Abstract: A light intensity modulation method implemented by using a mask (101) includes the steps of: 1) based on a circle of confusion (CoC) function of an illumination system (102), an initial light intensity distribution of an illumination field of view (FOV) and a target light intensity distribution of the illumination FOV, calculating a transmittance distribution of the mask (101) used to modulate the initial light intensity distribution into the target light intensity distribution; 2) meshing the mask (101) according to a desired accuracy of the target light intensity distribution and determining a distribution of opaque dots in each of cells resulting from the meshing based on the transmittance distribution of the mask (101) and a desired accuracy of the transmittance distribution; and 3) fabricating the mask (101) based on the determined distribution of the opaque dots and then deploying the mask (101) in the illumination system.

Abstract: A wafer transfer system for use in a photolithography system including a wafer storage apparatus, a pre-alignment apparatus, a buffer stage and a wafer stage is disclosed, which includes: a dual-arm robot, configured to take a wafer to be exposed from the wafer storage apparatus and transfer it onto the pre-alignment apparatus and further configured to remove an exposed wafer from the buffer stage and place it back into the wafer storage apparatus; a wafer-loading linear robot, configured to transfer a pre-aligned wafer onto the wafer stage; and a wafer-unloading linear robot, configured to transfer the exposed wafer onto the buffer stage. The dual-arm robot, the wafer-loading linear robot and the wafer-unloading linear robot can operate in parallel so as to achieve time savings in the wafer transfers.

Abstract: An adjustment apparatus which is an optical system having an incident face and a light exit face that is parallel to the incident face. The optical system is disposed in an exposure device. The adjustment apparatus includes at least one wedge lens and a plurality of optical lenses configured such that at least one of focal plane adjustment, magnification adjustment and position adjustment for a field of view corresponding to the exposure device is made possible through changing relative positions of at least one pair of neighboring ones of the lenses. An adjustment method corresponding to the adjustment apparatus is also provided for the focal plane adjustment, magnification adjustment and position adjustment for the field of view corresponding to the exposure device.

Abstract: A pre-alignment measurement device includes, disposed in a direction of propagation of light, a laser, a first cylindrical lens, a first imaging lens, an illumination diaphragm, a second imaging lens, a second cylindrical lens and a CCD detector. The laser, an object under measurement and the CCD detector are arranged at respective apexes of a triangle formed by the measurement device for pre-alignment. A light beam is emanated by the laser and is transformed into a line beam. The line beam is reflected by the object under measurement and then passes through the second cylindrical lens to form a CCD image which has different horizontal and vertical magnifications, allowing horizontal and vertical resolutions to be matched with horizontal and vertical measuring ranges, respectively. The CCD image contains information of a position and a height of a step defined by the object under measurement and the wafer stage.

Abstract: In an exposure apparatus and a method for defocus and tilt error compensation, each of alignment sensors (500a, 500b, 500c, 500d, 500e, 500f) corresponds to and has the same coordinate in the first direction as a respective one of focusing sensors (600a, 600b, 600c, 600d, 600e, 600f), so that each of the alignment sensors (500a, 500b, 500c, 500d, 500e, 500f) is arranged on the same straight line as a respective one of the focusing sensors (600a, 600b, 600c, 600d, 600e, 600f). As such, alignment marks can be characterized with both focusing information and alignment information. This enables the correction of errors in the alignment information and thus achieves defocus and tilt error compensation, resulting in significant improvements in alignment accuracy and the production yield.

Abstract: An exposure device is disclosed, including: a light source (1), an illumination module (2), a mask stage (5), a projection objective module, an imaging position adjustment module (4) and a wafer stage (6), disposed sequentially along a direction of light propagation, the imaging position adjustment module (4) including a plurality of adjustment elements (410) arranged individually, the projection objective module including a plurality of projection objectives (3) each having an FoV in positional correspondence with a respective one of the plurality of adjustment elements (410). The imaging position adjustment module (4) ensures satisfactory imaging quality and FoV stitching quality of the projection objectives (3) by performing translation, magnification, focal plane and other adjustments on an image formed by the projection objective module. The projection objective module is simpler as it does not contain any component or mechanism for imaging position adjustment.

