Patents Assigned to Foxconn Precision Components Co., Ltd.
  • Patent number: 6665934
    Abstract: A method for making a heat dissipation device (3) includes the steps of: providing a metal plate (2) and a fin member (1), bending the metal plate to form a body (2′), and attaching the fin member to the body. The metal plate includes a central portion (22) and a pair of end portions (24). The central portion is thicker than the end portions. The body includes a chassis (22′) originating from the central portion of the metal plate, and a pair of side walls (24′) originating from the end portions of the metal plate. The fin member is attached to the chassis between the side walls.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: December 23, 2003
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei Ta Lo
  • Patent number: 6666261
    Abstract: A liquid cooler (1) includes a body (10) and a cover (20) attached on the body. The body includes a base (12) with a first cavity (126) accommodating liquid, a central hollow cylinder (16) having a passage (164) in communication with the first cavity, and a plurality of vertical tubes (18) in communication with the first cavity. A plurality of fins (162) extends outwardly from the hollow cylinder. The cover defines a second cavity (26) in communication with the passage and the tubes. The liquid within the first cavity is heated by a heat-generating electronic device and moved to the second cavity through the tubes. Heated liquid which has reached the second cavity flows down through the passage along an inner surface of the hollow cylinder and returns back to the first cavity. The heated liquid is cooled by the fins conducting heat away from the hollow cylinder.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: December 23, 2003
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Chih-Hao Yang, Timin Zhang
  • Patent number: 6650536
    Abstract: A cooling system for a computer (10) includes a thermoelectric cooler (20) attached to a side panel (14) of the computer, an internal heat sink (30) attached on an electrical component, a cooling fan (52) attached on one side of the internal heat sink, a fan duct (50) connected between the thermoelectric cooler and the cooling fan, an exhaust fan (80), and an external heat sink (70) attached on the side panel opposite to the thermoelectric cooler. When electrified, the thermoelectric cooler is polarized to generate a hot surface in contact with the side panel and a cold surface facing toward an interior of the computer. The cooling fan sucks cold air from around the cold surface, and blows the cold air through and over the internal heat sink. The air is then expelled from the computer by the exhaust fan, and directed toward the external heat sink.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: November 18, 2003
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Tsung Lung Lee, Chung Tien Lai, Shuai Jiang
  • Patent number: 6636424
    Abstract: A heat dissipation device includes a heat sink (30), a metal plate (50), and a clip (20). The heat sink has a chassis (36) with thermally conductive material (40) applied thereunder. The metal plate is attached to the material in order to be in thermal contact with the chassis. The metal plate is then directly attached to a CPU (60). The clip is engaged with a socket (70) that supports the CPU, to facilitate the metal plate intimately contacting the CPU. The metal plate prevents the CPU from moving from the socket should the heat dissipation device be accidentally moved or displaced. This reduces any risk of damage to the CPU. In addition, heat generated from the CPU is efficiently removed.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: October 21, 2003
    Assignee: Foxconn Precision Components, Co., Ltd.
    Inventors: Hsieh Kun Lee, Donyun Lee
  • Patent number: 6552902
    Abstract: A heat sink (10) includes a circular base (20), a plurality of fins (30), and a central post (40). The base is adapted to be in thermal contact with an electronic device, to remove heat therefrom. The post extends from a top surface (26) of the base. The post has a first surface connected to the top surface and a second surface (44) dimensioned according to a heat sink fan to be attached thereon. The post also has a concave side surface (42) between the second surface of the post and the top surface of the base, for directing airflow. The fins are identical in height to the post. The fins are curved, aligned and spaced from each other at uniform intervals corresponding to directions of airflow generated from the fan. These minimize resistance to cooling air entering or exiting the heat sink.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: April 22, 2003
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Eric Cho, Carey Lai, Mark Lin
  • Patent number: 6520250
    Abstract: A fan holder (10) for attaching a fan (30) to a heat sink (40) includes a base (11) defining an opening (18) therethrough, two pairs of hooks (14), two pairs of posts (16) around the opening, a pair of positioning blocks (22), and two pairs of slots (15) defined in the base. The hooks depend from the base, and engage in grooves (46) defined through fins (42) of the heat sink. The posts extend upwardly from the base, and are received in corresponding holes (32) of the fan. Each post has a resilient engaging portion (24) and a notch (25), which allow the engaging portion to elastically compress and firmly attach the fan on the fan holder. The positioning blocks are formed under the base, on opposite sides of the opening. The slots are adjacent the hooks, and allow easy disassembly of the fan holder from the heat sink.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: February 18, 2003
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Dongyun Lee, Hsieh Kun Lee
  • Patent number: 6466445
    Abstract: A clip (10) for securing a heat sink (20) to an electronic device (30) mounted on a circuit board (35) between two retention modules (40) includes a central pressing portion (12), a pair of spring portions (14), a pair of legs (16, 17) for engaging with one retention module, a connection plate (174) extending outwardly from a distal end of one leg, and a handle (18) extending inwardly from a distal end of the connection plate. A pair of ribs (142) is formed on the clip for reinforcing the clip. The handle comprises a strip (188) engaging with a joint section of the clip between one spring portion and one leg, and a flange (186) opposite to the strip and abutting one edge of the joint section. When the handle is downwardly pressed, the leg connected with the handle moves outwardly thereby disengaging the leg from the retention module.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: October 15, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6453530
    Abstract: A tool (1) for mounting a heat sink clip (80) to a CPU socket (100) includes a handle (10) and a lever (40) pivotally attached to the handle. The handle includes a body (12) and first and second legs (14, 16). The second leg has two tabs (30) defining two first pivot holes (32) therein. The lever defines a second pivot hole (50). A pivot pin (60) is extended through the first and second pivot holes, thereby pivotally attaching the lever to the handle. The handle downwardly presses the clip to engage a first arm of the clip with a catch of the socket. The lever is rotated so that a bent portion (52) thereof inwardly pushes a second arm of the clip to engage with another catch of the socket. A spring (70) connected between the handle and the lever draws the lever back to its original position.
