Patents Assigned to Foxconn Precision Components Co., Ltd.
  • Patent number: 6418393
    Abstract: An inspecting device for a thermal module for cooling a CPU of a computer to decide whether the module can work properly is disclosed. The device includes a computer stored with preset data. A measuring unit has a heater generating heat with a predetermined temperature. A converter electrically connects the heater with the computer and converts an analogous signal corresponding to the temperature of the heater to a digital signal which is sent to the computer. A force generating mechanism is provided on the measuring unit which can generate a pressing force toward the heater. When the heater is contact with a heat-generating component contact part of the thermal module and the force generating mechanism is activated to press the part against the heater, the computer compares the data stored therein and the signal received from the converter to determine whether the thermal module can attain its required performance.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: July 9, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Chun-Hsin Lu, Pao-Lung Lin, Nien-Tien Cheng
  • Patent number: 6415852
    Abstract: A heat sink assembly (1) includes a heat sink (10), and a fan (20) attached to the heat sink. The fan is box-shaped, and defines two recesses (24) in each of two opposite side walls (22) thereof. The heat sink includes a base (12) and a plurality of parallel fins (14) extending upwardly therefrom. The fins include two engaging fins (16) at each of two opposite lateral sides of the heat sink. A wedge-shaped inside catch (18) is formed at a distal end of each engaging fin, for engaging with the corresponding recess of the fan. In assembly, the fan is pressed downwardly so that the engaging fins elastically deform, and the catches enter the recesses of the fan. Thus the fan is readily and securely attached to the heat sink. In an alternative embodiment, catches (18′) of the heat sink (10′) engage in through holes (26) of the fan.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: July 9, 2002
    Assignee: FoxConn Precision Components Co., Ltd.
    Inventor: Wei Ta Lo
  • Patent number: 6418018
    Abstract: A heat removal system of the present invention includes a fan (30) of a power supply (20), a heat sink (50) mounted to the fan, and a heat pipe (60) connecting the heat sink to a CPU (24). The heat sink includes a cylindrical base (52) and a plurality of radial fins (54) around the base. Four bolts (40) attach the heat sink and the fan to the power supply. A central bore (58) is defined in the base of the heat sink, for receiving one end of the heat pipe. The other end of the heat pipe is attached to a top surface of the CPU. Heat generated by the CPU is thereby conducted to the heat sink via the heat pipe, and then dissipated outside of a computer enclosure by forced convection of the fan.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: July 9, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei Ta Lo
  • Patent number: 6412546
    Abstract: A heat dissipation device includes a heat sink (80) and an assembling device for securing the heat sink to a, chip (90) mounted on a printed circuit board (100). The heat sink has a pair of ears (82) each defining an aperture (84) therein. The assembling device includes a clip (70), a pair of sleeves (50) each defining a cavity (62) therethrough, and a pair of springs (60). Each sleeve extends through the aperture of a corresponding ear of the heat sink, and the springs are disposed respectively between the ears and an end of the sleeves. The clip has a pair of posts (66) for extending through the printed circuit board to engage with the corresponding cavities.
    Type: Grant
    Filed: July 17, 2000
    Date of Patent: July 2, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yeu-Lih Lin, Chao-Yang Lee, Chung-Yung Sun, Chao Kun Tseng
  • Patent number: 6414846
    Abstract: A heat sink assembly includes a heat sink (10) and a fixing device (20). The heat sink includes a base (12) and a plurality of fins (14) extending from the base. The base has a pair of exposed portions at opposite sides of the fins. The fixing device includes a clip (22) and a clamp (24). The clip includes a pair of spaced pressing portions (222) and a pair of engaging loops (228). The clamp has a body (242) with a pair of apertures (244) defined therein. The apertures engagingly receive the engaging loops of the clip, so that the clamp is secured to the clip. The pressing portions are received between fins of the heat sink. The clamp is located over one exposed portion of the heat sink. The pressing portions press the heat sink against an electronic device (50).
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: July 2, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6401806
    Abstract: A heat sink assembly includes a heat sink (40), a fan (30), and a fixing device (10). The fan has a chassis (32), and a hollow cylinder (34) extending upwardly therefrom. The heat sink has a base (42) which defines a pair of grooves (422) in a bottom surface thereof, and a plurality of fins (44) with a transverse slot (442) defined through the fins. The fixing device includes a body (12), and four resilient legs (14) depending from corners of the body. A pair of lips (22) depends from opposite edges of the body. A tab (24) extends inwardly from each lip, for engaging in the slot of the heat sink and thereby preventing the fixing device from moving laterally. A hook (18) is formed at a distal end of each leg, for engaging in the grooves and thereby attaching the fan to the heat sink.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: June 11, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Tsung Lung Lee, Chung Tien Lai, Zili Zhang
  • Patent number: 6404630
    Abstract: A fan duct (10) for heat dissipation includes a hollow clasp (14), a base (16), and a flexible pipe (12) connecting the hollow clasp and the base. The clasp includes a hollow first connecting portion (142) connected to an end of the flexible pipe, a hollow funnel portion (144), and an upper disc (145) attachable to a computer enclosure (50). The base has a body receiving a fan (30) therein. A pair of catches (164) depends from opposite sides of the body, to engage with a bottom surface of the fan. The base also has a hollow second connecting portion (166) connected to an opposite end of the flexible pipe, thereby attaching the fan duct to the fan. The flexible pipe is made of pliable material, so that its length and shape can be adjusted according to a particular inner configuration of the enclosure.
