Abstract: A bitline reference voltage circuit according to the present invention includes a first transistor having a current path coupled between a first bitline and an intermediate node, and a gate for receiving a first control signal, a second transistor having a current path coupled between a second bitline and the intermediate node, and a gate for receiving a second control signal, a third transistor having current path coupled between the intermediate node and a source of constant voltage, and a gate for receiving a third control signal, and a capacitor coupled between the intermediate node and the source of constant voltage.

Abstract: A circuit and method reduces the number of nodes that must be forced during a standby mode when using clocked latches. The circuit and method can be used for half-cycle latches and full cycle latches in conjunction with alternate power-gated circuitry, even when many stages are cascaded in a pipeline structure. The data state on a single forcing node can be passed through one or more cascaded latch stages as well as through additional circuitry. By forcing latch transmission gates to be conductive during standby mode, multiple stages can be set to a specific state, as determined by an earlier stage being set by a forcing transistor. A clock generation. circuit and method is also provided for controlling transmission gates within the latches.

Abstract: A non-clocked data-in path in an integrated circuit device incorporating a random access memory array allows data written to the array to ripple through to all banks all the way up to the local write circuitry. This allows for the fastest writes possible to the array since there are no additional clocking registers to slow down the data flow.

Abstract: An optimized read data amplifier for the output data path of integrated circuit memory arrays comprises a fast, low power and small on-chip area consuming circuit which is advantageously effectuated through the combined application of “current sensing” and “voltage sensing” techniques. In a particular embodiment disclosed herein, an amplifier enable signal is timed with the column read address so that the amplifier is turned “off” when not in use and both data read lines (“DR” and “DRB”) are precharged “high”. No clocking of the read data amplifier is required in order to obviate undesired clock latencies and pipelining and a simple mechanism is implemented such that control of power-up and power-down results in further power savings.

Abstract: An integrated and constantly enabled on-chip test interface for use in verifying the functionality of high speed embedded memories such as synchronous dynamic random access memories (“SDRAM”) which allows for the utilization of existing, relatively low speed, (and hence low cost), testers to perform the testing. The interface allows for the verification of an embedded memory macro design utilizing a test interface which includes the memory macro and separate on-chip test circuitry so that half-rate, narrow word, input signals from a tester can perform all memory macro operations across the breadth of a wide memory macro input/output (“I/O”) architecture. The on-chip test circuitry may also include a synchronizing circuit to minimize skew between the external clock and the data output from the test chip.

Abstract: A high voltage transistor protection technique and switching circuit of especial applicability to integrated circuit devices utilizing multiple power supply voltages. In accordance with the technique of the present intention, the problems inherent in the amount of on-chip die area consumed and speed degradation of prior art circuit implementations are overcome by furnishing a substantially direct current voltage VHVP to the gate of a first transistor of a series connected thin gate oxide pair wherein VHVP≦VDSMAX (the maximum gate-to-source voltage of the first transistor) and VHVP≦VDSMAX+Vt (the maximum drain-to-source voltage of the second transistor plus the threshold voltage of the first transistor).

Abstract: A refresh initiated precharge technique using look-ahead refresh eliminates the need to close banks in a dynamic random access memory (“DRAM”) array prior to executing a “refresh” command by taking advantage of the fact that the actual initiation of an internal “refresh” operation is delayed by at least one clock cycle from the execution of the external “refresh” command. The technique is effectuated through the issuance of a “refresh” command to cause all banks within the DRAM array to precharge. This precharge occurs prior to the n-cycle delay (where N=1 or more clock cycles) of the internal “refresh” operation.

Abstract: A data bus architecture for integrated circuit embedded dynamic random access memory having a large aspect ratio serves to reduce power requirements in the data path through the use of multiple metal layers to reduce capacitance on the data busses. The memory is divided into multiple sections with data bussing in those sections routed in one metal, or conductive, layer. A different metal layer is used to route global data across these sections to a data register located on one edge of the memory. These global data lines are double data rate and single-ended which increases the physical spacing of these lines thereby reducing capacitance and power requirements. Each of the global data lines are routed to only one of the memory sections. This results in the average length of these lines being less than the length of the entire memory, which reduces the capacitance of the lines.

Abstract: A simultaneous function dynamic random access memory (“DRAM”) technique of particular applicability to DRAMs, synchronous DRAMs (“SDRAM”), specialty DRAMs, embedded DRAMs, embedded SDRAMs and the like which enables the execution of “read”, “write”, “active” and “precharge” commands on a single clock cycle. The technique of the present invention is of especial applicability to embedded memory arrays or specialty DRAMs where the number of input signals to the DRAM are not necessarily limited by mechanical component packaging constraints or component pin counts. In general, the advantages of the technique are obtained through the use of separate address fields, including bank addresses, for “read” and “write” commands, and separate bank addresses for “active” and “precharge” commands with a resultant highly parallel operational functionality.

Abstract: A data path decoding technique and architecture for integrated circuit memory devices and those devices incorporating embedded dynamic random access memory (“DRAM”) arrays provides an effective second level of decoding resulting in a need for routing fewer column select lines to the sense amplifiers as compared with existing designs while concomitantly providing for shortened local data lines resulting in less undesired resistance and capacitance. The technique and architecture of the present invention requires no additional on-chip area to that required by existing designs and adds no new gate delays or pass gates to the critical read data or write data paths. This is effectuated by the incorporation of an address function with the read/write enable (“RWEN”) or separate read enable (“REN”) and write enable (“WEN”) signals. Consequently, half as many column select lines need be routed to the sense amplifiers since a second level of column decoding is provided.

