Abstract: There is described a disk processing and manufacturing equipment in which the processing chambers are stacked on top of each other and in which the disks move through the system on disk carriers which are adjustable to take disks of varying sizes. The disks enter the system through a load zone and are then installed into disk carriers. They move in the carriers sequentially through processing chambers at one level and then move to the other level in a lift or elevator. At this other level, the disks again move sequentially through the system on that level and then exit at an unload zone.

Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of the housing where the leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.

Abstract: Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.

Abstract: Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.

Abstract: This invention deals with the reduction in fixed pattern noise in backthinned CMOS imagers primarily for use in a vacuum environment. Reduction is achieved by effectively shielding the imager. This is done by depositing a conductive layer on the front surface prior to the attachment of a support member or by incorporating a conductive layer into the die at least extensive with the analog circuitry. This also may be achieved by leaving a void adjacent to the analog circuitry area. This void, filled with air or a vacuum specifies a low dielectric layer over critical analog circuitry. Finally there is extended across the die an adhesive or underfill material after which a support member is placed onto the underfill to provide structure to the die. The underfill and the support layer should have thermal coefficients of expansion that substantially match that of the silicon.

Abstract: A low light level image directed to a photocathode in a vacuum causes release of electron which bombard a CMOS imager including passive pixel sensors which in turn generates an electronic image which is fed out of the vacuum and is used to create useful images corresponding to the low level input image. A camera and other low light imaging devices are described.

Abstract: Sequential sputtered film deposition of distinct materials on a workpiece is obtained with discrete targets composed of such distinct materials disposed on separate area portions of a common cathode/heatsink. Sputtering without cross contamination of the deposited films is enabled during an interval of relative motion between the target and workpiece or in an indexed static relative disposition, wherein the workpiece projection is entirely proximate one such portion to deposit the respective layer.

Abstract: A substrate processing system includes a primary processing assembly and secondary processing assembly. The secondary processing assembly has one or more interconnected modules and includes one or more process stations. The primary and secondary processing assemblies are connected by a vacuum conveyor, so that the substrates remain in vacuum during transport. The secondary processing assembly may include one or more modules which are interconnected to provide a desired system configuration. A dual processing module, including first and second process stations, is selectably operable in a serial mode or a parallel mode.

Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.

Abstract: A camera includes a photocathode operable in a night mode wherein electrons are generated in response to incident light, an active pixel sensor including an array of pixels for sensing electrons in the night mode, a power supply for energizing the photocathode in the night mode in response to a control signal, and a power supply control circuit for providing the control signal to the power supply in response to a sensed incident light level. The control signal may be a gating signal having a duty cycle that increases as the sensed incident light level decreases. The camera may be operable in a day mode wherein a fraction of the incident light is transmitted through the photocathode and is sensed by the active pixel sensor. The camera may further include an electron shielded light detector. A light detector signal generated by the electron shielded light detector may be used to control switching between the day mode and the night mode.

Abstract: A low light level system is described wherein electrons, created by images directed to a photocathode, directly bombard active pixel sensors. Both the active pixel sensors and the output end of the photocathode are positioned in a vacuum envelop. The electron released from the photocathode are directed to and at the active pixel sensors. The output of the active pixel sensor detector may be stored, viewed or displayed at a remote location. Various applications are described including a novel camera.

Abstract: A rapid thermal processing system for large area substrates, such as glass panels for flat panel displays, includes a processing chamber having a loading/unloading zone and a processing zone, a heating assembly for heating a substrate in the processing zone, and a transport assembly for transporting the substrate through the processing chamber. The transport assembly includes a feed conveyor for transporting the substrate from the loading/unloading zone through the processing zone and a substrate return assembly for transporting the substrate from the feed conveyor to the loading/unloading zone after the substrate is transported through the processing zone. The substrate return assembly may include a return conveyor for transporting the substrate to the loading/unloading zone and a substrate reverser for transferring the substrate from the feed conveyor to the return conveyor.