    Type: Grant
    Filed: January 24, 2001
    Date of Patent: June 11, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chung Tien Lai
  • Patent number: 6396697
    Abstract: A heat dissipation assembly includes a fan (10), a heat sink (20) and a holder (40) attaching the fan on the heat sink. The fan defines four through holes (104) at four corners thereof. The heat sink includes a base (201) with two grooves (205) defined thereunder, and a plurality of fins (202) attached on the base. The fins define a channel (204) there though. The holder includes two identical and opposing holder members (409). Each member includes a flange (402) with a vertical tab (404) for extending into one corresponding through hole of the fan, and a screw hole (403) for engaging with a screw (102) which extends through another corresponding through hole. Each member has two horizontal tabs (408) for inserting into the grooves of the base. Each member defines an opening (406) in alignment with the channel, for accommodating a heat sink clip (30).
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: May 28, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Yun Lung Chen
  • Patent number: 6396696
    Abstract: A clip (40) for securing a heat sink (20) to an electronic device (35) includes a body (42) and a fastener (44) slidably attached to the body. The body has a central pressing portion (46), a pair of legs(54, 56) extending downwardly at opposite ends of the body, and a fixing plate (66) depending away from one side edge of the pressing portion. Bent tabs (68, 69) extend from opposite upper and lower edges of the fixing plate, thereby defining a receiving space for receiving the fastener therein. A pressing tab (62) depends from an edge of the pressing portion opposite to the fixing plate. The fastener defines a slot (76) therein, for engaging a projection (18) of a retention module (10). The clip thereby secures the heat sink to the electronic device.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: May 28, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yeu-Lin Lin, Aimin Huang
  • Patent number: 6396695
    Abstract: A clip (10) for securing a heat sink (30) to an electronic device (40) includes a base (12), a pair of handles (16) and a pressing portion (18). The handles extend outwardly from opposite ends of the base. The base defines a slot (14) for receiving a catch (62) of a retention module (60). The slot includes first and second portion (142, 146) and a neck portion (144) therebetween. Upper limits of all three portions are colinear. The first portion has a vertical width greater than that of the second portion. A triangular protrusion (13) at the neck portion renders the vertical width of he neck portion less than that of both the first and second portions. The pressing portion extends inwardly from a top edge of the base. A pair of resilient tabs (242) depends from the pressing portion, for abutting a groove (36) of the heat sink. The catch is initially received in the first portion of the slot, and then moved over the triangular protrusion to the second portion.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: May 28, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsieh Kun Lee, Dongyun Lee
  • Patent number: 6392888
    Abstract: A heat dissipation assembly comprises a printed circuit board (PCB) (20), a chip (30) and a heat sink (10). The PCB comprises a grounding circuit and four through apertures (22) in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns (16) depending from a bottom surface of a base (12) thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: May 21, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yung Chou Chen, Che Cheng Lin, Hsueh Sheng Hsiao
  • Patent number: 6392885
    Abstract: A fan holder (10) for attaching a fan (30) to a heat sink (40) includes a base (11) defining a vent (24) for allowing air flow, two pairs of legs (16, 18), two pairs of posts (14) around the vent and a pair of positioning blocks (22). The legs depend from the base, and each leg has a hook (166, 186) for engaging with the heat sink. A pair of slots (20) is defined in the base on opposite sides of each leg. A pair of handles (188) extends upwardly from one pair of legs, for facilitating operation of the holder. The posts extend upwardly from the base, for being received in corresponding holes (32) of the fan. Each post has a resilient tab (142), for resiliently and firmly attaching the fan on the holder. The positioning blocks are formed under the base, on opposite sides of the vent.
    Type: Grant
    Filed: April 5, 2001
    Date of Patent: May 21, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Dongyun Lee, Hsieh Kun Lee
  • Patent number: 6392889
    Abstract: A fastener (50) includes a pin (52), a spring (54) and a handle (56). The pin extends through a heat sink (10). The handle is pivotably attached to a top portion of the pin. The pin has a foot (522) extending through a mother board (30) and a supporting board (40) located under the mother board to engage with the supporting board. A CPU (20) is mounted on the mother board. The spring surrounds the pin and is located between a base of the heat sink and the handle. When the handle is rotated from a horizontal position to a vertical position, the handle compresses the spring toward the foot. The spring in turn presses the base of the heat sink against the CPU.
