Abstract: The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.

Abstract: An arrayed antenna module includes a first antenna group, a second antenna group, a front conductive connecting assembly and a rear conductive connecting assembly. The first antenna group includes a plurality of first antenna structures arranged in parallel thereon. The second antenna group includes a plurality of second antenna structures arranged in parallel thereon. The front conductive connecting assembly includes a first front conductive connecting element electrically connected to the first antenna group, and a second front conductive connecting element electrically connected to the second antenna group. The rear conductive connecting assembly includes a first rear conductive connecting element electrically connected to the first antenna group, and a second rear conductive connecting element electrically connected to the second antenna group. Therefore, the arrayed antenna module provided can be applied to a portable electronic device so as to receive or transmit signals.

Abstract: The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second die pad, the first die pad coupled to a first portion of a metal layer, the second die pad coupled to a second portion of the metal layer, and the first portion of the metal layer and the second portion of the metal layer spaced apart by a second insulating layer. An associated semiconductor packaging method and another semiconductor package structure are also disclosed.

Abstract: A co-construction antenna module includes a carrier, a first patch antenna group, a second patch antenna group, a first dipole antenna group, and a second dipole antenna group. The carrier includes a first surface, a second surface relative to the first surface, and a surround surrounding side connected between the first surface and the second surface. The first patch antenna group includes a plurality of first patch antennas disposed on the carrier, and the plurality of first patch antennas are disposed on at least one of the first surface and the second surface. The second patch antenna group includes a plurality of second patch antennas disposed on the carrier, and the plurality of second patch antennas are disposed on at least one of the first surface and the second surface. The first dipole antenna group and the second antenna are disposed in the carrier.

Abstract: The present invention provides a portable electronic device and a stacked antenna module thereof. The stacked antenna module includes a first antenna structure and a second antenna structure stacked on the first antenna structure and insulated from the first antenna structure. The first antenna structure includes a first carrier substrate having at least one through hole, a surrounding insulation layer disposed inside the at least one through hole, and a first feeding pin passing through the first carrier substrate. The second antenna structure includes a second carrier substrate and a second feeding pin passing through the second carrier substrate, and the second feeding pin passes through the surrounding insulation layer without contacting the surrounding insulation layer.

Abstract: The present disclosure provides a method for preparing a semiconductor package having a standard size from a die having a size smaller than the standard size. The method includes: providing a wafer; forming a die on the wafer, wherein the die has a size smaller than one-half of a standard size 0201; dicing the die from the wafer; encapsulating the die to form an encapsulated die; and singulating the encapsulated die to form a semiconductor package having a size equal to or larger than the standard size 0201.

Abstract: The present disclosure provides a back cover assembly of a portable electronic device. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

Abstract: The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.

Abstract: An antenna structure includes a board unit and a coil unit. The board unit includes a metal board and an insulating board connected with or adjacent to the metal board, and the coil unit is disposed beside the same side of the metal board and the insulating board. In one embodiment, when one narrow side of the metal board and one narrow side of the insulating board connects with each other, the coil unit is disposed right under the commissure of the metal board and the insulating board. In addition, more than half or half of the area of the coil unit is covered by the insulating board, and less than half or half of the area of the coil unit is covered by the metal board. The current direction on the metal board and the current direction on the coil unit are the same as clockwise or counterclockwise.

Abstract: An antenna structure includes a radiation module and a metal board. The radiation module has a first coil unit and a second coil unit. The first coil unit is coupled to the second coil unit. The first coil unit and the second coil unit have opposite direction of current. The metal board is disposed at one side of the radiation module. The metal board has an enclosed slot which has a first slot portion and a second slot portion.

Abstract: A method of manufacturing common mode filter having heterogeneous laminates, the method includes steps of providing a nonmagnetic insulating substrate; forming a magnetic layer; forming a first lead; forming a first insulating layer; forming a first through hole; forming a first coil; forming a second insulating layer; forming a second coil; forming a third insulating layer; forming a second through hole; forming a second lead; forming a fourth insulating layer; and depositing a first magnetic material.

Abstract: A common mode filter with a multi-spiral layer structure includes a first coil, a first insulating layer, a second coil, a second insulating layer, a third coil, a third insulating layer, and a fourth coil, wherein the first coil serially connects with the fourth coil, and the second coil serially connects with the third coil. A first conductive pillar is configured to connect the first coil and the fourth coil, and a second conductive pillar is configured to connect the second coil and the third coil, wherein the first conductive pillar and the second conductive pillar are internally diagonally disposed relatively within a corner or the same side of corners of the rectangular spiral.

Abstract: A SMD transformer structure includes a substrate unit, a magnetic unit, a coil unit and a shielding unit. The substrate unit includes a support substrate. The magnetic unit includes at least one magnetic material core bar disposed on the support substrate. The coil unit includes at least one transformer coil assembly wound around the magnetic material core bar. The transformer coil assembly includes a plurality of transformer coils wound around the magnetic material core bar, and each transformer coil has two opposite end portions respectively and electrically connected to the corresponding first electrode and the corresponding second electrode of the substrate unit. The shielding unit includes at least one magnetic shielding board disposed on the magnetic material core bar. Whereby, the SMD transformer structure not only can be simplified to reduce its size, but also can be automatically manufactured to increase its production efficiency and product yield (reliability).

Abstract: A wide-band common mode filtering apparatus includes at least two cascaded common mode filters with different noise-filtering responses, wherein the cut-off frequency of the wide-band common mode filtering apparatus is at the lowest cut-off frequency of the common mode filters, and the noise-filtering response of the wide-band common mode filtering apparatus is the superposition of the noise-filtering responses of the common mode filters. In one embodiment of the present invention, the wide-band common mode filtering apparatus includes a first common mode filter having a first filtering band, and a second common mode filter having a second filtering band different from the first filtering band. The disclosure of the present technique allows the cascaded common mode filters with different filtering bands to form the wide-band common mode filtering apparatus having an overall filtering band to meeting a new demand.

Abstract: An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern.

Abstract: A SMD transformer structure includes a substrate unit, a magnetic unit, a coil unit and a shielding unit. The substrate unit includes a support substrate. The magnetic unit includes at least one magnetic material core bar disposed on the support substrate. The coil unit includes at least one transformer coil assembly wound around the magnetic material core bar. The transformer coil assembly includes a plurality of transformer coils wound around the magnetic material core bar, and each transformer coil has two opposite end portions respectively and electrically connected to the corresponding first electrode and the corresponding second electrode of the substrate unit. The shielding unit includes at least one magnetic shielding board disposed on the magnetic material core bar. Whereby, the SMD transformer structure not only can be simplified to reduce its size, but also can be automatically manufactured to increase its production efficiency and product yield (reliability).

Abstract: A portable electronic device includes a casing unit, a first support unit, a second support unit, a first antenna unit, a second antenna unit, a first conducting unit and a second conducting unit. The casing unit includes a first outer casing and a second outer casing pivotally connected with the first outer casing. The first outer casing includes a hinge structure pivotally connected with the second outer casing. The first support unit includes a first support body disposed in the hinge structure, and the second support unit includes a second support body disposed in the hinge structure. The first antenna unit includes a first antenna structure disposed on the first support body and separated from the second outer casing. The second antenna unit includes a second antenna structure disposed on the second support body and separated from the second outer casing.

Abstract: An antenna structure includes a radiation module and a metal board. The radiation module has a first coil unit and a second coil unit. The first coil unit is coupled to the second coil unit. The first coil unit and the second coil unit have opposite direction of current. The metal board is disposed at one side of the radiation module. The metal board has an enclosed slot which has a first slot portion and a second slot portion.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.