Abstract: A disk gripper for gripping an insulating disk, such as a glass disk, at its edge during processing includes a contact device for contacting the edge of the insulating disk and a mechanism for moving the contact device between a contact position, in contact with the edge of the disk, and a retracted position. In a first processing station, a conductive coating is applied to a disk held by the gripper, with the contact device in the retracted position. In a second processing station, ions are generated in a plasma adjacent to the surface of the disk held by the gripper. The contact device is in the contact position in contact with the conductive coating, and a bias voltage is applied to the contact device in the second processing station. The ions are accelerated from the plasma toward the disk by the bias voltage applied to the conductive coating.

Abstract: A substrate processing system includes a processing chamber, a substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, first and second ion sources located in the chamber, and a power source for energizing the first and second ion sources. Each ion source ionizes the process gas to produce ions for processing a substrate disposed on the substrate holder. The first and second ion sources include first and second anodes, respectively. The power source energizes the first and second anodes in a time multiplexed manner, such that only one of the first and second ion sources is energized at any time and interactions between ion sources are eliminated.

Abstract: A rapid thermal processing system for large area substrates, such as glass panels for flat panel displays, includes a processing chamber, a transport assembly for transporting a substrate through the processing chamber, and a heating assembly for heating the substrate. The heating assembly includes a bank of elongated heating elements disposed in the processing chamber. The heating elements have longitudinal axes aligned with the substrate transport direction. In one embodiment, heating elements on one side of the substrate have longitudinal axes aligned perpendicular to the substrate transport direction and heating elements on the opposite side of the substrate have longitudinal axes aligned parallel to the substrate transport direction.

Abstract: Disclosed is a system for transporting disks in vacuum to a vacuum station whereat a lubricant film is applied uniformly to the surfaces of the disks by evaporation. Thickness uniformity is achieved by directing the evaporate through a multi-hole aperture plate. Described is equipment for manufacture, the process of manufacture and the novel disks created.

Abstract: Methods and apparatus for testing a magnetic disk and a read head are provided. A reference track is written on the magnetic disk. The read head is scanned laterally with respect to the reference track while the magnetic disk is rotating. The reference track is sensed with the read head as the read head is scanned across the reference track to produce a scanned read signal that is representative of disk and read head performance. The scanned read signal may be processed to provide parameters such as track average amplitude, signal-to-noise ratio, and pulse width of write transitions.

Abstract: A substrate processing system includes a processing chamber, a substrate holder positioned in the chamber, a gas source for supplying a process gas to the chamber, at least one ion source located in the chamber, and a power source for energizing the ion source by positively biasing the anode and negatively biasing the cathode, the bias in each instance being relative to the chamber. The ion source ionizes the process gas producing ions for processing a substrate disposed on a substrate holder in the chamber. One embodiment includes two such ion sources. In this case, the power source energizes the first and second anodes and the cathodes in a time multiplexed manner, such that only one of the first or second ion sources is energized at any time and interactions between ion sources are eliminated.

Abstract: An electron beam microscope includes an electron beam pattern source, a vacuum enclosure, electron optics, a detector and a processor. The electron beam pattern source generates a sequence of electron beam patterns for illuminating a set of pixels on a specimen. The electron optics directs the sequence of electron beam patterns to the specimen. The detector detects a result of an interaction between each of the electron beam patterns and the specimen and produces a sequence of detector signals. The processor, in response to the sequence of detector signals, generates an image including a pixel value representative of each of the illuminated of pixels on the specimen. The electron beam microscope preferably includes a deflector for deflecting each of the electron beam patterns relative to the specimen.

Abstract: An electron source includes a negative electron affinity photocathode on a light-transmissive substrate and a light beam generator for directing a light beam through the substrate at the photocathode for exciting electrons into the conduction band. The photocathode has at least one active area for emission of electrons with dimensions of less than about two micrometers. The electron source further includes electron optics for forming the electrons into an electron beam and a vacuum enclosure for maintaining the photocathode at high vacuum. The photocathode is patterned to define emission areas. A patterned mask may be located on the emission surface of the active layer, may be buried within the active layer or may be located between the active layer and the substrate.