Abstract: Provided a lithography projection objective includes: first lens group, second lens group, third lens group, fourth lens group, and fifth lens group, wherein first lens group, second lens group, third lens group, fourth lens group, and fifth lens group are sequentially arranged along an optical axis; first lens group and third lens group each has negative optical power, second lens group and fourth lens group each has positive optical power, fifth lens group has optical power of 0, sum optical power of first lens group, second lens group, third lens group, fourth lens group, and fifth lens group is 0; lithography projection objective further includes diaphragm; and first lens group, third lens group, and fourth lens group each comprises aspheric lenses, one aspheric lens thereof includes an aspherical surface; and a number of aspheric lenses is greater than or equal to 4 and less than or equal to 8.

Abstract: A vacuumizing device includes a vacuum chamber, a bonding fixture and a vacuumizing system. The bonding fixture is disposed in the vacuum chamber and includes a substrate table provided with a plurality of grooves for retention of the substrate by suction. The vacuumizing system is disposed in communication with both the vacuum chamber and grooves. During vacuumizing by the vacuumizing system, a vacuum value in the grooves is smaller than or equal to a vacuum value in the vacuum chamber. In the vacuumizing device and methods, the vacuumizing system is used to vacuumize the grooves in the substrate table and the vacuum chamber so that the vacuum value in the grooves is always smaller than or equal to that in the vacuum chamber. As a result, the substrates are firmly retained on the substrate table without warping, thereby improving the quality of substrate bonding.

Abstract: A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.

Abstract: An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122).

Abstract: A spin coating device and method. The spin coating device includes a rotatable rotary shaft and sucker fixed on an end portion of the shaft, and an electromagnetic induction device below the sucker which includes an annular magnet fixed below the sucker, coil group formed by a first and second coil, and strip-shaped magnet fixed at the rotary shaft. A base on the sucker has a notch. The unbalanced centrifugal force during rotation of the sucker causes vibration. The electromagnetic induction device enables the centrifugal force generated during rotation of the sucker to be in balance with the magnetic force generated by the electromagnetic induction device to adjust the levelness of the sucker surface. The device does not need manual manipulation, enables the sucker to be more stable, reduces damage to the equipment due to vibration, and improves the effect of photoresist spin-coating while saving time and labor.

Abstract: A robotic manipulator for handling a cassette and an automated cassette transport device are disclosed, the device including a mechanical arm (1), an end actuator (2) at an end of the mechanical arm (1) and a vision-based locating assembly (3) on the end actuator (2). On the one hand, the vision-based locating assembly (3) can determine the position of a flange of the cassette, thereby identifying the cassette. In other words, the cassette can be identified based on a feature of the cassette itself. This dispense with a separate locating marker while improving cassette measuring and handling accuracy. On the other hand, transportation of the cassette is allowed by complementary retention of its flange on a recessed surface of the end actuator (2).

Abstract: A substrate transfer device and method as well as a photolithography apparatus are disclosed. The device includes a motion platform and a plurality of transfer stages which are arranged side-by-side along a first direction are configured to transfer substrates in a second direction that is perpendicular to the first direction. The motion platform includes a base table and a plurality of motion tables in movable connection with the base table. Each of the transfer stages is connected to, and movable in the first direction with, a corresponding one of the motion tables. A pre-alignment assembly for pre-alignment and positional adjustments of the substrates is provided on the motion platform and on the transfer stages. When one of the transfer stages is unloading a first substrate, another one of the transfer stages receives a second substrate and effectuates its first- and second-directional pre-alignment with the aid of the pre-alignment assembly.

Abstract: The present invention provides a linear module, which includes a casing, and a linear transmission device (20). The casing has an internal cavity, in which the linear transmission device (20) is at least partially disposed, and an output opening (31) which extends along a movement direction of the linear transmission device (20) defined on the case. A sealing band (32) is arranged at the output opening (31). The linear module further includes a first rolling mechanism (50) which is moveable in synchronization with the linear transmission device (20) and is arranged on a side of the sealing band (32) which is away from the internal cavity. The first rolling mechanism (50) is in rolling contact with the sealing band (32). This linear module enables high cleanliness and has good sealing performance, high accuracy and high stability.

Abstract: A wafer holder and a wafer transfer apparatus, system and method are disclosed. The wafer holder is mounted onto the wafer transfer apparatus and includes a holder body and a sucker. The holder body defines a first opening, while the sucker includes a first skirt. The first skirt is located on one side of the holder body and connected to the first opening. A groove is formed at a joint between the first skirt and the first opening. The groove is located at an outer side of the first skirt, and is able to relief stresses produced at a base portion of the sucker during deformation of the first skirt.

Abstract: An apparatus and method for bonding alignment are provided. The apparatus for bonding alignment includes a press assembly and an objective lens group (105) disposed on one side of the press assembly. The press assembly includes a first chuck (103) and a rotatable second chuck (104). When support surfaces of the first and second chucks are not parallel to each other, the second chuck is rotated to make the two support surfaces parallel. A first substrate (301) is then loaded on the first chuck, and alignment marks (302) on the first substrate are observed using the objective lens group disposed on one side of the press assembly. A second substrate (501) is loaded on the second chuck, and alignment marks (502) on the second substrate are also observed with the objective lens group. Based on an observation result by the objective lens group, the two substrates are moved so that the alignment marks thereon are aligned and hence the two substrates themselves are aligned.

Abstract: An exposure apparatus and method. The exposure apparatus includes a control system, light source system, plurality of illumination systems and plurality of projection objective lenses. The light source system is configured to emit a plurality of first illumination beams incident on the illumination systems. Each illumination system includes a variable attenuator and branch energy detector. The branch energy detector is configured to detect an illuminance level of a second illumination beam generated in the corresponding illumination system and feed it back to the control system. The control system is configured to adjust the illuminance levels of the second illumination beams in the respective illumination systems by controlling the respective variable attenuators therein. The exposure apparatus and method have improved exposure performance and allow finer and faster energy adjustments, thus enabling precise control and higher exposure accuracy.

Abstract: A mask fork, configured to transfer a mask from a standard mechanical interface pod. The standard mechanical interface pod includes a plurality of supports having a L-shaped cross section. Each of the plurality of supports includes a connecting section extending horizontally and a supporting section extending vertically, and the connecting section has a bottom to which a limiting section is fixed. The mask fork includes a fork body and two tines connected to the fork body in symmetry with each other. Each of the tines comprises a transfer member configured to support the mask during a transfer of the mask and anti-collision members including a first anti-collision member extending horizontally and a second anti-collision member extending vertically. The first anti-collision member is horizontally attached to a side of the transfer member facing away from the mask.

Abstract: An optical path compensation apparatus includes a wedge assembly, a driving mechanism and a preload unit. The wedge assembly includes a movable wedge and a fixed wedge. The movable wedge and the fixed wedge having equal wedge angles and respective wedge surfaces inclined in opposite directions. The preload unit is configured to elastically press the movable wedge on the fixed wedge, and the driving mechanism is configured to cause relative movement between the wedge surface of the movable wedge and the wedge surface of the fixed wedge. This optical path compensation apparatus is capable of achieving effective position correction of a focal plane of a measurement system for focusing and leveling in a smooth, convenient and precise way while not causing any error in other directions.

Abstract: A cassette transport device is disclosed which includes a smart cart, a base expansion frame mounted on the smart cart and a cassette-loading frame fixed to the base expansion frame. The cassette-loading frame is partitioned into several segments each accommodating a plurality of cassette trays. Each of the cassette trays defines, on its surface, a first trough and a second trough in the first trough. The first trough is configured to retain a cassette of a first size, and the second trough is configured to retain a cassette of a second size. With the first and second troughs, each of the cassette trays is able to retain a cassette of either the first or second size, making the cassette transport device possible to be used in transportation of the both types of cassettes with a high yield. Moreover, the smart cart is capable of automated transportation without human intervention or track construction while enabling savings in transportation cost, time and labor.

Abstract: A prism rotation adjustment mechanism, a photolithographic exposure system and a photolithography tool are disclosed. The prism rotation adjustment mechanism includes a frame (200), a flexible mechanism (100) and an actuation mechanism. The flexible mechanism (100) includes a fixing component (110), an actuating component (120), a connecting component (130) and a swinging component (140) that are flexibly articulated in a sequence. The fixing component (110) is fixed to the frame (200). The actuation mechanism is fixed to the frame (200) and coupled to the actuating component (120). On the swinging component (140) are secured a prism wherein an axis of articulation between the swinging component (140) and the fixing component (110) is in correspondence with a rotational center of the prism.

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: The lithography apparatus includes at least two exposure devices and one substrate device. The substrate device includes a substrate stage and a substrate supported by the substrate stage. The at least two exposure devices are disposed in symmetry to each other above the substrate with respect to a direction for scanning exposure and configured to simultaneously create two exposure fields onto the substrate to expose the portions of the substrate within the exposure fields.

Abstract: A method for vertical control of a lithography machine includes step 1, prior to a scanning exposure, controlling vertical measurement sensors to measure workpiece to obtain overall surface profile data of the workpiece; step 2, performing a global leveling based on the overall surface profile data of the workpiece; and step 3, during the scanning exposure of each exposure field, measuring a local surface profile of the workpiece in real time by the vertical measurement sensors and controlling at least one of a mask stage, a workpiece stage and a projection objective to move vertically according to a Z-directional height value, an Rx-directional tilt value and an Ry-directional tilt value corresponding to the local surface profile of the workpiece, to compensate for the local surface profile of the workpiece in real time, so that an upper surface of each exposure field coincides with a reference focal plane for the exposure field.

Abstract: A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Abstract: A machine vision system for substrate alignment includes first and second illumination sources (11, 12), first and second reflectors (21, 22), first and second objective lenses (31, 32) and first and second detectors (41, 42), each of which pair is symmetric with respect to an X-axis. Light beams emitted from the first and second illumination sources are irradiated on and reflected by respective substrates (1, 2), amplified by the respective objective lenses and received and detected by the respective detectors. An alignment apparatus is also disclosed. Disposing each of the pair of the first and second illumination sources, the first and second reflectors, the first and second objective lenses and the first and second detectors in symmetry with respect to the X-axis results in a significantly reduced footprint of the machine vision system along the orientation of lens barrels of the objective lenses and hence an expanded detection range thereof and improved alignment efficiency and accuracy.