dispensability properties is provided. The adhesive composition includes a curable resin component, a curing agent for the curable resin component, and a conductive filler material. The filler material is an alloy of copper and silver. The specific ratios of the copper and silver in the alloy are tailored so as to provide the adhesive composition with appropriate thermal conductivity and dispensing properties making the composition particularly useful for application in the semiconductor industry.

Abstract: The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Abstract: The present invention relates to adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to inventive toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.

Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.

Abstract: A two component polyurethane adhesive composition having one or more polyols as a first component and one or more isocyanates as a second component. The composition also comprises one or more catalysts and one or more blocking agents to delay the curing reaction. The composition provides long open time, improved wet out of the substrates to be bonded, a rapid cure rate and excellent final bond performance at room and elevated temperatures. Optional ingredients, such as fillers, chain extenders and plasticizers may be added as desired. In one embodiment, the catalyst is a tin catalyst such as dibutyl tin dilaurate which may optionally be combined with other catalysts such as tertiary amines. The blocking agent in one embodiment is 8-hydroxyquinoline.

Abstract: A filler-containing an organic polymer dispersion is provided. The organic polymer of the dispersion is polymerized in the presence of particles of at least one filler. The ratio of the particle size of the filler particles to the particle size of the polymer particles is in the range of from 1.1:1 to 20:1.

Abstract: A curable composition for forming anisotropically conductive bonds comprising: (i) an amount of first substantially uncured curable component; (ii) conductive particles coated with a substantially uniformly thick coating of the cure product of a second curable component dispersed within the first curable cyanoacrylate component. The composition is suitable for use as an adhesive composition for bonding chips to electronic circuits. Desirably the first component and the second component are both cyanoacrylates.

Abstract: The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good workability intrinsic to a light curable resins. The invention provides a cationically curable epoxy resin composition comprising: (a) an epoxy resin component; (b) a cationic photo-initiator; (c) a cationic thermal-initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing a Group II element in the long periodic table.

Abstract: UV curable compositions, polymeric photoinitiators and precursors therefor are described.

Abstract: The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.

Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.

Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.

Abstract: The present invention relates to compositions comprising an epoxy resin; a reagent selected from the group of cationic compounds or compounds which are capable to form cationic compounds or mixtures of those; at least one compound with two aromatic rings and at least one central cyclic oxygen bridged ring and the use of such compositions in adhesives, sealants and coatings.

Abstract: The invention relates to an outer container for holding an inner container in particular where the inner container has a sensitive product. The outer container comprises at least one of a moveable display board; retaining formations for retaining a hygroscopic element; or a stand for gripping the base of the inner container to retain it in an upright position. The invention also relates to a combination pack comprising the inner container retained in the outer container, particularly where the inner container holds a moisture sensitive product such as an adhesive.

Abstract: The present invention relates to anaerobically curable compositions based on (meth)acrylate-functionalized poly(acrylate) polymers.

Abstract: An anti-seize composition which is non-flowable and dimensionally stable at temperatures greater than about 120° F. and dispensable at room temperature without the application of heat is provided. The composition includes a solid anti-seize lubricant, such as of metallic copper, metallic nickel, metallic aluminum, metallic lead, metallic zinc, graphite, calcium oxide, calcium carbonate, calcium fluoride, calcium stearate, lithium, molybdenum disulfide, boron nitride, barium sulfate. or combinations thereof. The anti-seize lubricant is dispersed in a carrier which is a solid at about room temperature. The carrier includes a grease with an ASTM D 217 penetration at 25° C. from about 200 to about 400 mm, a matrix material, and a naphthenic petroleum oil having a viscosity of less than about 300 SUS at 100° F. and having an API gravity at 60° F. from about 23 to about 25. The matrix material is a polymeric material. Optionally, a refined petroleum wax may also be included.

Abstract: A sealed multi-compartment package includes a wipe and a mold release agent which are kept separate from one another until the time of use. The package includes a first compartment for containing a fabric-like wipe and a second compartment in sealed separation from the first compartment containing a mold release agent. The first and second compartments are in communication and separated by a displaceable seal. Upon displacement of the seal, the mold release agent and the wipe are brought into mutual contact.