Abstract: For example, a wireless communication device may be configured to determine an expected interference-based value corresponding to an Uplink (UL) transmission from a wireless communication station (STA) in a Trigger-Based (TB) Multi-User (MU) UL transmission to be communicated from a plurality of STAs to the wireless communication device; to determine one or more transmit (Tx) configuration parameters for the STA based on the expected interference-based value corresponding to the UL transmission from the STA; and to transmit a trigger frame to trigger the TB MU UL transmission, the trigger frame including the one or more Tx configuration parameters to configure the UL transmission from the STA.

Abstract: Processor trace systems and methods are described. For example, one embodiment comprises executing instrumented code by a compiler, the instrumented code including at least one call to un-instrumented code. The compiler can determine the at least one call to un-instrumented code is a next call to be executed. A resume tracing instruction can be inserted into the instrumented code prior to the at least one call to the un-instrumented code. The resume tracing instruction can be executed to selectively add processor tracing to the at least one call to the un-instrumented code, and the at least one call to the un-instrumented code can be executed.

Abstract: In one embodiment, an apparatus comprises circuitry, wherein the circuitry is configured to: receive, via a communications network, context information for a first set of one or more edge devices, wherein the context information identifies an operating environment of the first set of edge devices based on information from one or more sensors; receive, via the communications network, workload information for a second set of one or more edge devices; determine workload assignments for the first set of edge devices based on the context information for the first set of edge devices and based on the workload information for the second set of edge devices; and transmit, via the communications network, the workload assignments to the first set of edge devices.

Abstract: An integrated circuit structure comprises one or more fins extending above a surface of a substrate over an N-type well. A gate is over and in contact with the one or more fins. A second shallow N-type doping is below the gate and above the N-type well.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

Abstract: A semiconductor chip providing on-chip self-testing of an Analog-to-Digital Converter, ADC, implemented in the semiconductor chip is provided. The semiconductor chip comprises the ADC and a Digital-to-Analog Converter, DAC, configured to generate and supply a radio frequency test signal to the ADC via a supply path. The ADC is configured to generate digital output data based on the radio frequency test signal. The semiconductor chip further comprises a reference data generation circuit configured to generate digital reference data. Additionally, the semiconductor chip comprises a comparator circuit configured to compare the digital output data to the digital reference in order to determine error data.

Abstract: Various embodiments generally may relate to Load Balancing Optimization (LBO) and Mobility Robustness Optimization (MRO). Some embodiments of this disclosure are directed to the following 5G SON solutions: use cases and requirements for the management of distributed LBO and centralized LBO; procedures for the management of distributed LBO and centralized LBO; and management services and information needed to support the management of distributed LBO and centralized LBO.

Abstract: Techniques are provided for detection of laser-based audio injection attacks. A methodology implementing the techniques according to an embodiment includes calculating cross correlations between signals received from microphones of an array of two or more microphones. The method also includes identifying time delays associated with peaks of the cross correlations, and magnitudes associated with the peaks of the cross correlations. The method further includes calculating a time alignment metric based on the time delays and calculating a similarity metric based on the magnitudes. The method further includes generating a first attack indicator based on a comparison of the time alignment metric to a first threshold and generating a second attack indicator based on a comparison of the similarity metric to a second threshold. The method further includes providing warning of a laser-based audio attack based on the first attack indicator and/or the second attack indicator.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a P-type semiconductor device above a substrate and including first and second semiconductor source or drain regions adjacent first and second sides of a first gate electrode. A first metal silicide layer is directly on the first and second semiconductor source or drain regions. An N-type semiconductor device includes third and fourth semiconductor source or drain regions adjacent first and second sides of a second gate electrode. A second metal silicide layer is directly on the third and fourth semiconductor source or drain regions, respectively. The first metal silicide layer comprises at least one metal species not included in the second metal silicide layer.

Abstract: Disclosed embodiments provide a handover prediction scheme that is based on contextual awareness of a compute node, such as a mobile device. The contextual information is used to predict network availability in a predicted target location, which is an area that a compute node is likely to travel. The use of sensors embedded in or accessible by the compute node may be used to carry out aspects of the embodiments. A reinforcement learning recommendation model is used to determine an optimal network, radio access technology, and/or network access node to connect with ahead of arriving at the predicted target location at a predicted arrival time. Other embodiments are described and/or claimed.