Abstract: A data path decoding technique and architecture for integrated circuit memory devices and those devices incorporating embedded dynamic random access memory (“DRAM”) arrays provides an effective second level of decoding resulting in a need for routing fewer column select lines to the sense amplifiers as compared with existing designs while concomitantly providing for shortened local data lines resulting in less undesired resistance and capacitance. The technique and architecture of the present invention requires no additional on-chip area to that required by existing designs and adds no new gate delays or pass gates to the critical read data or write data paths. This is effectuated by the incorporation of an address function with the read/write enable (“RWEN”) or separate read enable (“REN”) and write enable (“WEN”) signals. Consequently, half as many column select lines need be routed to the sense amplifiers since a second level of column decoding is provided.

Abstract: A circuit and method for an integrated circuit memory incorporates a look-ahead function where refresh commands are presented to the device at least one cycle before actual internal refresh operations occur. Active cycles are executed on the same clock as the external command is applied. Active commands are unaltered and are executed on the same clock cycle as the occurrence of the active command. Active commands can be executed immediately without waiting to determine if the row address latch is to be sourced externally or internally.

Abstract: A method for loading an integrated circuit FIFO at extremely high operating frequencies includes providing N logical locations, providing N+1 transparent latch stages, and providing N+1 write pointers, wherein two write pointers are contemporaneously enabled during a FIFO load operation. The method can be extended to enable three or more write pointers for even higher frequency operation.

Abstract: An automatic delay technique for early “read” and “write” memory access operations in synchronous dynamic random access memory (“SDRAM”) devices and those integrated circuit devices employing embedded SDRAM arrays. A circuit and method is provided which controls the internal column select (“Yi”) and data signals such that the column address strobe (“/CAS”) signal is allowed to go “active” in advance of that otherwise possible in conjunction with conventional SDRAM arrays. In an exemplary embodiment, the column select signals (“read” or “write”) are delayed until either the corresponding, pre-decoded column address signal or the respective column clock signal is valid, whichever occurs later.

Abstract: A switching circuit incorporating a high voltage transistor protection technique for use in an integrated circuit device having dual voltage supplies which extends the maximum pumped voltage (“VCCP”) for reliable MOS transistor operation to VCCP=VTN+(2*VCC), where VTN is the threshold voltage of the transistor and VCC is the supply voltage level. This is effectuated by adding an additional relatively thick gate oxide transistor in series with the relatively thin gate oxide MOS N-channel transistors in a conventional high voltage switching circuit to increase the reliable maximum voltage for the high voltage power supply.

Abstract: A pre-charge and reference voltage technique operates on a DRAM memory array in which two additional rows of reference cells are added to the array. When the array starts the pre-charge cycle, the regular word line and latch P-channel bar signals both turn off and the complementary bit line pair is shorted together. These two lines charge share to create a half way voltage level (VCC/2) that is restored into the reference cell. After this voltage is restored into the reference cell, the bit lines are fully pre-charged to ground.

Abstract: A base cell for a gate array or standard cell integrated circuit design has N and P wells organized in checkerboard fashion, each well containing several P and N devices respectively. A first of the plurality of relatively deep P regions is adjacent to at least a first and a second of the plurality of relatively deep N regions. The first relatively deep N region is adjacent to the first relatively deep P region along a first edge of the first relatively deep N region, and to the second relatively deep P region along a second edge of the relatively deep N region. The first and second edges of the relatively deep N region are perpendicular. An array of the base cells therefore has a checkerboard pattern, unlike the striped pattern of typical gate array and standard cell designs. The array of the base cells is amenable to minimizing clock parasitic capacitance when clocked inverters, including the complimentary clocked inverters of latches, are laid out at vertexes of the checkerboard pattern.

Abstract: A sense amplifier design for DRAM devices (as well as those incorporating embedded DRAM) which provides improved read and write speed without requiring the use of an extra signal line to the gate of a transistor coupling the sense amplifier latch nodes to the associated bit lines. In accordance with the present invention, an additional circuit element is added between the latch nodes and the bit lines which serves as a resistive path therebetween. Functionally, this additional circuit element serves to isolate the latch nodes from the relatively large bit line capacitance during a write operation such that the latch nodes can change state more quickly. These additional circuit elements may take the form of N-channel transistors having their gate tied to a pumped voltage level VCCP, resistors, various configurations of depletion transistors or CMOS pass gates.

Abstract: A small signal, low power read data bus driver for integrated circuit devices incorporating memory arrays which advantageously utilizes non-precharged data lines and reduced output voltage swing to reduce power requirements, tri-stateable outputs to allow several circuits to be multiplexed on the same data line and provides a buffer between the sense amplifier and the data lines to improve data line switching speed.

Abstract: A negative voltage driver circuit having reduced current flow to the negative supply voltage source and improved reliability comprises first, second and third series coupled switching devices defining an output and intermediate nodes therebetween respectively for coupling a high voltage source to a reference voltage level. Control terminals of the first and second switching devices are coupled to a first circuit node and a control terminal of the third switching device is coupled to a second circuit node. A fourth switching device is coupled between the lower intermediate node and a negative voltage source, with a control terminal of the fourth switching device being coupled to a third circuit node. In operation, the first circuit node is activated, followed sequentially by the second and third circuit nodes, the second circuit node being deactivated substantially concurrently with the activation of the third circuit node.