    Type: Grant
    Filed: August 21, 2001
    Date of Patent: May 21, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Tsung-Lung Lee, Cheng Tien Lai, Zi Li Zhang
  • Patent number: 6392886
    Abstract: A heat sink assembly includes a heat sink (30), a clip (20), and a fastener (10). The heat sink has a base (301) and a plurality of parallel fins (302) extending therefrom. A pair of barbs (303) is symmetrically formed on outmost sides of two adjacent central fins. The fastener includes a basal body (101), a pair of side arms (103) extending upwardly from the body, a pair of pressing plates (104) extending horizontally outwardly from top ends of the side arms, a pair of locking arms (105) depending from the pressing plates, and a pair of catches (106) inwardly formed at distal ends of the locking arms for engaging with the barbs of the heat sink. A notch (102) is defined in a bottom of the body, for facilitating the fastener abutting against a pressing section (201) of the clip.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: May 21, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsieh Kun Lee, Wellint Xia
  • Patent number: 6386274
    Abstract: A heat sink assembly includes a heat sink (10), a fixing device (40), and a fan (30). The heat sink has a base (16), an engaging body (12), an annular groove (14) defined in the engaging body, and a plurality of radial fins (18). A plurality of external teeth (122) extends from the engaging body. A protrusion (20) extends outwardly from one fin, and an engaging space (22) is defined adjacent the protrusion. A central space (24) between the fins accommodates the fan. The fixing device has a frame (42) defining an engaging opening (44) and having a plurality of internal teeth (442). The internal teeth are engaged in the groove against the external teeth. The fixing device has a stop tab (52) accommodated in the engaging space, and a latch (54) extending from the stop tab. The stop tab abuts the protrusion, and the latch presses against the protrusion.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: May 14, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Jing Liang Wang, Ming Hung Yang, Cheng-Chi Lee
  • Patent number: 6373701
    Abstract: A heat dissipation assembly (20) includes a heat sink (10) and a metal plate (30). The heat sink includes a chassis (14) and a plurality of fins (12). The chassis forms a pair of tabs (17) depending from each of two opposite sides of a bottom surface (15) of the chassis. First and second flanges (18, 19) respectively depend from the opposite sides, between the tabs. A material (45) with low thermal resistance is arranged between the metal plate and the chassis. The metal plate is attached to the bottom surface of the chassis. The flanges are bent inwardly to fasten the metal plate to the chassis.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: April 16, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6373699
    Abstract: A heat dissipation device (1) includes a chassis (10) and a fin member (20). The chassis is formed as a single unit by extrusion, and includes a top surface (11). Four parallel ribs (13) are formed on the top surface. A pair of slots (14) is difined in the top surface, adjacent the two outermost ribs. The slots are adapted for connection to a conventional fan frame (50). The fin member defines four grooves (21) and a channel (22) therethrough. The channel is between the innermost grooves, and is adapted to interferentially receive a conventional heat sink clip (60). The four grooves interferentially receive the ribs of the chassis, thereby securely attaching the fin member to the chassis.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: April 16, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Yun Long Chen
  • Patent number: 6367542
    Abstract: A heat sink assembly includes a heat sink (10), an internal fan (20), a fan frame (30), and an external fan (40). The heat sink includes a base (12) and a fin member (14) attached to the base. The fin member includes a central portion (142), and a plurality of fins (144) extending radially from the central portion. A central cavity (146) is defined in the fin member, surrounded by the fins. The internal fan is received in the cavity and supported by the central portion. The fan frame has an opening (34) defined therein, and is mounted on the heat sink. The external fan is mounted on the fan frame such that it covers the opening. The internal fan accelerates airflow from upper portions of the fin member to lower portions of the fin member.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: April 9, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6370024
    Abstract: A heat sink clip (30) includes a spring portion (31) and two arms (36) extending from respective opposite ends of the spring portion. The spring portion has a horizontal portion (35) which forms a tab (33) extending horizontally and then downwardly from a side edge of the horizontal portion. The tab defines a positioning hole (34) for engaging with a catch (62) formed on a side wall of a retention module (60). Each arm defines an aperture (37) for engaging with a beam (61) formed on each end of the retention module. The end of each arm extends outward to form a T-shaped handle (40). The handle includes an L-shaped connecting portion (41) and an L-shaped operation portion (42).
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: April 9, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6362962
    Abstract: A clip (30) for securing a heat sink (50) to a heat-generating electronic device (90) includes first and second fasteners (40, 60). The first fastener includes a body (41), and a pair of legs (49) depending from respective opposite ends of the body. The body has a stretch portion (411) in which cutouts (413) are defined to form a pair of fixing tabs (415). A pair of spring pressing portions (43) is formed at respective opposite ends of the body. Each spring pressing portion has a pressing tab (451) to be received in a slot (53) defined in the heat sink. The second fastener has a vertical panel (61) defining an opening (62) adapted to receive a clasp (72) of a retention module (70), and a slot (63) for receiving the fixing tabs of the first fastener therethrough. The fixing tabs are then deformed to secure the second fastener to the first fastener.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: March 26, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsieh Kun Lee, Zhi Sheng Lin