Patents Assigned to Foxconn Precision Components Co., Ltd.
  • Patent number: 6360812
    Abstract: A heat dissipating assembly (10) includes a heat sink (12), a pair of clips (14), and a pair of holders (16). The heat sink includes a chassis (20) defining a pair of slots (24) spaced from each other and a plurality of fins (22) extending from the chassis between the slots. Each clip includes a central horizontal portion (42), two pressing bodies (40) extending from respective sides of the horizontal portion, and two legs (44) extending from respective distal ends of the pressing bodies. Each leg defines an aperture (46). Each holder has a tab (62) and a U-shaped hook (64) depending perpendicularly from respective opposite ends thereof. Each hook is elastically deformable to be engagingly received in the slot of the chassis. The horizontal portion of each clip is located between the tab and the hook of the holder, whereby the clip is attached to the heat sink by the holder.
    Type: Grant
    Filed: September 12, 2000
    Date of Patent: March 26, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6362963
    Abstract: A heat sink clip (4) includes a fastener (42) and a handle (44). The fastener includes a body (46) and first and second arms (54, 56) extending downward from opposite ends of the body. The first and second arms each define an aperture (58) for engaging with a corresponding tab (2) formed on an electronic device retention module (10). A pressing portion (64) is stamped adjacent a horizontal portion (48) of the body. The pressing portion is engagingly received in a slot (26) defined in a heat sink (20), and presses the heat sink against an electronic device (80) positioned in a socket connector adjacent the retention module. The handle has an operation section (72) and a joint section (74) extending downward from the operation section. The joint section forms a pair of vertical hems (76) at respective opposite sides thereof which extend toward each other to define a space (78). The space interferentially receives protrusions (62) formed on the second arm, whereby the handle is attached to the fastener.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: March 26, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Dongyun Lee, Hsieh Kun Lee
  • Patent number: 6341644
    Abstract: A heat sink assembly includes a fan, a heat sink, and a fixing device which attaches the fan to the heat sink. The heat sink has a plurality of fins. Four catches are respectively formed on four outermost fins, two on each of two longitudinal sides of the base. The fixing device has a base and four legs depending from respective corners of the base. A pair of protrusions depends from the base near respective lateral sides of the base. Four poles extend upwardly from the base near respective corners of the base. Each leg defines an aperture for engaging with the corresponding catch of the heat sink. The fan defines four through holes for respectively receiving the poles of the fixing device.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Wei-Ta Lo, Chung-Yung Sun
  • Patent number: 6343015
    Abstract: A heat sink clip (10) includes a body (12), and first and second arms (13, 19) depending from opposite ends of the body. The body includes a curved portion (11), first and second spring portions (15, 17) extending from opposite ends of the curved portion, and a connecting portion (16) between the second spring portion and the second arm. Each arm defines aperture (14). A fin (24) with a hole (25) defined therein is stamped outwardly from the second arm above the aperture, for engaging with a tool. Two flanges (27) extend upwardly from respective opposite longitudinal edges of the curved portion, thereby reinforcing the curved portion. Two longitudinal ribs (29) are formed at respective opposite sides of the curved portion, thereby reinforcing the body.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Aimin Huang, Carey Lai
  • Patent number: 6343020
    Abstract: A memory module includes a circuit board on which memory chips are mounted and a metal casing attached to the circuit board for shielding the memory chips. Conductive traces are formed on the circuit board for electrically engaging corresponding portions of the casing to ground the casing. The casing forms a raised portion defining a space for accommodating the memory chips. A recess is formed on the raised portion and a bottom surface of the recess contacts the memory chips to conduct and remove heat from the memory chips. Ventilation holes are defined in the raised portion for facilitating heat removal. The casing forms two positioning pins inserted into corresponding positioning holes defined in the circuit board for properly positioning the casing with respect to the circuit board. The casing also forms two latching arms engaging with corresponding latching holes defined in the circuit board for securing the casing to the circuit board.