Abstract: Systems, apparatuses and methods may provide for a frontend driver that notifies a hypervisor of a map request from a guest driver of a device, wherein the device is passed through to and directly controlled by a virtual machine, and wherein the map request is associated with an attempt of the device to access a guest memory page in a virtualized execution environment. The frontend driver may also determine whether the guest memory page is pinned and send a map hypercall to the hypervisor if the guest memory page is not pinned. Additionally, the hypervisor may determine that the guest memory page is pinned, determine, based on a direct memory access (DMA) bitmap, that an unmap request from the guest driver has been issued, and unpin the guest memory page.

Abstract: An apparatus and system to enable dynamic offloading and execution of compute tasks are described. In split CU-DU RAN architectures, the CU-CP is connected with multiple compute control functions (CF) and service functions (SF) that have different computing hardware/software capabilities. Different architectures depend on whether the SF is collocated with the CU-UP, the CU-UP and SF only serve compute messages, a compute message is supplied directly to the CU-UP or also traverses the CU-CP. In response to reception from a UE of a compute message containing data for computation being sent to the CU-CP through the DU, the CU-CP sends the data to the SF with identifiers and sends the result to the UE.

Abstract: Methods, apparatus, and computer platforms and architectures employing many-to-many and many-to-one peripheral switches. The methods and apparatus may be implemented on computer platforms having multiple nodes, such as those employing a Non-uniform Memory Access (NUMA) architecture, wherein each node comprises a plurality of components including a processor having at least one level of memory cache and being operatively coupled to system memory and operatively coupled to a many-to-many peripheral switch that includes a plurality of downstream ports to which NICs and/or peripheral expansion slots are operatively coupled, or a many-to-one switch that enables a peripheral device to be shared by multiple nodes. During operation, packets are received at the NICs and DMA memory writes are initiated using memory write transactions identifying a destination memory address.

Abstract: An extremely high-throughput (EHT) station (STA) may encode an EHT PPDU for transmission on a plurality of subchannels. The EHT STA may determine a spectral mask to apply to the EHT PPDU prior to transmission of the EHT PPDU. When preamble puncturing is performed, the EHT STA may apply an overall spectral mask to the EHT PPDU prior to transmission. The overall spectral mask may be based on an interim spectral mask and a preamble-puncture spectral mask. The subchannels may be in a 6 GHz band and the EHT STA may determine if preamble puncturing is to be performed for one or more of the subchannels based on a presence of incumbents in the one or more of the subchannels, although the scope of the embodiments is not limited in this respect.

Abstract: Techniques related to packing pieces of data having variable bit lengths to serial packed data using a graphics processing unit and a central processing unit are discussed. Such techniques include executing bit shift operations for the pieces of data in parallel via execution units of the graphics processing unit and packing the bit shifted pieces of data via the central processing unit.

Abstract: Systems and methods described herein may relate to providing a dynamically configurable circuitry able to be programed using a microsector granularity. Furthermore, selective partial reconfiguration operations may be performed use write operations to write a new configuration over existing configurations to selectively reprogram a portion of programmable logic. A quasi-delay insensitive (QDI) shift register and/or control circuitry receiving data and commands from an access register disposed between portions of programmable logic may enable at least some of the operations described.

Abstract: In an embodiment, a processor comprises: an execution circuit to execute instructions; at least one cache memory coupled to the execution circuit; and a table storage element coupled to the at least one cache memory, the table storage element to store a plurality of entries each to store object metadata of an object used in a code sequence. The processor is to use the object metadata to provide user space multi-object transactional atomic operation of the code sequence. Other embodiments are described and claimed.

Abstract: One embodiment provides for a graphics processing unit comprising a processing cluster to perform multi-rate shading via coarse pixel shading and output shaded coarse pixels for processing by a post-shader pixel processing pipeline.

Abstract: Folded integer multiplier (FIM) circuitry includes a multiplier configurable to perform multiplication and a first addition/subtraction unit and a second addition/subtraction unit both configurable to perform addition and subtraction. The FIM circuitry is configurable to determine each product of a plurality of products for a plurality of pairs of input values having a first number of bits by performing, using the first and second addition/subtraction units, a plurality of operations involving addition or subtraction, and performing, using the multiplier, a plurality of multiplication operations involving values having fewer bits than the first number of bits. The plurality of multiplication operations includes a first number of multiplication operations, and the multiplier is configurable to begin performing all multiplication operations of the plurality of multiplication operations within a first number of clock cycles equal to the first number of multiplication operations.

