Patents Assigned to Foxconn Precision Components Co., Ltd.
  • Patent number: 6307748
    Abstract: A clip assembly (30) includes a nail member (40), a sleeve member (60), and a spring (50) around the sleeve member. The nail member includes a cap (42), a post (44), a neck (46) and a cone-shaped barb (48). A pair of wedges (442) is formed on an outer surface of the post. The sleeve member is cylindrical. The sleeve member defines a central bore (62) for receiving the nail member, and a pair of rectangular slots (66) for receiving the wedges. A circumferential shoulder (68) is formed on the sleeve member, for abutting against a bottom surface of a heat sink. A lower portion (72) of the sleeve member defines cutouts (722), thereby also forming deformable fingers (723). The sleeve member is interposed between the heat sink and a PCB. The nail member is inserted down through the lower portion, and elastically expands the fingers of the sleeve member.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: October 23, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yeu-Lih Lin, Ai-Min Huang
  • Patent number: 6304453
    Abstract: A heat sink assembly includes a heat sink (30), a clip (40) and two pairs of holders (50). The heat sink has a base (31) and a plurality of fins (32) extending from the base. A groove (34) is defined in each of two opposite side surfaces (36) of the base. The clip presses the heat sink onto an electronic device (60) mounted on a socket (70). Each holder has a fixing portion (51) for being interferentially inserted into the groove of the heat sink, and a positioning portion (52) for engaging with a side edge of the socket. The heat sink is thereby prevented from moving with respect to the electronic device.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: October 16, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: We-Ta Lo
  • Patent number: 6304452
    Abstract: A clip includes a pin (40) and a leaf spring (50). The pin includes a columnar body (44), an expanded head (42) formed at a top end of the body, and a cone-shaped plug (48) formed at a bottom end of the body opposite the head. A slot (488) is defined through the plug and a bottom portion of the body, to enable the plug to elastically deform. The plug is thus adapted for extending through a heat sink and engaging with a printed circuit board. A flange (46) extends perpendicularly from the body between the head and the plug. The leaf spring includes a base (51), with an opening (52) defined therein for extension of the pin therethrough. A pair of inflexed prolongations (53) extends progressively downwards from opposite corners of the base, with the width of each prolongation being less than half the width of the base.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: October 16, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6301112
    Abstract: A clip for mounting a heat sink to an electronic element includes a pressing body and a pair of latching arms extending from opposite ends of the pressing body. A sloped portion connects the pressing body with each latching arm. Each latching arm defines a latching opening for engaging with a corresponding latching projection of the electronic element. A handling tab is integrally extends outward from one of the latching arms. A slot is defined in the handling tab. Thus, when disassembling the clip from the electronic element, a tooling, such as a screwdriver, is partially inserted into the slot of the clip and then ensures an easy disengagement the latching opening of the clip from the latching projection of the electronic element.
    Type: Grant
    Filed: February 17, 2000
    Date of Patent: October 9, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Hsieh Kun Lee
  • Patent number: 6297966
    Abstract: A memory module assembly in accordance with the present invention comprises a memory module, such as a RAM module, and a pair of shells for enclosing the RAM module. The RAM module comprises a printed circuit board (PCB), a plurality of memory chips attached on the PCB and a plurality of related electronic elements disposed near the chips. A securing means comprises a clasp for fixing the PCB and the shells together at a middle portion proximate upper edges of the PCB and the shells, and a pair of rivets extending through corresponding positioning apertures defined proximate a bottom edge of the PCB and corresponding apertures defined proximate a bottom edge of the shell. The clasp is resilient and comprises a shoulder and a pair of resilient arms inwardly extending from opposite ends of the shoulder for securing the PCB and the shells together.