    Type: Grant
    Filed: July 19, 1999
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Pao-Lung Lin, Nien-Tien Cheng, Heng-Chih Liu
  • Patent number: 6343013
    Abstract: A heat sink assembly includes a heat sink (30), a fan (50), and a fixing device (10). The fixing device includes an engaging portion (12) for pressing the heat sink onto a CPU (40), and a fixing portion (14) for securing the fan to the heat sink. The engaging portion has a pressing section (122) and two spring sections (124) received in a slot (36) of the heat sink, and two legs (126). An aperture (130) is defined in each leg, for engaging with a corresponding catch (22) of a socket (20). The fixing portion has a frame (142), and four clamps (144) at four corners of the frame. Each clamp has a slit (148), and a pair of barbs (150) at a distal end of the clamp. Two integrating flanges (149) depend from opposite sides of the frame, each integrating flange integrally connecting with a corresponding leg.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: January 29, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Chun-Chi Chen
  • Patent number: 6341065
    Abstract: A heat sink clip (10) includes a body (12) and a fastener (14). The body includes a spring portion (20) positioned above a heat sink, and two legs (28) extending from opposite ends of the spring portion. Each leg defines an aperture (30) for engaging a catch of a retention module mounted beside an electronic device. The spring portion has a horizontal section (26) which forms a spring tongue (21). A pair of L-shaped guiding tabs (22) is formed under and spaced from the horizontal section, with a space defined between the horizontal section and the guiding tabs. A gap (24) is formed between the guiding tabs. The fastener includes an operation portion (40), and a connecting portion (42) for insertion in the space between the horizontal section and the guiding tabs. The connecting portion defines a slot (43) for engagement with the spring tongue of the body. A spring tab (46) is formed under the connecting portion.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: January 22, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Wei-Ta Lo
  • Patent number: 6339533
    Abstract: A heat dissipating assembly (30) includes a heat sink (50), a pair of clips (40) and a pair of retention modules (60). The heat sink includes a chassis defining a pair of slots (56) near respective opposite ends thereof. Each retention module forms a pair of catches (62) at respective opposite ends thereof. Each clip includes a central pressing portion (41), a pair of spring sections (42), and a pair of legs (44). A wing (412) depends from an edge of the pressing portion, for engaging with an outer wall of the corresponding retention module. A tab (414) depends from the pressing portion 41 opposite the wing, to be received in the corresponding slot. Each leg defines an opening (48) for insertion of a tool therethrough, and a hole (46) adapted to receive the catch of the corresponding retention module. Thus the heat sink is securely attached to an electronic device (80).
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: January 15, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsieh Kun Lee, ZhiSheng Lin
  • Patent number: 6333850
    Abstract: A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element comprises a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure near the opening. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: December 25, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsien-Shen Pei, Chung-Yung Sun, Chao-Yang Lee
  • Patent number: 6330905
    Abstract: A heat sink assembly includes a heat sink (60), a fan (20) and a fixing device (70). The heat sink has a plurality of fins (64). The outermost fins define catches (66). The fixing device includes an upper portion (10) and a lower portion (30). The upper and lower portions respectively define upper and lower openings (14, 36) providing air flow access for the fan. A pole (18) depends from each comer of the upper portion. The fan has first through holes (22) for extension of the poles therethrough. A pair of latches (38) extends upwardly from the lower portion, for engaging with the upper portion. The upper portion defines two cutouts (16) in communication with the upper opening, for receiving the latches. A side wall (50) depends from each of two opposite sides of the lower portion. Each side wall defines two recess (54) at respective opposite ends thereof. A barb (52) is formed at each opposite end of each side wall, for engaging with the corresponding catch of the heat sink.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: December 18, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Yeu-Lih Lin, Aimin Huang
  • Patent number: 6330908
    Abstract: A heat sink includes a base (20) and a number of fins (30). The base includes a bottom plate (21) to be positioned on and in contact with an electronic package, such as a central processing unit, and a column (22) extending from the bottom plate opposite the electronic package. The fins are attached to the column and radially extend therefrom. A gap is formed between the fins and the plate of the base for facilitating air flow through the heat sink. A curved surface (23) may be formed between the column and the base for guiding the air flow away from the fins.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: December 18, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsieh Kun Lee, Don-Yun Lee
  • Patent number: 6321451
    Abstract: A heat sink comprises a base plate and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet. A method for making a reliable heat sink includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate thereby integrating the connecting portions with the base plate, forming concave sections in the connecting portions and convex sections on an opposite lower surface of the base plate.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: November 27, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Shun-Jung Lee, Hsieh-Kun Lee
  • Patent number: 6320746
    Abstract: A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element includes a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: November 20, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Hsien-Shen Pei, Chung-Yung Sun, Chao-Yang Lee
  • Patent number: 6318451
    Abstract: A heat sink includes a base and a number of fins extending from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip of a flip chip processor thereby reducing damage to the flip chip during mounting the heat sink to the flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: November 20, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Chao-Yang Lee, Yeu-Lih Lin, Chao Kun Tseng
  • Patent number: 6318452
    Abstract: A clip includes a body (10) having a spring portion (12) and a leg (14) formed on a first end of the spring portion for engaging with a first side of a heat generating device, such as a central processing unit module. A fastener (20) has a spring plate (24) connected to a second end of the spring portion of the body and is engageable with an opposite second side of the heat generating device for securing a heat sink to the heat generating device. A pair of connecting tabs (26) extends from the fastener above the body for pivotally retaining an actuating member (30) therebetween. The actuating member forms cams (34) engaging the spring portion of the body whereby, when the actuating member is manually operated, the camming engagement between the actuating member and the spring portion drives the fastener to engage the second side of the heat generating device.
    Type: Grant
    Filed: July 10, 2000
    Date of Patent: November 20, 2001
    Assignee: Foxconn Precision - Components Co., Ltd.
    Inventor: DongYun Lee
  • Patent number: 6317323
    Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed by a pressing means between the fins in the base plate for receiving the latching member. A pair of positioning pins depend downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU.
    Type: Grant
    Filed: December 29, 1999
    Date of Patent: November 13, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Chao-Yang Lee, Chao Kun Tseng, Chung-Tung Sun, Wei-Ta Lo
  • Patent number: 6315032
    Abstract: A heat sink includes a base plate and a plurality of heat dissipating fins upwardly extending from the base plate. Each fin includes a heat dissipating portion and a connecting portion integrated with the base plate by punching whereby concave sections are left in the connecting portion. The fins can be formed in various shapes by shearing and bending or by bending a metal sheet. A method for making a reliable heat sink includes a preparing step, a punching step and a flattening step. The preparing step comprises manufacturing a base plate and a plurality of fins each including a connecting portion and a heat dissipating portion. The punching step comprises punching the connecting portions of the fins against the base plate thereby integrating the connecting portions with the base plate, forming concave sections in the connecting portions and convex sections on an opposite lower surface of the base plate.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: November 13, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Shun-Jung Lee, Hsieh-Kun Lee
  • Patent number: 6311766
    Abstract: A heat sink assembly includes a heat sink (50), a fan (10), and a fixing device (30). The heat sink has a chassis (56) which defines a pair of diagonally opposite grooves (58) in respective opposite side walls thereof. The fan defines a vertical through hole (12) at each comer. The fixing device has a rectangular base (35). A pole (32) having a barb (36) extends upwardly from each comer of the base, for engaging with the corresponding through hole. A pair of legs (40) depends from each side of the base. A catch (42) is formed at a distal end of each leg, for engaging with the heat sink. Two guard boards (46) depend from each side of the base. A pair of bosses (48) is formed at distal ends of two diagonally opposite guard boards, for engaging with the grooves of the heat sink.
    Type: Grant
    Filed: December 26, 2000
    Date of Patent: November 6, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Mark Lin, Carey Lai, Hans Wan
  • Patent number: 6310774
    Abstract: A heat sink clip (50) includes a body (20) and an R-shaped handle (40). The body includes a central pressing portion (29), and first and second spring portions (21, 24) extending from opposite ends of the pressing portion. First and second legs (22, 27) depend from free ends of the first and second spring portions respectively. A catch (25) is stamped upwardly from the second spring portion, and then bent toward the pressing portion. A bent tab (31) is stamped outwardly from the second leg and then bent downwardly. The handle includes first and second connecting portions (41, 42), and anactuating portion (43) between the first and second portions. First and second fixing holes (44, 45) are respectively defined near the free ends of the first and second portions, and respectively engage with the catch and bent tab of the body.
    Type: Grant
    Filed: October 23, 2000
    Date of Patent: October 30, 2001
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventor: Hsieh Kun Lee
  • Patent number: D453744
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: February 19, 2002
    Assignee: Foxconn Precision Components Co., Ltd.
    Inventors: Cheng-Chi Lee, Xue Jin Fu, Xiang Bo Liu