Abstract: A heating and cooling arrangement of a bonder is disclosed which includes a heating-wire plate (1), a cooling-pipe plate (2), a heating wire (5), a cooling pipe (6) and a solder layer. The heating wire (5) and the cooling pipe (6) are welded in respective channels in the heating-wire plate (1) and the cooling-pipe plate (2) and uniformly welded together by the solder layer. The heating wire (5) is configured to connect to an external heating device, the cooling pipe (6) is configured to connect to an external cooling device. A method of fabricating such a heating and cooling arrangement of a bonder is also disclosed. In the bonder heating and cooling arrangement, the heating wire and the cooling pipe are uniformly welded together by the solder layer to form an integrated assembly with a smaller overall thickness, a shortened heat transfer path and increased cooling efficiency. This reduces the work load of a required vacuum pump, enhances the surface flatness of the component and increases bonding accuracy.

Abstract: A Halbach magnetic array is disclosed, including a plurality of first and second magnetic units alternately arranged in a width direction, wherein: each first magnetic unit includes first magnetic groups and first magnetic columns alternately arranged in a length direction, each first magnetic group includes four first magnetic bars arranged in a 2*2 matrix; each second magnetic unit includes second magnetic groups and second magnetic columns alternately arranged in the length direction, each second magnetic group includes four second magnetic bars arranged in a 2*2 matrix; each first magnetic column is magnetized in a height direction, and each second magnetic column is magnetized in a direction opposite to the height direction. A magnetic suspension vibration damper is also disclosed.

Abstract: A self-damping shutter apparatus for use in an exposure system of a photolithography machine, comprising: at least two pieces of shutter blades (1) for cutting off light source to an exposure area when the shutter is closed; a shutter driving arm (2), for driving the shutter blades (1) to synchronically open or close; a magnetic damping brake motor (3), for driving or braking the shutter driving arm (2), and the magnetic damping brake motor (3) drives and brakes, via the shutter driving arm (2), the shutter blades (1). The self-damping shutter apparatus for use in the exposure system of the photolithography machine increases consistency of opening or closing the shutter blades, improves a light shading effect of the shutter apparatus in an exposure, and improves stability in the process of opening or closuring the shutter blades.

Abstract: A reticle transfer apparatus includes a reticle, a reticle stage (4) and a robot (2). The robot (2) is configured to support, transport and transfer the reticle onto the reticle stage (4).

Abstract: A wafer edge protection apparatus, including an electrical control module having a servomotor, a vertical motion mechanism and a protection mechanism. The protection mechanism includes: a shaft coupler, in fixed connection with a shaft of the servomotor and having a plurality of first connecting components; and a transmission sleeve, in fixed connection with the vertical motion mechanism and having a plurality of second connecting components in movable connection with the plurality of first connecting components.

Abstract: An apparatus for correcting the shape of a reticle, including: suckers; a sucker mounting frame; and a pneumatic control system, wherein the sucker mounting frame is disposed above a reticle stage, the suckers are mounted on a bottom of the sucker mounting frame in a manner of being spaced apart from one another; and the pneumatic control system is configured to control the suckers to retain the reticle by suction or to release the reticle. The suckers are so arranged that they do not block trapezoidal exposure fields of view on the reticle, thereby allowing a light beam to be fully (100%) incident on the reticle, which results in improved exposure efficiency. The apparatus is mounted separately from a photolithography tool by which it is employed, enabling a lower weight load on the reticle. Additionally, the apparatus is not in contact with any component disposed in the photolithography tool and will not introduce additional external vibration to the tool.

Abstract: A silicon wafer edge protection device having: a horizontal motion assembly; vertical motion assembly; speed regulating device, which is in signal connection with the vertical motion assembly and used for regulating vertical motion assembly motion speed; flexible bumper assembly, which is connected to the horizontal motion assembly and vertical motion assembly and used for reducing the amplitude of vibration of the silicon wafer edge protection device when a collision occurs; and control device, which is in signal connection with the speed regulating device and used for sending a control signal to the speed regulating device to control motion of the vertical motion assembly. The silicon wafer edge protection device can prevent a wafer stage from undergoing an instantaneous strong impact and prevent a silicon wafer from being crushed. When a collision occurs, the wafer stage and the silicon wafer can be protected. Production efficiency is also improved.

