Abstract: A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.

Abstract: A broadband antenna includes a substrate, a ground plane, a radiating path, a shorting path, a first connection path, a second connection path and a coupling path. The ground plane has a shorting point, a first grounding point and a second grounding point. The radiating path has a feeding point and a first connecting point. Two ends of the shorting path are respectively electrically connected with the shorting point and the feeding point, and the shorting path has a second connecting point. Two ends of the first connection path are respectively connected with the first connecting point and the second connecting point. Two ends of the second connection path are respectively connected with the first grounding point and the feeding point. One end of the coupling path is connected to the second grounding point and another end of the coupling path is separated from the shorting path.

Abstract: A composite antenna structure includes a dielectric main body, a covering layer and a metallic transmission line structure. The dielectric constant of the dielectric main body is ranged from 1 to 200. The covering layer is disposed on the dielectric main body and has a pattern area defined thereon. The metallic transmission line structure is formed on the pattern area of the covering layer.

Abstract: A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Abstract: A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.

Abstract: A loop antenna for communication is provided, which includes a microwave substrate, being a hexahedron; a first conductive layer, disposed on an upper surface of the substrate for forming a first loop; a second conductive layer, disposed on a first side surface of the substrate, and electrically connected to a feed-in point and a ground point; and a third conductive layer, disposed on a lower surface of the substrate for forming a second loop. The first conductive layer and the second conductive layer are electrically connected at the junction between the upper surface and the first side surface, and the second conductive layer and the third conductive layer are electrically connected at the junction between the first side surface and the lower surface. The antenna also has an appropriate bandwidth for wireless communication application.

Abstract: A thermally enhanced optical package includes a heat conducting module configured to dissipate the heat generated from an optical device, a plurality of insulating pads disposed on a heat conducting substrate, and at least one electrical conducting pad disposed on the insulating pads. The heat conducting module includes a heat conducting substrate and a plurality of heat conducting pillars, and the optical device is a light emitting diode chip or a light emitting diode die in the present embodiments. The thermally enhanced optical package is further characterized in a simple manufacturing procedure, including substantially an electrical or electroless plating process, a metal foil laminating process, a thick film printing process, and a patterning and etching process.

Abstract: A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils.

Abstract: A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.

Abstract: A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

Abstract: A common mode filter includes at least two inductance unit sets. Each inductance unit set includes a coil leading layer, an insulating substrate, at least two electrically conductive columns, and a coil main body layer. The coil leading layer is disposed on a first surface of the substrate, and includes at least two leading wires, at least four leading terminals, and at least two contacts. Each leading wire respectively connects one leading terminal and one contact. The coil main body layer is disposed on a second surface of the substrate, and includes a coil lead and two end portions thereof. Each electrically conductive column extends through the substrate, connecting one contact and one end portion. The two substrates and two coil main body layers of the at least two inductance unit sets are bonded by an electrically insulating layer. The two coil main body layers are electrically isolated from each other by the electrically insulating layer.

Abstract: A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.

Abstract: An aluminum electrolytic capacitor includes an aluminum foil substrate, a porous aluminum layer, an insulating layer, an electrically conductive polymer material, an electrically conductive material, and at least two terminal electrodes. The porous aluminum layer is attached to the aluminum foil substrate. The insulating layer is formed on the porous aluminum layer. The electrically conductive polymer material overlays the insulating layer. The terminal electrodes respectively connect to the aluminum foil and the electrically conductive material.

Abstract: A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

Abstract: A common mode filter includes at least two inductance unit sets. Each inductance unit set includes a coil leading layer, an insulating substrate, at least two electrically conductive columns, and a coil main body layer. The coil leading layer is disposed on a first surface of the substrate, and includes at least two leading wires, at least four leading terminals, and at least two contacts. Each leading wire respectively connects one leading terminal and one contact. The coil main body layer is disposed on a second surface of the substrate, and includes a coil lead and two end portions thereof. Each electrically conductive column extends through the substrate, connecting one contact and one end portion. The two substrates and two coil main body layers of the at least two inductance unit sets are bonded by an electrically insulating layer. The two coil main body layers are electrically isolated from each other by the electrically insulating layer.

Abstract: A manufacturing method of a single chip semiconductor coating structure includes following steps. Step 1 is providing a single chip semiconductor which has a plurality of surfaces, and two opposite surfaces selected from the plurality of surfaces are manufacturing surfaces and have a conductive area with a pad thereon, respectively. Step 2 is providing a tool to cover one of the conductive areas with the pad. Step 3 is providing a coating step to form an insulating layer on the single chip semiconductor. Step 4 is providing a removing step to remove the insulating layer for exposing the covered conductive area and the pad. Step 5 is forming two electrodes and each of the two electrodes covers the conductive area with the pad.

Abstract: An over-current protection device comprises a PTC material layer, a first electrode layer, a second electrode layer, a first side electrode and a second side electrode. The PTC material layer is sandwiched between the first electrode layer and the second electrode layer. The first side electrode and the second side electrode are respectively disposed on two opposite side surfaces of the PTC material layer, and are respectively connected to the first electrode layer and the second electrode layer. Furthermore, the first side electrode and the second side electrode are respectively extended to four surfaces adjacent and perpendicular to the two side surfaces.

Abstract: A circular polarization antenna structure with a dual-layer ceramic includes a first hard dielectric body, a first metal layer, a grounding layer, an antenna feed pin, a second hard dielectric body, a second metal layer and an adhesive element. The first metal layer and the grounding layer dispose on a top surface and a bottom surface of the first hard dielectric body. The antenna feed pin passes through the through hole of the first hard dielectric body, the top side of the antenna feed pin is fixed on the top surface of the first hard dielectric body, and the bottom side of the antenna feed pin extends outwards from the bottom surface of the first hard dielectric body. The second hard dielectric body disposes above the top side of the first hard dielectric body. The second metal layer disposes on the top surface of the second hard dielectric body.

Abstract: A thin type common mode filter includes an insulating flexible substrate, a first magnetic material layer, a first coil leading layer, a coil main body multi-layer, a second coil leading layer, and a second magnetic material layer. The first coil leading layer is formed on a first surface of the flexible substrate, and the first coil leading layer is formed on a second surface of the flexible substrate opposite to the first surface. The coil main body multi-layer, the second coil leading layer, and the second magnetic material layer are sequentially stacked on the first coil leading layer.