    Type: Grant
    Filed: September 15, 1999
    Date of Patent: October 2, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Shun-Jung Lee, Hsieh-Kun Lee
  • Patent number: 6295203
    Abstract: A clip assembly (40) for mounting a heat sink (30) to an electronic device (20) retained on a socket connector (10) includes a clip (50) and a fastener (60). The clip has an elongate spring portion (52) engaging a surface of the heat sink and two legs (54) extending from the spring portion for engaging with catches (12) of the socket connector, thereby securing the heat sink to the electronic device. The fastener includes a pair of latches (62) and a resilient connecting section (66) connected between the latches. Each latch has a protrusion (64) extending from a distal end thereof, each protrusion extending towards the opposite protrusion. The heat sink forms a plurality of fins (34) defining a slot (36) therebetween for receiving the clip and the fastener. The latches are configured to engage with grooves (38) defined in fins on opposite sides of the slot of the heat sink, thereby securely attaching the clip to the heat sink and effectively eliminating relative movement between the clip and the heat sink.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: September 25, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6273185
    Abstract: A heat sink assembly for use in conjunction with an electronic integrated circuit, such as a chip, comprises a heat sink and a pair of retainers. The heat sink includes a plate defining a large number of fins and a flat bottom surface. A locking protrusion is formed at a proper position of each side of the plate. Each retainer comprises a transition portion, two engaging arms perpendicular to each other, and a nail beneath the transition portion. A rectangular sheath is formed on a distal end of each engaging arm for cooperating with a corresponding locking protrusion. Each nail includes a main body, a neck section, a protruding section and a cone section. A slot is defined through the lower portion of the section and through the protruding section and the cone section.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: August 14, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yeu-Lih Lin, Chao-Yang Lee, Chao Kun Tseng
  • Patent number: 6257533
    Abstract: An attachment includes an upper locking element and a lower locking element assembled together. The upper locking element comprises a main plate, a folded section, a locking section and a locking tip. The lower locking element comprises a spring section, a first and second arms. Protrusions of the upper locking element engage with holes of the lower locking element, and the locking tip engages with a locking slot of the first arm. The lower locking element is strengthened by the upper locking element. The upper locking element acting as a handle for facilitating an assembly/unassembly process of attaching a heat sink to a CPU package.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: July 10, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsien-Shen Pei, Chao-Yang Lee
  • Patent number: 6250375
    Abstract: A clip (10) includes a body (12) and a fastener (14). The body has a leg (26) depending at an end thereof for engaging with a retention module (50), and a central pressing tab (24) for being received in a groove (76) defined in a heat sink (70). The body further has a joint portion (28) at another end thereof. Cutouts (33) are defined in the joint portion to form a pair of deformable protrusions (35) and a U-shaped head (36). A rib (38) is formed on the body for reinforcing the clip. The fastener has a retaining portion (42). The retaining portion includes a slot (44) for receiving the head, and an aperture (46) for engaging with an ear (64) formed on the retention module. The protrusions are deformed to secure the fastener to the body.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: June 26, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsieh Kun Lee, Zhi Sheng Lin
  • Patent number: 6243266
    Abstract: A locking device comprises a number of pegs and a bracket for securely locking a heat sink to CPU packages of a range of thicknesses. The pegs each have a cap for securing against a heat sink and a neck adapted for engaging with a slot of the bracket. The bracket fits against a bottom surface of the CPU package and includes a base and a number of essentially similar cantilever parts depending from the base. Each cantilever part forms a pair of locking recesses at different heights above the base, and a sustaining flange at distal ends of the locking recesses. Each sustaining flange forms an engaging surface which is coplanar with a mating surface of the base for pressing against the bottom surface of the CPU package. The slot extends between the locking recesses. During assembly, the neck slides along the slot and is secured in either locking recess of the bracket.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: June 5, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6243267
    Abstract: A PGA socket comprises a base, a cover slidably attached to the base, a lever and a slider. The lever is rotatablely coupled between the base and the cover to cammingly slide the cover and the slider relative to the base. A CPU having a plurality of terminals is inserted into the PGA socket. A heat sink is then attached to a top of the CPU. When the lever is rotated to a closed position, the cover slides to a closed position, electrically connecting the terminals of the CPU with the contacts in the socket. A pair of latch arms integral with the lever rotate from their open vertical position down between the fins of the heat sink to their closed horizontal position, and at the same time the cams of the lever actuate the slider to cammingly slide toward the heat sink thereby, effectively locking the heat sink into place.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: June 5, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Ching-An Chuang
  • Patent number: 6233150
    Abstract: A memory module assembly comprises a memory card having a circuit board and a number of electronic components mounted on the circuit board, a pair of shells attached on opposite surfaces of the circuit board and a pair of clips securing the card and the shells together. The circuit board forms a grounding pad around three edges thereof. Correspondingly, each shell has an electrically conductive area contacting the grounding pad of the circuit board for preventing electromagnetic interference. The circuit board forms a number of openings, and each shell have a number of projections and apertures corresponding to the openings of the circuit board. The shells are positioned on the card with the projections of one shell received in the openings of the circuit board and apertures of the other shell. The clips secure the card and the shells together.
    Type: Grant
    Filed: October 25, 1999
    Date of Patent: May 15, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Pao-Lung Lin, Nien-Tien Cheng, Eric Liu
  • Patent number: 6229705
    Abstract: A clip includes a plastic handle and a metal fastener. The handle is generally T-shaped with an operation section and a joint section extending downwards from the operation section. The joint section forms a pair of hems generally L-shaped and extending toward each other to define a receiving space therebetween. The metal fastener includes a body and first and second arms extending from opposite ends of the body. A pair of protrusions extends from each of opposite edges of the second arm for being interferentially received in the receiving space of the handle thereby securely retaining the handle to the fastener. Flanges extend from opposite edges of the body and are bent to overlap the body for reinforcing the body. Alternatively, a rib is formed on the body for the reinforcement purposes.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: May 8, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Hsieh Kun Lee
  • Patent number: 6185102
    Abstract: A heat transfer device comprises a heat conductive base, first and second cylindrical chambers defined in the heat conductive base and parallel to each other, a first heat conduction pipe fixed within the first cylindrical chamber, a second heat conduction pipe pivotally received in the second cylindrical chamber, and a sealing mechanism. One end of the first heat conduction pipe is secured within the first cylindrical chamber, while the other end thereof is attached to a heat-generating electrical element for absorbing heat produced by the electrical element and then transmitting the absorbed heat to the heat conductive base. One end of the second heat conduction pipe is pivotally mounted within the second cylindrical chamber, while the other end thereof is connected to a monitor panel of the Notebook computer for dissipating the heat transmitted by the heat conductive base to the exterior of the Notebook computer via the monitor panel.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: February 6, 2001
    Assignee: Foxconn Precision Components, Co., Ltd.