Abstract: A method for pre-aligning a substrate includes the steps of: 1) providing a substrate having a plurality of marks are arranged circumferentially on a surface thereof, wherein each of the plurality of marks consists of at least one first stripe extending in a first direction and at least one second stripe extending in a first direction; 2) aligning a center of the substrate with a given point on a substrate carrier stage; 3) illuminating a mark selected from the plurality of marks on the surface of the substrate with light and obtaining an image of the selected mark; 4) processing the image to obtain first projection data corresponding to the first direction and second projection data corresponding to the second direction; 5) identifying a set of first peak values corresponding to the at least one first stripe of the selected mark from the first projection data and a set of second peak values corresponding to the at least one second stripe of the selected mark from the second projection data; 6) selecting firs

Abstract: A magnetic alignment system is disclosed, including a magnet array (10), a motor rotor (20), a fixed tooling (30) and a force sensor (40). The motor rotor (20) is disposed over the magnet array (10) and is connected via the force sensor (40) to the fixed tooling (30) that is positionally fixed relative to the magnet array (10). By varying an angle of a three-phase current supplied to a specific one of three-phase coil assemblies in the motor rotor (20) within an angular range for magnetic alignment and measuring a force generated by the specific one of three-phase coil assemblies using the force sensor (40), an angle of magnetic alignment for the specific one of three-phase coil assemblies is determinable based on the angle of three-phase current that causes the specific one of three-phase coil assemblies to generate a maximum force.

Abstract: A focusing and leveling apparatus, including: an illumination light source (201) for emanating a light beam; an illumination lens group (202), a projecting unit, an object (209) being measured, a detecting unit, a refractive unit, a relay lens group and a photoelectric detector (220), disposed sequentially in this order in a transmission path of the light beam. The projecting unit includes projection slits (203) defining a plurality of non-linearly arranged marks, such that after passing sequentially through the illumination lens group (202), the projecting unit, the object (209) being measured and the detecting unit, the light beam emanated by the illumination light source (201) becomes a plurality of non-linearly arranged sub-beams corresponding to the plurality of marks. The refractive unit is so configured that after passing through the refractive unit, the plurality of sub-beams form a plurality of linearly arranged light spots.

Abstract: A silicon wafer edge protection device having: a horizontal motion assembly; vertical motion assembly; speed regulating device, which is in signal connection with the vertical motion assembly and used for regulating vertical motion assembly motion speed; flexible bumper assembly, which is connected to the horizontal motion assembly and vertical motion assembly and used for reducing the amplitude of vibration of the silicon wafer edge protection device when a collision occurs; and control device, which is in signal connection with the speed regulating device and used for sending a control signal to the speed regulating device to control motion of the vertical motion assembly. The silicon wafer edge protection device can prevent a wafer stage from undergoing an instantaneous strong impact and prevent a silicon wafer from being crushed. When a collision occurs, the wafer stage and the silicon wafer can be protected. Production efficiency is also improved.

Abstract: A device including a light source, illumination system, objective lens, and detector. The light source produces measurement light beams, the illumination system directs measurement light beams into the objective lens, and the objective lens directs measurement light beams onto an overlay marker, collects main maximums of diffracted light beam diffracted from the overlay marker, and focuses main maximums of diffracted light beam onto a pupil plane of the objective lens. The detector is positioned on the pupil plane of the objective lens and used for detecting the position of each main maximums of diffracted light beam on the detector, to obtain the overlay error of said overlay marker. Diffracted-light position information is used to measure overlay error, and measurement signals are not affected by illumination uniformity, transmissivity uniformity, etc.

Abstract: Disclosed is an adaptive groove focusing and leveling device for measuring the height and the inclination of the surface of a measured object (400).

Abstract: A reticle shape regulation device includes: an adsorption device having an upper surface and a lower surface; and a limit mechanism having a limit surface. The adsorption device is movable relative to the limit mechanism at least in a vertical direction. The upper surface of the adsorption device faces toward and is engagable with the limit surface. The lower surface of the adsorption device defines a vacuum chamber that is configured for communication with a negative-pressure source so as to adsorb the reticle by a negative pressure. The lower surface of the adsorption device further defines at least one positive-pressure outlet that is in communication with a positive-pressure source and is configured to supply a continuous positive-pressure air flow between the lower surface of the adsorption device and the reticle during the adsorption of the reticle.