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: September 24, 2002
    Assignee: FoxConn Precision Components Co., Ltd.
    Inventor: Tien Lu Kao
  • Patent number: 6450251
    Abstract: A heat removal system includes a heat dissipation assembly (10) and a system fan (20) which cooperatively achieve optimized heat dissipation efficiency. The heat dissipation assembly includes a heat sink (12) and an angled fan (14). The heat sink includes a base (122) and a plurality of parallel fins (124). A slanted surface (126) is defined by a set of adjacent edges of the fins. The fan defines a through hole (142) at each of four corners thereof. Four screws (144) extend through the through holes, thus attaching the fan to the heat sink at the slanted surface. A rotational axis of the fan intersects a central portion of the base of the heat sink, which portion defines a region of highest temperature of the heat sink. The angled fan together with the system fan provide maximized cooling airflow.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: September 17, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yeu Lih Lin, Carey Lai, Zili Zhang
  • Patent number: 6452803
    Abstract: A heat sink assembly includes a heat sink (10), and a clip (30). The heat sink includes a base (12) defining an annular groove (14), and a plurality of upwardly extending fins (16). A cavity (18) defined in the fins accommodates a fan (20). The clip includes a generally annular body (32), a first arm (34) pivotably attached to the body, and a second arm (42) fixedly attached to the body. The body defines a cutout (36) for facilitating elastic deformation thereof. The body further defines a pair of apertures (40), and the first arm forms a pair of projections (46). The first arm is rotated and the body is squeezed so that the projections are engaged in the apertures. The body is thereby securely received in the groove and engaged with the base. When the projections are disengaged from the apertures, the body is disengagable from the base.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: September 17, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Herben Liu
  • Patent number: 6452801
    Abstract: A clip (10) comprises a pressing body (12) adapted to press onto a heat sink (40). First and second arms (14, 15) extend outwardly and upwardly from opposite ends of the pressing body. A pair of flanges (36) extends perpendicularly outwardly from opposite edges of the second arm. A horseshoe-shaped locking slot (38) is defined in each flange. An operation portion (24) extends upwardly and then downwardly from an end of the second arm. The operation portion has an engaging hole (18) for engagingly receiving a socket (50). A pair of locking bars (34) extends from opposite edges of the operation portion, and is slidably accommodated in the locking slots. Pushing the operation portion causes the locking bars to slide along the locking slots until they snap into place, whereby the clip is securely attached to the socket and firmly presses the heat sink against an electronic device (60).
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: September 17, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6449151
    Abstract: A heat sink assembly includes a heat sink (10), a frame (30), a fan (50), and a fastener (70). The heat sink has a pair of diagonally opposite vertical poles (20). An annular step (201) is formed on each pole at a position higher than a top extremity of fins (107) of the heat sink. An annular groove (203) is defined in the vicinity of a top end of each pole. The frame has a central opening (303), and a pair of apertures (301) at diagonally opposite corners of the frame. Four through hole (501) are defined in four corners of the fan. The fastener has two mutually perpendicular fixing arms (702). Each fixing arm defines a semicircular cutout (705) at an inner edge of a free end thereof. The fixing arms at the cutouts engage in the grooves of the poles, thereby securing the fan to the heat sink.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: September 10, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6442816
    Abstract: A tool (100) for mounting a clip (60) to a CPU socket (90) includes a body (110), and a pair of feet (130) attached on opposite sides of the body. The body includes a handle (112), a presser (114) for downwardly pressing the clip, and a finger (116) with a claw (120) for catching a bar (70) of a leg (62) of the clip thereby allowing the body to outwardly rotate the leg. The handle defines two first holes (118) for extension of two pins (140) therethrough. Each foot includes a connection portion (132) and a toe (134). Two second holes (136) are defined in each foot, for retaining ends of the pins. The pins thereby attach the feet to the handle. The toes abut the socket, thereby allowing the tool to be safely rotated in contact with the socket.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: September 3, 2002
    Assignee: FoxConn Precision Components Co., Ltd.
    Inventor: Tien Lu Kao
  • Patent number: 6442836
    Abstract: A method for forming a folded fin includes at least the following steps: providing a horizontal metallic strip; forming number of pairs of indents alternately in a top face and a bottom face of the strip; clamping the strip with three folding tools, wherein a first tool is located between a first pair of indents in the top face of the strip, a second tool is located between a successive second pair of indents in the bottom face of the strip and a third tool is located between a fuirther successive third pair of indents in the top face of the strip; and moving the second and third tools toward the first tool to a position where parts of the strip between the first and second tools and between the second and third tools are bent to be vertical, wherein the third tool moves horizontally toward the first tool and the second tool moves at an angle toward an upper side of the first tool.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: September 3, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yu Ping Chen, Kuo Chuan Lin, Chao-Kun Tseng
  • Patent number: 6430049
    Abstract: A clip (10) for securing a heat sink (20) to an electronic device (30) includes a body (12) and a pair of fasteners (16) attached to opposite ends of the body. The body has a pressing portion (122), a pair of first connection portions (126) extending away from opposite ends of the pressing portion, and a fixing portion (134) depending from the pressing portion. The fixing portion includes a pair of stopping tabs (138). The pressing portion and the fixing portion each form a projection (142). The stopping tabs are received in cutouts (28) of the heat sink, to prevent the clip from moving parallel to grooves (26) defined in the heat sink. The projections are received in the grooves, to prevent the clip from moving perpendicular to the grooves. Thus a pair of clips and the heat sink are securely combined to form a single assembly (50).
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: August 6, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Cheng Tien Lai, Chao Wang
  • Patent number: 6430051
    Abstract: A clip (10) for securing a heat sink (20) to a CPU (30) mounted on a CPU socket (40) includes first and second latching arms (50, 70) and a connecting portion (80). The first latching arm includes a horizontal first main body (52), and a first through hole (58) defined in the first main body. The second latching arm includes a horizontal second main body (72), and a second through hole (78) defined in the second main body. An end of the second main body directly confronts an end of the first main body. The connecting portion defines a pair of first and second pivot holes (86, 88), and is pivotally connected to each of the first and second latching arms. The connecting portion is rotated, and the second latching arm climbs up and along the first latching arm. The clip thereby firmly engages with catches of the CPU socket.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: August 6, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Ming Hung Yang, Cheng-Chi Lee
  • Patent number: 6424530
    Abstract: A clip (10) securing a heat sink (20) to a heat-generating device (40) for removing heat therefrom comprises a body (12) and a pair of arms (14, 16) extending from the body. The body is positioned in a groove of the heat sink, for pressing the heat sink against a heat-generating device. The body integrally forms a loop (122) which receives a fin (24) of the heat sink, for enhancing engagement of the clip with the heat sink. Hooks (142, 162) at ends of the arms engage with holes defining in a substrate (30) on which the heat-generating device is mounted, thereby securing the heat sink against the heat-generating device.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: July 23, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsieh Kun Lee, Wellint Xia
  • Patent number: 6421242
    Abstract: A heat sink clip (1) includes a handle portion (10), a connecting portion (20) and a sliding portion (30). The handle portion has two side plates (14), a hook (19) extending perpendicularly from one of the side plates, and a pressing cam (15) formed at a bottom end of the other side plate. Each side plate defines a through hole (18) and an arcuate sliding slot (16) in the vicinity of the bottom end of the side plate. The connecting portion has a first cantilever (22) and a first locking arm (28). The first cantilever has a pair of pivot holes (26) in alignment with the through holes, for extension of a pin (40) therethrough. The sliding portion has a second cantilever (32) and a second locking arm (36). The second cantilever has a pair of pivot tabs (34) for sliding within the sliding slots of the handle portion.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: July 16, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6418025
    Abstract: A clip (10) for attaching a heat sink to an electronic device mounted on a circuit board includes a body (17) and a handle (15) extending from the body for facilitating operation of the clip. An arcuate spring tab (12) extends from the body and elastically engages with the heat sink. A pair of cutouts (16) is defined in opposite edges of the body for accommodating thickness of the circuit board. A pair of elastically deformable barbs (14) is formed at a distal end of the body for engaging with the circuit board to securely fix the heat sink to the circuit board.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: July 9, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chao Yang Lee
  • Patent number: 6418022
    Abstract: A clip (1) comprises a main body (10) and an operating bar (30). The main body has a pressing section (12) adapted to press onto a heat sink (40). First and second arms (14, 15) extend outwardly and upwardly from opposite ends of the pressing section. A pair of flanges (24) extends perpendicularly outwardly from opposite edges of the second arm. A horseshoe-shaped locking slot (26) is defined in each flange. The operating bar has an engaging hole (19) for engagingly receiving a socket (50). A pair of sliding shafts (32) extends from opposite edges of the operating bar, and is slidably accommodated in the locking slots. Pushing the operating bar causes the sliding shafts to slide along the locking slots until they snap into place, whereby the clip is securely attached to the socket and firmly presses the heat sink against an electronic device (60).
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: July 9, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen