Patents Assigned to Intevac, Inc.
  • DRY ETCHING METHOD OF SURFACE TEXTURE FORMATION ON SILICON WAFER
    Publication number: 20120138139
    Abstract: Systems and methods for improving surface reflectance of silicon wafers are disclosed. The systems and methods improve surface reflectance by forming a textured surface on the silicon wafer by performing surface oxidation and dry etching processes. The surface oxidation maybe performed using a dry oxygen plasma process. A dry etch process is performed to remove the oxide layer formed by the surface oxidation step and etch the Silicon layer with oxide masking. Dry etching enables black silicon formation, which minimizes or eliminates light reflection or scattering, eventually leading to higher energy conversion efficiency.
    Type: Application
    Filed: November 1, 2011
    Publication date: June 7, 2012
    Applicant: INTEVAC, INC.
    Inventor: Young Kyu CHO
  • ION IMPLANT SYSTEM HAVING GRID ASSEMBLY
    Publication number: 20120125259
    Abstract: An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.
    Type: Application
    Filed: January 31, 2012
    Publication date: May 24, 2012
    Applicant: INTEVAC, INC.
    Inventors: Babak Adibi, Moon Chun
  • METHOD FOR ION IMPLANT USING GRID ASSEMBLY
    Publication number: 20120129325
    Abstract: A method of ion implantation comprising: providing a plasma within a plasma region of a chamber; positively biasing a first grid plate, wherein the first grid plate comprises a plurality of apertures; negatively biasing a second grid plate, wherein the second grid plate comprises a plurality of apertures; flowing ions from the plasma in the plasma region through the apertures in the positively-biased first grid plate; flowing at least a portion of the ions that flowed through the apertures in the positively-biased first grid plate through the apertures in the negatively-biased second grid plate; and implanting a substrate with at least a portion of the ions that flowed through the apertures in the negatively-biased second grid plate.
    Type: Application
    Filed: January 31, 2012
    Publication date: May 24, 2012
    Applicant: INTEVAC, INC.
    Inventors: Babak Adibi, Moon Chun
  • SYSTEM AND METHOD FOR COMMERCIAL FABRICATION OF PATTERNED MEDIA
    Publication number: 20120090992
    Abstract: A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.
    Type: Application
    Filed: December 27, 2011
    Publication date: April 19, 2012
    Applicant: INTEVAC, INC.
    Inventors: Kevin P. Fairbairn, Michael S. Barnes, Terry Bluck, Ren Xu, Charles Liu, Ralph Kerns
  • Optical beam spectrometer with movable lens
    Patent number: 8125637
    Abstract: A spectroscopic system is described that provides at least one of focus of an excitation beam onto a sample, automatic focus of an optical system of the spectroscopic system for collecting a spectroscopic signal, and/or averaging of excitation intensity over a surface area of the sample.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: February 28, 2012
    Assignee: Intevac, Inc.
    Inventors: Keith T. Carron, Mark Watson, Shane Buller
  • Method of and apparatus utilizing carbon cord for evaporation of metals
    Patent number: 8114339
    Abstract: A high temperature evaporator is made using an electrically insulating crucible and a heating element made of woven graphite fibers. The crucible is manufactured out of an electrically insulating block to the required shape, and channels are machined on the walls of the crucible. The woven graphite cord is threaded through the channels and is used as heating elements. Since the heating cords are made of woven graphite, they are very flexible and do not embrittle. They can be manufactured to various resistivity as needed, allowing for relatively inexpensive power supplies and low current power delivery. The cords are not fragile and do not break due to thermal shock or vibration.
    Type: Grant
    Filed: February 24, 2010
    Date of Patent: February 14, 2012
    Assignee: Intevac, Inc.
    Inventors: Arthur C. Wall, Terry Bluck
  • Evaporative system for solar cell fabrication
    Patent number: 8087380
    Abstract: A plurality of chamber are arranged about a transport chamber. The linear transport chamber may include a linear track supporting robot arms. The robot arms transport substrates to and from the chambers. Each chamber includes a plurality of evaporators, each controlled independently. Each substrate positioned in the chamber is coated from a plurality of the evaporators, such that by controlling the operation of each evaporator independently the formation of the layers and the concentration gradient of each layer can be precisely controlled.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: January 3, 2012
    Assignee: Intevac, Inc.