Abstract: A computer-readable storage medium stores instructions for execution by one or more processors of a UE. The instructions configure the UE for small data transmission (SDT) in a 5G NR network and cause the UE to perform operations comprising detecting while in an RRC_Inactive state, a radio link failure during a first SDT of UL data to a base station. A secure key for a second SDT is generated based on the radio link failure. A configuration message including an indication of the second SDT is transmitted to the base station. A response message including a UL grant is received from the base station. The UL data is encoded for the second SDT using the secure key. The second SDT is performed using the UL grant while the UE is in the RRC_Inactive state.

Abstract: Described herein is a cloud-based gaming system in which graphics processing operations of a cloud-based game can be performed on a client device. Client-based graphics processing can be enabled in response to a determination that the client includes a graphics processor having a performance that exceeds a minimum threshold. When a game is remotely executed and streamed to a client, the client is configurable to provide network feedback that can be used to adjust execution and/or encoding for the game.

Abstract: Methods, systems and apparatuses may provide for technology that triggers an idle state in a first command streamer in response to a request to reset a second command streamer that shares graphics hardware with the first command streamer. The technology may also determine an event type associated with the request and conduct the request based on the event type.

Abstract: An embodiment of the invention is a processor including execution circuitry to calculate, in response to a decoded instruction, a result of a complex multiplication of a first complex number and a second complex number. The calculation includes a first operation to calculate a first term of a real component of the result and a first term of the imaginary component of the result. The calculation also includes a second operation to calculate a second term of the real component of the result and a second term of the imaginary component of the result. The processor also includes a decoder, a first source register, and a second source register. The decoder is to decode an instruction to generate the decoded instruction. The first source register is to provide the first complex number and the second source register is to provide the second complex number.

Abstract: Methods and apparatus for scalable MCTP infrastructure. A system is split into independent MCTP domains, wherein each MCTP domain uses Endpoint Identifiers (EIDs) for endpoint devices within the MCTP domain in a manner similar to conventional MCTP operations. A new class of MCTP devices (referred to as a Domain Controllers) is provided to enable inter-domain communication and communication with global devices. Global traffic originators or receivers like a BMC (Baseboard Management Controller), Infrastructure Processing Unit (IPU), Smart NIC (Network Interface Card), Debugger, or PROT (Platform Root or Trust) discover and establish two-way communication through the Domain Controllers to any of the devices in the target domain(s). The Domain Controllers are configured to implement tunneled connections between global devices and domain endpoint devices.

Abstract: Graphics processors for implementing multi-tile memory management are disclosed. In one embodiment, a graphics processor includes a first graphics device having a local memory, a second graphics device having a local memory, and a graphics driver to provide a single virtual allocation with a common virtual address range to mirror a resource to each local memory of the first and second graphics devices.

Abstract: Technologies for fast boot-up of a compute device with error-correcting code (ECC) memory are disclosed. A basic input/output system (BIOS) of a compute device may assign memory addresses of the ECC memory to different processors on the compute device. The processors may then initialize the ECC memory in parallel by writing to the ECC memory. The processors may write to the ECC memory with direct-store operations that are immediately written to the ECC memory instead of being cached. The BIOS may continue to operation on one processor while the rest of the processors initialize the ECC memory.

Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first isolation structure over a first end of a fin. A gate structure is over the fin and is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end. The second isolation structure is spaced apart from the gate structure. The first isolation structure and the second isolation structure both comprise a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material. The recessed second dielectric material laterally surrounds at least a portion of a third dielectric material different from the first and second dielectric materials.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to debug a hardware accelerator such as a neural network accelerator for executing Artificial Intelligence computational workloads. An example apparatus includes a core with a core input and a core output to execute executable code based on a machine-learning model to generate a data output based on a data input, and debug circuitry coupled to the core. The debug circuitry is configured to detect a breakpoint associated with the machine-learning model, compile executable code based on at least one of the machine-learning model or the breakpoint. In response to the triggering of the breakpoint, the debug circuitry is to stop the execution of the executable code and output data such as the data input, data output and the breakpoint for debugging the hardware accelerator.

Abstract: Embodiments are directed to providing integrity-protected command buffer execution. An embodiment of an apparatus includes a computer-readable memory comprising one or more command buffers and a processing device communicatively coupled to the computer-readable memory to read, from a command buffer of the computer-readable memory, a first command received from a host device, the first command executable by one or more processing elements on the processing device, the first command comprising an instruction and associated parameter data, compute a first authentication tag using a cryptographic key associated with the host device, the instruction and at least a portion of the parameter data, and authenticate the first command by comparing the first authentication tag with a second authentication tag computed by the host device and associated with the command.

Abstract: One embodiment provides a graphics processor comprising a set of processing resources configured to perform a supersampling anti-aliasing operation via a mixed precision convolutional neural network. The set of processing resources include circuitry configured to receive, at an input block of a neural network model, a set of data including previous frame data, current frame data, jitter offset data, and velocity data, pre-process the set of data to generate pre-processed data, provide pre-processed data to a feature extraction network of the neural network model and an output block of the neural network model, process the first pre-processed data at the feature extraction network via one or more encoder stages and one or more decoder stages, output tensor data from the feature extraction network to the output block, and generate an anti-aliased output frame via the output block based on the current frame data and the tensor data output from the feature extraction network.

Abstract: Technologies for a field effect transistor (FET) with a ferroelectric gate dielectric are disclosed. In an illustrative embodiment, a perovskite stack is grown on a buffer layer as part of manufacturing a transistor. The perovskite stack includes one or more doped semiconductor layers alternating with other lattice-matched layers. Growing the doped semiconductor layers on lattice-matched layers can improve the quality of the doped semiconductor layers. The lattice-matched layers can be etched away, leaving the doped semiconductor layers as fins for a ribbon FET. A ferroelectric layer can be conformally grown on the fins, creating a high-quality ferroelectric layer above and below the fins. A gate can then be grown on the ferroelectric layer.

Abstract: An example apparatus to perform a convolution on an input tensor includes a parameters generator to: generate a horizontal hardware execution parameter for a horizontal dimension of the input tensor based on a kernel parameter and a layer parameter; and generate a vertical hardware execution parameter for a vertical dimension of the input tensor based on the kernel parameter and the layer parameter; an accelerator interface to configure a hardware accelerator circuitry based on the horizontal and vertical hardware execution parameters; a horizontal Iterator controller to determine when the hardware accelerator circuitry completes the first horizontal iteration of the convolution; and a vertical Iterator controller to determine when the hardware accelerator circuitry completes the first vertical iteration of the convolution.

Abstract: One or more non-transitory computer-readable media with instructions stored thereon, wherein the instructions are executable to cause one or more processor units to responsive to a data clear command issued by a tenant of a cloud service provider, issue a plurality of write commands to storage locations utilized by the tenant, the write commands to write a value based on an input provided by the tenant to the storage locations; and provide data read from at least a subset of the storage locations for attestation by the tenant of performance of the data clear command.

Abstract: Embodiments of apparatuses, methods, and systems for selective use of branch prediction hints are described. In an embodiment, an apparatus includes an instruction decoder and a branch predictor. The instruction decoder is to decode a branch instruction having a hint. The branch predictor is to provide a prediction and a hint-override indicator. The hint-override indicator is to indicate whether the prediction is based on stored information about the branch instruction. The prediction is to override the hint if the hint-override indicator indicates that the prediction is based on stored information about the branch instruction.

Abstract: A method and system of automatically estimating a ball carrier in team sports.

Abstract: For example, a wireless communication device may be configured to determine a Concurrent Multiple Band (CMB) routing scheme based on Quality of Service (QoS) requirement information and network condition information, the CMB routing scheme to route a plurality of application streams to a plurality of radios of the wireless communication device for wireless communication over a plurality of wireless communication bands, the plurality of application streams corresponding to one or more applications to be executed by the wireless communication device; and to route the plurality of application streams to the plurality of radios by determining, based on the CMB routing scheme, to which radio of the plurality of radios to route the application stream of the plurality of application streams.

