Abstract: In various embodiments, apparatuses for receiving and supporting one or more components during processing thereof at process temperatures greater than approximately 1000° C. feature refractory metal shelves separated by refractory metal support posts.
Type:
Grant
Filed:
February 17, 2016
Date of Patent:
July 2, 2019
Assignee:
H.C. STARCK INC.
Inventors:
Maria Bozena Winnicka, Scott Jeffrey Volchko, Stan Wojciechowski, Abhishek Bhattacharyya
Abstract: A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.
Abstract: In various embodiments, apparatuses for receiving and supporting one or more components during processing thereof at process temperatures greater than approximately 1000° C. feature refractory metal shelves separated by refractory metal support posts.
Type:
Grant
Filed:
February 17, 2016
Date of Patent:
February 26, 2019
Assignee:
H.C. STARCK INC.
Inventors:
Maria Bozena Winnicka, Scott Jeffrey Volchko, Stan Wojciechowski, Abhishek Bhattacharyya
Abstract: A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 ?m width (e.g., less than about 50 ?m width). A process for making the target includes hot isostatically pressing, below a temperature of 1080° C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing.
Abstract: In various embodiments, etchants featuring (i) mixtures of hydrochloric acid, methanesulfonic acid, and nitric acid, or (ii) mixtures of phosphoric acid, methanesulfonic acid, and nitric acid, are utilized to etch metallic bilayers while minimizing resulting etch discontinuities between the layers of the bilayer.
Type:
Grant
Filed:
August 29, 2016
Date of Patent:
January 22, 2019
Assignees:
H.C. STARCK INC., DAETEC, LLC
Inventors:
Patrick Hogan, John Moore, Alex Brewer, Jared Pettit
Abstract: In various embodiments, a microreactor features a corrosion-resistant microchannel network encased within a thermally conductive matrix material that may define therewithin one or more hollow heat-exchange conduits.
Type:
Grant
Filed:
November 10, 2015
Date of Patent:
October 23, 2018
Assignee:
H.C. STARCK INC.
Inventors:
Paul R. Aimone, Marc Abouaf, Patrick Hogan
Abstract: In various embodiments, a precursor powder is pressed into an intermediate volume and chemically reduced, via sintering, to form a metallic shaped article.
Abstract: In various embodiments, three-dimensional layered metallic parts are substantially free of gaps between successive layers, are substantially free of cracks, and have densities no less than 97% of the theoretical density of the metallic material.
Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.
Type:
Grant
Filed:
July 8, 2016
Date of Patent:
August 14, 2018
Assignee:
H.C. STARCK INC.
Inventors:
Paul Aimone, Francois-Charles Dary, David B. Smathers
Abstract: A method for making a sputtering target including steps of encapsulating and hot isostatically pressing at least one mass of metal powder (e.g., tantalum), having a particle size ranging from about 10 to about 1000 ?m, with at least about 10 percent by weight of particles having a particle size greater than about 150 ?m (for example, about 29 to about 56 percent (e.g., about 35 to about 47 percent) by weight of the particles in the at least one mass of metal powder having a particle size that is larger than 150 microns, but below about 250 ?m), for defining at least a portion of a sputtering target body, having an essentially theoretical random and substantially uniform crystallographic texture.
Type:
Grant
Filed:
April 8, 2015
Date of Patent:
July 17, 2018
Assignee:
H.C. STARCK INC.
Inventors:
Patrick Hogan, Paul Aimone, Joseph Flanigan, Marcel Hagymasi, Helmut Haas
Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.
Abstract: In various embodiments, eroded sputtering targets are partially refurbished by spray-depositing particles of target material to at least partially fill certain regions (e.g., regions of deepest erosion) without spray-deposition within other eroded regions (e.g., regions of less erosion). The partially refurbished sputtering targets may be sputtered after the partial refurbishment without substantive changes in sputtering properties (e.g., sputtering rate) and/or properties of the sputtered films.
Abstract: A tantalum or tantalum alloy which contains pure or substantially pure tantalum and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a tantalum alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the tantalum alloy.
Abstract: The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of niobium or vanadium, and a third metal element selected from the group consisting of titanium, chromium, niobium, vanadium, and tantalum, wherein the third metal element is different from the second metal element, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in the second metal element, and a phase that is rich in the third metal element.
Type:
Grant
Filed:
March 26, 2015
Date of Patent:
April 17, 2018
Assignee:
H.C. STARCK, INC.
Inventors:
Gary Alan Rozak, Mark E. Gaydos, Patrick Alan Hogan, Shuwei Sun
Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
Type:
Grant
Filed:
June 5, 2014
Date of Patent:
March 27, 2018
Assignee:
H.C. STARCK INC.
Inventors:
Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
Abstract: In various embodiments, sputtering targets are formed by introducing molybdenum powder into a sheet bar mold, pressing the powder to form a sheet bar, sintering the sheet bar to form an ingot having a density of at least 90% of a theoretical density, preheating the ingot, rolling the ingot to form a plate, and heat treating the plate.
Type:
Grant
Filed:
March 4, 2016
Date of Patent:
March 27, 2018
Assignee:
H.C. STARCK INC.
Inventors:
Brad Lemon, Joseph Hirt, Timothy Welling, James G. Daily, III, David Meendering, Gary Rozak, Jerome O'Grady, Prabhat Kumar, Steven A. Miller, Rong-chein Richard Wu, David G. Schwartz
Abstract: A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 ?m width (e.g., less than about 50 ?m width). A process for making the target includes hot isostatically pressing, below a temperature of 1080° C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing.
Abstract: The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.
Type:
Grant
Filed:
July 30, 2015
Date of Patent:
December 5, 2017
Assignee:
H.C. STARCK INC.
Inventors:
Gary Alan Rozak, Mark E. Gaydos, Patrick Alan Hogan, Shuwei Sun
Abstract: In various embodiments, a metal alloy resistant to aqueous corrosion consists essentially of or consists of niobium with additions of tungsten, molybdenum, and one or both of ruthenium and palladium.
Abstract: In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films.
Type:
Grant
Filed:
September 10, 2014
Date of Patent:
October 10, 2017
Assignees:
H.C. Starck Inc., H.C. Starck GmbH
Inventors:
Steven A. Miller, Prabhat Kumar, Richard Wu, Shuwei Sun, Stefan Zimmermann, Olaf Schmidt-Park