    Inventors: Terry Bluck, Michael S. Barnes, Kevin P. Fairbairn
  • COLLIMATOR BONDING STRUCTURE AND METHOD
    Publication number: 20110261239
    Abstract: An image sensor is disclosed that includes a solid state semiconductor imager having a metallized catch pad, a collimator having a metallized layer that faces a sensor anode, the metallized layer joined with the metallized catch pad to form a metal bond between the solid state semiconductor imager and the collimator. Methods of making the joined solid state semiconductor imager and collimator assembly are also disclosed.
    Type: Application
    Filed: April 21, 2010
    Publication date: October 27, 2011
    Applicant: INTEVAC, INC.
    Inventors: Kenneth A. COSTELLO, Kevin J. Roderick, Edward Yin, Douglas Fowler
  • ADJUSTABLE SHADOW MASK ASSEMBLY FOR USE IN SOLAR CELL FABRICATIONS
    Publication number: 20110192993
    Abstract: An adjustable shadow mask implantation system comprising: an ion source configured to provide ions; and an shadow mask assembly configured to selectively allow ions from the ion source to pass therethrough to a substrate where they are implanted, wherein the shadow mask assembly is configured to adjust between a first position and a second position, wherein the shadow mask assembly enables ion implantation of multiple substantially parallel lines absent any lines with an intersecting orientation with respect to the multiple substantially parallel lines when set in the first position, and wherein the shadow mask assembly enables ion implantation of multiple substantially parallel lines and a line with an intersecting orientation with respect to the multiple substantially parallel lines when set in the second position.
    Type: Application
    Filed: February 9, 2011
    Publication date: August 11, 2011
    Applicant: INTEVAC, INC.
    Inventors: Moon Chun, Babak Adibi
  • APPARATUS AND METHODS FOR TRANSPORTING AND PROCESSING SUBSTRATES
    Publication number: 20110158773
    Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
    Type: Application
    Filed: March 7, 2011
    Publication date: June 30, 2011
    Applicant: INTEVAC, INC.
    Inventors: Terry BLUCK, Kevin P. Fairbairn, Michael S. Barnes, Christopher T. Lane
  • EVAPORATIVE SYSTEM FOR SOLAR CELL FABRICATION
    Publication number: 20110104847
    Abstract: A plurality of chamber are arranged about a transport chamber. The linear transport chamber may include a linear track supporting robot arms. The robot arms transport substrates to and from the chambers. Each chamber includes a plurality of evaporators, each controlled independently. Each substrate positioned in the chamber is coated from a plurality of the evaporators, such that by controlling the operation of each evaporator independently the formation of the layers and the concentration gradient of each layer can be precisely controlled.
    Type: Application
    Filed: October 30, 2009
    Publication date: May 5, 2011
    Applicant: INTEVAC, INC.
    Inventors: Terry BLUCK, Michael S. Barnes, Kevin P. Fairbairn
  • Apparatus and methods for transporting and processing substrates
    Patent number: 7901539
    Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: March 8, 2011
    Assignee: Intevac, Inc.
    Inventors: Terry Bluck, Kevin P Fairbairn, Michael S. Barnes, Christopher T. Lane
  • ELECTROSTATIC CHUCK
    Publication number: 20100326602
    Abstract: An isolator for heat transfer gas conduits of an electrostatic chuck is described. The isolator includes a sleeve and a body positioned in the sleeve to form an annulus between the body and sleeve that allows for flow of the heat transfer gas. The body is positioned against the puck of the chuck, and may be supported in this position by a spring. A silicon seal may be provided between the sleeve and the puck to prevent plasma from forming in the conduits.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Applicant: INTEVAC, INC.
    Inventors: Terry BLUCK, Terry Pederson, Dennis Grimard
  • PROCESS FOR OPTIMIZATION OF ISLAND TO TRENCH RATIO IN PATTERNED MEDIA
    Publication number: 20100237042
    Abstract: A sequence of process steps having balanced process times are implemented in sequence of etch chambers coupled linearly and isolated one from the other, resulting in the optimization of island to trench ratio for a patterned media. A biased chemical etching using active etching gas is used to descum and trim the resist patterns. An inert gas sputter etch is performed on the magnetic layers, resulting in the patterned magnetic layer on the disk. A final step of stripping is then performed to remove the residual capping resist and carbon hard mask on top of un-etched magnetic islands. The effective magnetic material remaining on the disk surface can be optimized by adjusting the conditions of chemical etch and sputter etch conditions. Relevant process conditions that may be adjusted include: pressure, bias, time, and the type of gas in each step.