    Inventors: Yong Kung Shou, Feng-Yu Chiang
  • Patent number: 6169656
    Abstract: A fan duct for dissipating heat generated by a central processing unit of a computer is disclosed. The fan duct has a main body defining an air inlet and an air outlet. An electrical fan is mounted to the main body below the air outlet. A knob is attached to a top wall of the main body and located above the fan. An enclosure of the computer includes a back panel and a top cover. The top cover is attached with a hook. The fan duct is firstly assembled to the back panel by extending screws through the back panel to threadedly engage with the fan duct. The top cover is then mounted to the back panel to reach a finally assembled position in which the hook engages with the knob, whereby a portion of a weight of the fan is supported by the hook.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: January 2, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsien-Shen Pei, Eric Sun, Richard Lee
  • Patent number: 6163453
    Abstract: A fan duct induces an air flow generated by a fan of a lower supply of a computer to flow simultaneously through at least two heat-generating components of the computer. The fan dut is formed by plastic injection molding to have a cuboidal configuration, defining a first opening in alignment with the fan, a second opening proximate a first heat-generating component, and a third opening proximate a second heat-generating component when the fan duct is mounted in the computer at a predetermined position. When the fan is operated in a direction to draw air from the computer, an air flow is generated to simultaneously flow through the two heat-generating components and into the fan duct via the second and third openings. The heated air is then expelled out of the fan duct via the first opening to reach an exterior of the computer.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: December 19, 2000
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Kai-Shing Hou, Yung-Chou Chen, Richard Lee, Stanley Chen, Allen Tan, Jeff Luo
  • Patent number: 6145586
    Abstract: A heat sink module with a heat dissipating device comprises a heat sink, a clip, a fan with screws, a first attaching member, a pipe and a second attaching member. The first attaching member is used for attaching to an air opening of a computer enclosure. The first attaching member connects with the pipe and communicates with the air opening for transporting cool air therefrom. The second attaching member comprises a recessed base for attaching to the heat sink. The fan is received in the central portion of the recessed base, and is secured on the heat sink. Another end of the pipe communicates with the recessed base for transporting cool air from outside to cool the heat sink. Thus, heat dissipating efficiency is significantly improved.
    Type: Grant
    Filed: November 29, 1999
    Date of Patent: November 14, 2000
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei Ta Lo
  • Patent number: 6137681
    Abstract: A thermal module for dissipating heat generated by a component of a computer consists of a heat sink having a top face defining a cavity exposed to a front side of the heat sink and a bottom face defining a passage fixedly receiving an end portion of a heat pipe. The other end of the heat pipe thermally connects with the heat generating component. A number of round rods are integrally formed with the heat sink and extend into the cavity. A fan mounting plate is fixed to the heat sink and has a top face defining a recession for receiving a fan therein, an opening communicating with the recession and a conduit above the round rods and in communication with the fan via the opening. The conduit has a spiral portion and a rectangular outlet. When the fan is activated, an air flow is generated and flows into the conduit via the opening.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: October 24, 2000
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Hsin Lu
  • Patent number: 6122169
    Abstract: A heat sink assembly of the present invention comprises a conductive housing with a heat pipe and a fan fixed therein, and fixing devices. The conductive housing is formed by die-casting and comprises a base, a heat sink portion and a shielding portion which depend downwardly from the square base. The base defines a thorough channel to fix the heat pipe for dissipating heat produced by an electronic element mounted in the shielding portion, two legs of the channel being communication with the space formed by the shielding portion and the heat sink portion respectively. The shielding portion is integral with the heat sink portion and defines a peripheral side wall to form a sealed square-shaped space together with the base to provide EMI shielding for the electronic element. A hole is defined in each of the four corners of the peripheral side wall of the shielding portion to engage with the fixing devices.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: September 19, 2000
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Eric Liu, Pao Lung Lin, Chun-Hsin Lu
  • Patent number: 6118661
    Abstract: A clip is configured for retaining a heat sink on a chip and socket combination. The clip includes an arcuate pressing portion, first and second engaging arms downwardly extending from opposite ends of the arcuate pressing portion, and a driving arm generally upwardly extending from a lower end of the second engaging arm. The clip engages with the socket by openings in the first and second engaging arms receiving projections on opposite edges of the socket. The arcuate pressing portion downwardly presses the heat sink toward the chip. The second engaging arm defines a slit above the hole thereof to reduce the rigidity thereof and the driving arm forms a rib to increase the rigidity thereof, thereby the driving arm having a greater rigidity than the second engaging arm. The driving arm is downwardly and outwardly movable to disengage the second engaging arm from the socket.
    Type: Grant
    Filed: October 19, 1999
    Date of Patent: September 12, 2000
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo