Abstract: A grating measuring device includes: a light source module (300) for generating two light beams having different frequencies, one of which serves as a measuring beam and the other as a reference beam; a grating (200); and a grating measuring probe (100) including a dual-frequency light reception module, a vertical measurement module, a vertical detection module and a reference detection module. The dual-frequency light reception module is configured to receive the measuring and reference beams, and the vertical measurement module is adapted to project the measuring beam onto the grating (200), collect a zeroth-order diffracted beam resulting from double diffraction occurring at the grating, and feed the zeroth-order diffracted beam to the vertical detection module. The zeroth-order diffracted beam interferes with the reference beam in the vertical detection module, resulting in a vertical interference signal.

Abstract: A lens anti-contamination device is disclosed, including a first device (300) and a second device (400) connected to the first device (300), the first device (300) being closer to a lens (100) relative to the second device (400), wherein the first device (300) is used to output protective layer gas, and the protective layer gas is enabled to uniformly flow in close contact with the lower surface of the lens (100) through a nozzle (330), such that the contaminated lens (100) can be cleaned and a protective layer is funned to prevent the lens from being contaminated again; the second device (400) is used to take away gas close to a contamination source, and the contamination gas enters an annular cavity (420) through small holes (410) and is exhausted into a distant environment through the suction and exhaust power of an exhaust passage (200). A lens anti-contamination method is also disclosed.

Abstract: Apparatus and method for transferring a substrate are disclosed. The substrate transfer apparatus includes: a substrate conveyance assembly disposed between a mechanical arm and a wafer stage, the substrate conveyance assembly including a substrate loading conveyor and a substrate unloading conveyor parallelly arranged in a first direction, each of the substrate loading conveyor and the substrate unloading conveyor configured for transferring a substrate between the wafer stage and the mechanical arm along a second direction perpendicular to the first direction; an integral frame; and a transition air suspension assembly fixed to the integral frame at the end thereof proximal to the wafer stage, the transition air suspension assembly being able to engage with either of the substrate loading conveyor and the substrate unloading conveyor for producing an air film to levitate the substrate during the conveyance of the substrate by the substrate loading conveyor or the substrate unloading conveyor.

Abstract: A measurement device and method for focusing and leveling are disclosed. The device includes a measuring optical path and a first monitoring optical path. Measuring light in the measuring optical path interacts with a wafer and is then incident on a measuring detector to form thereon a measuring mark. First monitoring light in the first monitoring optical path is incident on a measuring detector to form thereon a first monitoring mark. An error in a measurement result of the wafer that arises from a drift of the measuring detector can be eliminated by compensating for a vertical deviation of the wafer obtained by subtracting a drift of the first monitoring mark from a displacement of the measuring mark. In this way, measurement accuracy and stability can be improved by monitoring and correcting the drift of the measuring detector.

Abstract: An exposure apparatus includes an exposure unit for exposing a wafer. The exposure unit includes an illumination system and masks. The illumination system includes a light-homogenizing unit. The light-homogenizing unit includes a light-homogenizing quartz rod having a regular hexagonal cross section. Each of the masks has a regular hexagonal shape matching with the cross section of the light-homogenizing quartz rod. A field of exposure resulting from this arrangement is less affected by objective field of view distortion and allows a higher useful depth of focus (UDoF) when compared to other fields of exposure of the same size. In addition, with the same projection objective DoF, a greater field of exposure can be obtained.

Abstract: A light intensity modulation method implemented by using a mask (101) includes the steps of: 1) based on a circle of confusion (CoC) function of an illumination system (102), an initial light intensity distribution of an illumination field of view (FOV) and a target light intensity distribution of the illumination FOV, calculating a transmittance distribution of the mask (101) used to modulate the initial light intensity distribution into the target light intensity distribution; 2) meshing the mask (101) according to a desired accuracy of the target light intensity distribution and determining a distribution of opaque dots in each of cells resulting from the meshing based on the transmittance distribution of the mask (101) and a desired accuracy of the transmittance distribution; and 3) fabricating the mask (101) based on the determined distribution of the opaque dots and then deploying the mask (101) in the illumination system.

Abstract: A magnetic gravity compensator comprises a stator (1), a rotor (2), a base (4) and an adjustment mechanism (6). The stator (1) is disposed on the base (4), and the rotor (2) is levitated with respect to the stator (1). The stator (1) comprises a central cylindrical magnet (11) that is fixed to the base (4) by the adjustment mechanism (6) and consists of at least two arc magnets (111). The adjustment mechanism (6) has a first end fixed to the base (4) and a second end securely connected to the at least two arc magnets (111). The adjustment mechanism (6) is configured to drive the at least two arc magnets (111) to synchronously move radially with respect to a central axis of the central cylindrical magnet (11) so as to change a magnetic circuit between the central cylindrical magnet (11) and the rotor (2), and thereby adjust a magnetic levitation force between the stator (1) and the rotor (2).

Abstract: A method for pre-aligning a substrate includes the steps of: 1) providing a substrate having a plurality of marks are arranged circumferentially on a surface thereof, wherein each of the plurality of marks consists of at least one first stripe extending in a first direction and at least one second stripe extending in a first direction; 2) aligning a center of the substrate with a given point on a substrate carrier stage; 3) illuminating a mark selected from the plurality of marks on the surface of the substrate with light and obtaining an image of the selected mark; 4) processing the image to obtain first projection data corresponding to the first direction and second projection data corresponding to the second direction; 5) identifying a set of first peak values corresponding to the at least one first stripe of the selected mark from the first projection data and a set of second peak values corresponding to the at least one second stripe of the selected mark from the second projection data; 6) selecting firs

Abstract: A scanning mirror monitoring system and method as well as a focusing and leveling system are disclosed. The scanning mirror monitoring system includes a simple harmonic motion detector unit and a signal processing unit (25). The simple harmonic motion detector unit monitors a simple harmonic motion of a scanning mirror (8) and produces a simple harmonic signal. The signal processing unit (25) receives the simple harmonic signal and instructs a scanning mirror actuator unit (27) to adjust the amplitude and/or position of the scanning mirror (8) based on a variation found in the simple harmonic signal. The signal processing unit (25) identifies the variation by monitoring an optical intensity profile.

Abstract: An interferometer measuring device is disclosed which includes a workpiece stage (10), a laser interferometer (20) and a measuring reflector (30) mounted on the workpiece stage. The measuring reflector (30) is comprised of a plurality of planar mirrors (31) that are joined together along a horizontal direction. The laser interferometer (20) includes a first interferometer (21) and a second interferometer (22).

Abstract: An alignment system, a dual-wafer-stage system and a measurement system are disclosed, the alignment system including a main frame (201, 301), a first wafer stage (205, 305), an alignment sensor (202, 302), a position acquisition module (208, 308) and a signal processing device (203, 303). The position acquisition module (208, 308) collects positional data from the first wafer stage (205, 305) and the reflector (204, 304) simultaneously. The reflector (204, 304) is arranged on the alignment sensor (202, 302). In other words, positional data of the alignment sensor (202, 302) and positional data of the first wafer stage (205, 305) are collected simultaneously. In addition, the data can be processed to indicate the relative position of the first wafer stage (205, 305) relative to the alignment sensor (202, 302) whose vibration has been zeroed. That is, a position where an alignment mark is aligned can be obtained with the relative vibration amplitude of the alignment sensor (202, 302) being zeroed.

Abstract: A motion stage device, an exposure device and a lithography machine are disclosed. The motion stage device includes: Y-direction motors (203), a mover of each Y-direction motor (203) movable in a horizontal Y-direction; X-direction motors provided on X-direction guide rails (105), the X-direction guide rails (105) is in connection with the movers of the Y-direction motors (203) and movable in the horizontal Y-direction under actuation of the Y-direction motors (203), the X-direction motors having movers (107b) movable in a horizontal X-direction; an inner frame (102), supporting the X-direction guide rails (105); and a motion stage (108, 106), disposed on the movers (107b) of the X-direction motor. This motion stage device possesses improved modal and vibration characteristics because of a reduced load on the Y-direction motors (203).

Abstract: A photolithography tool and a method for compensating for surface deformation in a carrier of the photolithography tool are disclosed. In the photolithography tool, carrier surface deformation compensation elements are provided at the bottom of the carrier, which are capable of compensating for the surface deformation in the carrier. In the method, the surface deformation is detected by carrier surface deformation detection modules, and an automated closed-loop controller controls compensating forces exerted by the carrier surface deformation compensation elements based on the detected deformation. This allows more accurate compensation for the carrier surface deformation.

Abstract: An apparatus for detecting a degree of particulate contamination on a flat panel is disclosed, including: an illuminator for producing a radiation beam which results in scattered radiation from its scattering by contaminants on a surface of the flat panel under test and reflected radiation from its reflection by the surface of the flat panel under test; a detector for collecting the scattered radiation, the detector having a radiation collection surface perpendicular to a normal of the surface of the flat panel under test; and a beam trimmer for separating the reflected radiation from the scattered radiation, the beam trimmer including a first optical member, disposed in correspondence with the scattered radiation and configured for directing the scattered radiation to be collected by the detector, and a second optical member disposed in correspondence with the reflected radiation and configured for directing the reflected radiation not to be collected by the detector.

Abstract: Disclosed is an adaptive groove focusing and leveling device for measuring the height and the inclination of the surface of a measured object (400).

Abstract: An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are arranged on the wafer such that they are substantially symmetrical to each other with respect to a center of the wafer; a peripheral vision acquisition system (1), configured to perform a first positional compensation for the wafer based on a relative positional relationship of an edge or a notch of the wafer with respect to the wafer stage; and a mark detection system (4), configured to capture images of the first and second alignment marks (W1, W2) and perform a second positional compensation for the wafer by determining a relative positional relationship of the center of the wafer with respect to a center of the wafer stage based on the positions of the first and second alignment marks (W1, W2) in a coordinate system of the mark detection system, wherein the coordinate system of the mark detection system (4) has a horizontal axis (X) defined by a li

Abstract: An amplitude monitoring system, a focusing and leveling apparatus and a defocus detection method. The method includes: adjusting amplitude of a scanning mirror to a theoretical amplitude value and recording corresponding theoretical output voltage values of a photodetector; adjusting the amplitude of the scanning mirror and sampling real-time amplitude values of the scanning mirror and real-time output voltage values of the photodetector to calculate compensated real-time demodulation results, and recording real-time defocus amounts of a wafer table; subsequent to stepwise displacement of the wafer table, establishing a database based on the compensated real-time demodulation results and the real-time defocus amounts of the wafer table; and in an actual measurement, sampling in real time an actual amplitude value of the scanning mirror and actual output voltage values of the photodetector to calculate a compensated real-time demodulation result and finding an actual defocus amount of the wafer table.

Abstract: A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.

Abstract: A device including a light source, illumination system, objective lens, and detector. The light source produces measurement light beams, the illumination system directs measurement light beams into the objective lens, and the objective lens directs measurement light beams onto an overlay marker, collects main maximums of diffracted light beam diffracted from the overlay marker, and focuses main maximums of diffracted light beam onto a pupil plane of the objective lens. The detector is positioned on the pupil plane of the objective lens and used for detecting the position of each main maximums of diffracted light beam on the detector, to obtain the overlay error of said overlay marker. Diffracted-light position information is used to measure overlay error, and measurement signals are not affected by illumination uniformity, transmissivity uniformity, etc.

Abstract: A coaxial reticle alignment device, a lithography apparatus and alignment methods are disclosed. The coaxial reticle alignment device includes: illumination modules (A, B), each configured to provide an alignment light beam; a projection objective (8) under a reticle (5); a reference plate (9) on a workpiece stage (12), configured to carry a reference mark (10); and an image detection and processing module (11) under the reference plate (9).