    Type: Application
    Filed: March 23, 2010
    Publication date: September 23, 2010
    Applicant: INTEVAC, INC.
    Inventors: Houng T. Nguyen, Ren Xu, Michael S. Barnes
  • METHOD FOR OPTIMIZED REMOVAL OF WAFER FROM ELECTROSTATIC CHUCK
    Publication number: 20100208409
    Abstract: Systems and methods for optimally dechucking a wafer from an electrostatic chuck are described. The force on a lift-pin mechanism is monitored and a dechuck voltage is determined based on the force. The wafer is dechucked at the determined dechuck voltage.
    Type: Application
    Filed: February 17, 2009
    Publication date: August 19, 2010
    Applicant: INTEVAC, INC.
    Inventors: Terry Bluck, Hizam Sahibudeen, Dennis Grimard
  • METHOD AND APPARATUS FOR PRECISION SURFACE MODIFICATION IN NANO-IMPRINT LITHOGRAPHY
    Publication number: 20100098862
    Abstract: A scalable, high-throughput nanoimprint lithography priming tool includes a dual-reactant chemical vapor deposition reactor chamber, a mandrel configured to hold a plurality of hard disks at an inner diameter of the hard disks, and a transport mechanism to move the plurality of hard disks into and out of the chamber. The tool may also include a transfer tool to transfer the plurality of hard disks to additional chambers for processing.
    Type: Application
    Filed: October 1, 2009
    Publication date: April 22, 2010
    Applicant: INTEVAC, INC.
    Inventors: Ren XU, Carl T. PETERSEN, III, Charles LIU
  • SYSTEM AND METHOD FOR PROCESSING SUBSTRATES WITH DETACHABLE MASK
    Publication number: 20100003768
    Abstract: Apparatus and methods are provided that enable processing of patterned layers on substrates using a detachable mask. Unlike prior art where the mask is formed directly over the substrate, according to aspects of the invention the mask is made independently of the substrate. During use, the mask is positioned in close proximity or in contact with the substrate so as to expose only portions of the substrate to processing, e.g., sputtering or etch. Once the processing is completed, the mask is moved away from the substrate and may be used for another substrate. The substrate may be cycled for a given number of substrates and then be removed for cleaning or disposal.
    Type: Application
    Filed: June 30, 2009
    Publication date: January 7, 2010
    Applicant: INTEVAC, INC.
    Inventors: Michael S. BARNES, Terry BLUCK
  • SYSTEM AND METHOD FOR SUBSTRATE TRANSPORT
    Publication number: 20090324369
    Abstract: Introduction of substrates into vacuum environment is accomplish by gradually reducing the number of substrates being transferred simultaneously as the clean and evacuated environment is progressed. Cassettes are maintained in clean atmospheric environment and do not enter the vacuum environment. Several vacuum locks are linearly staggered so as to introduce progressively higher level of vacuum environment. The number of substrates transported through this arrangement is a portion of the number of substrates present in each cassette. The staggered vacuum locks lead to a series of processing chambers, wherein a yet smaller number of substrates, e.g., one or two, are transported.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 31, 2009
    Applicant: INTEVAC, INC.
    Inventors: Stuart SCOLLAY, Terry Bluck, Xiang Chen
  • TOOLS AND METHODS FOR MOUNTING TRANSPORT RAILS IN A SUBSTRATE PROCESSING SYSTEM
    Publication number: 20090279990
    Abstract: Devices and methods for mounting and aligning transport rails to a processing chamber of a substrate processing system are described. An alignment feature is built-in to the transport rail and a corresponding alignment feature is added to the valves separating processing chambers. The alignment feature may be a pin-groove arrangement.
    Type: Application
    Filed: October 31, 2008
    Publication date: November 12, 2009
    Applicant: INTEVAC, INC.
    Inventor: Stuart Scollay
  • Processing thin wafers
    Patent number: 7611322
    Abstract: There is described a wafer processing system for thinned wafers that are easily broken during handling. The system protects against breakage during handling and provides for temperature controls during processing.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: November 3, 2009
    Assignee: Intevac, Inc.
    Inventors: Terry Bluck, Stuart Scollay, Edric Tong