Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

Abstract: The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

Abstract: A frequency adjustable antenna apparatus and a manufacturing method thereof are disclosed. The antenna apparatus includes a plurality of antenna paths and the length of the antenna path is changed via the soldering pads. Therefore, the receiving frequency of the antenna can be changed. The frequency adjustable antenna apparatus includes a body, a first path, at least one second path and a printed circuit board. The first path is located on an upper surface of the body and extends to a lower surface. The second path is located on the lower surface. The printed circuit board includes at least one soldering pad. When the lower surface of the body is pasted on the printed circuit board, the first path is connected with the second path via the soldering pads. Thereby, the length of the first path is changed to adjust the frequency of the antenna apparatus.

Abstract: The present invention is an electrostatic discharge protection device having a low trigger voltage. The device can utilize a process of manufacturing a PCB to minimize costs and manufacturing time. The device comprises: a discharge area, which is essentially a space within the device and can be filled by a material having a desired breakdown voltage, and at least two electrode areas, wherein the two electrode areas are substantially electrically isolated from each other and simultaneously adjacent to or within the discharge area. When an electric potential difference between the electrode areas exceeds a predetermined value, a conductive path between the electrode areas will be created by discharging through the discharge area. The device is characterized in that each of the two electrodes is a part of a conductive plate, and the two conductive plates become a part of the device by pressing or adhering so that a gap for electric isolation exists between the two electrode areas.

Abstract: An antenna apparatus includes a hollow column, a conductive cable, a first metal wire, a column structure, and a second metal wire. The conductive cable is received in the hollow column, and the conductive cable electrically contacts the hollow column via a second conductive wire layer thereof. One side of the first metal wire is electrically connected with a first conductive wire layer of the conductive cable. The column structure has a column body, a metal layer formed on the column body, at least one spiral groove formed on the metal layer for exposing a part of the column body, and two conductive covers respectively disposed on two sides of the column body. Moreover, one of the two conductive covers is electrically connected with the other side of the first metal wire. Furthermore, one side of the second metal wire is electrically connected with the other conductive cover.

Abstract: The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.

Abstract: A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a spiral metal layer on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna apparatus includes a column body, a metal layer and a spiral structure. The metal layer is formed on the surface of the column body, and the spiral structure is formed on the metal layer. The spiral structure is implemented by removing part of the metal layer to form a pitch structure. The column body is exposed between the pitches. The column antenna apparatus can be applied to a single, dual, three or multi frequencies wireless communication device. Furthermore, the column antenna apparatus can be installed at outside of the wireless communication device to be an external antenna or at inside of the wireless communication device to be a built-in antenna.

Abstract: A temperature controlling protective device is made of a PPTC material, comprising: a body having two ends, a top surface and a bottom surface, and two ends of the body. Two electrodes made of silver gel respectively cover the two ends of the body. Two protective layers respectively cover the top surface and the bottom surface. The protective device may prevent electronic circuits from damage due to over heating.

Abstract: A flexible antenna apparatus and a manufacturing method thereof are provided for wireless communication devices. The flexible antenna has a metal layer with an adhesive layer pasted onto the back surface of the metal layer, so that it can be directly pasted onto the housing of the wireless communication device. On another side of the metal layer, there is a transparent protective layer and the metal layer reserves a zone without the transparent protective layer for electrically coupling to the electrical substrate of the wireless communication device. The present flexible antenna apparatus reduces the developing time and cost of the device and the manufacturing process more convenient. The flexible antenna apparatus is suitable for all wireless communication devices and increases the flexibility of the manufacturing process by adding a holder having at least one plastic pin, or a pin.

Abstract: The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install protection devices at respective I/O ports on a printed circuit board to prevent the IC devices from damage by surge pulses. Therefore, the costs to design circuits are reduced, the limited space is efficiently utilized, and unit costs to install respective protection devices are lowered down.

Abstract: An antenna module has a PCB with a plurality of contacts, a support element, and an antenna module. The support element has a support portion extended downwardly therefrom. The antenna module is connected with the support element. The antenna structure has a metal support element fixed on the PCB with a plurality of contacts. The support element is used to support an antenna module for electrically connecting the antenna module on the PCB with the contacts. When the antenna module connects to the PCB, the antenna contact does not project out the bottom side of the PCB. Therefore, the bottom side of the PCB is level. The antenna structure has a metal support used to shield the noise interference between the antenna module and the PCB.

Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.

Abstract: An insulated structure of a chip array component and fabrication method of the same, the element is fabricated by enclosing its main body with a dense layer of high surface insulation resistance material, and then exposing the portions of the main body where terminal electrodes are to be formed by removing the dense layer of high surface insulation resistance material by employing sand blasting, laser trimming, grinding, or etching process.

Abstract: The present invention is directed to a structure of a surface mounted resettable over-current protection device and a method for manufacturing the same. First, a raw material substrate having two ends is provided. On each of the two ends of the raw material substrate, a patterned conducting metal foil is formed. Then, the raw material substrate is cut to form a grid-shaped substrate having a plurality of strip-shaped structural parts. An insulating layer is formed to enclose the whole grid-shaped substrate, allowing parts of the patterned metal foil layers on the ends of the strip-shaped structural parts to be exposed. Next, the strip-shaped structural parts of the grid-shaped substrate are cut into a plurality of chips, each chip having two cut sections. Finally, two terminal electrodes are formed on the both cut sections of each chip.

Abstract: An integrated active satellite antenna module has a low loss filter, a low noise amplifier, a switch, a chip, two input ends and an output end. A front-end microwave circuit is used for resolving the mutual coupling effect between the satellite antenna and the other antennas operating at any other frequencies in an integrated active satellite antenna module, and furthermore it provides the simultaneous operating condition for the individual antenna by improving the isolation level between the satellite frequency band and the other frequency band.

Abstract: The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install protection devices at respective I/O ports on a printed circuit board to prevent the IC devices from damage by surge pulses. Therefore, the costs to design circuits are reduced, the limited space is efficiently utilized, and unit costs to install respective protection devices are lowered down.

Abstract: The present invention discloses a laminated chip electronic device and a method of manufacturing the same. In the laminated chip electronic device and the method of manufacturing the same according to the present invention, a body is made of a non-linear resistance coefficient material and has a plurality of conductive layers formed therein; an insulating layer is formed on the top, bottom, front and back surfaces of the body; and two electrodes are formed at the two ends of the body and electrically connected to the terminals of the conductive layers, respectively. Furthermore, in the present invention, two soldered interface layers are formed on the two electrodes, respectively.

Abstract: A GPS receiving antenna for cellular phone is configurated into a L-shaped frame, a Y-shaped frame, or a U-shaped frame so as to achieve the best capturing effect of the radio wave radiated from the satellite. It is not necessary to use materials of specially high dielectric constant for fabrication of these antennas so that the production cost can be minimized and fabrication process can be simplified (FIG. 2).

Abstract: The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.