Abstract: Embodiments of a microelectronic assembly includes: a package substrate and an integrated circuit (IC) die coupled to a surface of the package substrate by first interconnects and second interconnects, the first interconnects and the second interconnects comprising solder. The first interconnects are larger than the second interconnects, the first interconnects and the second interconnects further comprise bumps on the IC die and bond-pads on the surface of the package substrate, with the solder coupled to the bumps and the bond-pads, lateral sides of the bumps have a coating of a material that prevents solder wicking, and the surface of the package substrate includes insulative baffles between the bond-pads.

Abstract: An electronic device includes first and second external conductive pads coupled to route a first signal and third and fourth external conductive pads. The third and the fourth external conductive pads are between the first and the second external conductive pads on a surface of the electronic device.

Abstract: Lined photoresist structures to facilitate fabricating back end of line (BEOL) interconnects are described. In an embodiment, a hard mask has recesses formed therein, wherein liner structures are variously disposed each on a sidewall of a respective recess. Photobuckets comprising photoresist material are also variously disposed in the recesses. The liner structures variously serve as marginal buffers to mitigate possible effects of misalignment in the exposure of photoresist material to photons or an electron beam. In another embodiment, a recess has disposed therein a liner structure and a photobucket that are both formed by self-assembly of a photoresist-based block-copolymer.

Abstract: An embodiment of an electronic processing system may include an application processor, persistent storage media communicatively coupled to the application processor, and a graphics subsystem communicatively coupled to the application processor. The graphics subsystem may include a first graphics engine to process a graphics workload, and a second graphics engine to offload at least a portion of the graphics workload from the first graphics engine. The second graphics engine may include a low precision compute engine. The system may further include a wearable display housing the second graphics engine. Other embodiments are disclosed and claimed.

Abstract: Disclosed embodiments relate to systems and methods for performing instructions to transform matrices into a row-interleaved format. In one example, a processor includes fetch and decode circuitry to fetch and decode an instruction having fields to specify an opcode and locations of source and destination matrices, wherein the opcode indicates that the processor is to transform the specified source matrix into the specified destination matrix having the row-interleaved format; and execution circuitry to respond to the decoded instruction by transforming the specified source matrix into the specified RowInt-formatted destination matrix by interleaving J elements of each J-element sub-column of the specified source matrix in either row-major or column-major order into a K-wide submatrix of the specified destination matrix, the K-wide submatrix having K columns and enough rows to hold the J elements.

Abstract: Approaches based on differential hardmasks for modulation of electrobucket sensitivity for semiconductor structure fabrication, and the resulting structures, are described. In an example, a method of fabricating an interconnect structure for an integrated circuit includes forming a hardmask layer above an inter-layer dielectric (ILD) layer formed above a substrate. A plurality of dielectric spacers is formed on the hardmask layer. The hardmask layer is patterned to form a plurality of first hardmask portions. A plurality of second hardmask portions is formed alternating with the first hardmask portions. A plurality of electrobuckets is formed on the alternating first and second hardmask portions and in openings between the plurality of dielectric spacers. Select ones of the plurality of electrobuckets are exposed to a lithographic exposure and removed to define a set of via locations.

Abstract: Semiconductor packages, and methods for making the semiconductor packages, having an interposer structure with one or more interposer and an extension platform, which has an opening for placing the interposer, and the space between the interposer and the extension platform is filled with a polymeric material to form a unitary interposer-extension platform composite structure. A stacked structure may be formed by at least a first semiconductor chip coupled to the interposer and at least a second semiconductor chip coupled to the extension platform, and at least one bridge extending over the space that electrically couples the extension platform and the interposer. The extension platform may include a recess step section that may accommodate a plurality of passive devices to reduced power delivery inductance loop for the high-density 2.5D and 3D stacked packaging applications.

Abstract: A microelectronics package comprising a substrate, the substrate comprising a dielectric and at least first and second conductor level within the dielectric, where the first and second conductor levels are separated by at least one dielectric layer. The microelectronics package comprises an inductor structure that comprises a magnetic core. The magnetic core is at least partially embedded within the dielectric. The inductor structure comprises a first trace in the first conductor level, a second trace in the second conductor level, and a via interconnect connecting the first and second traces. The first trace and the second trace extend at least partially within the magnetic core.

Abstract: A scheme for restoring a password-protected endpoint device (e.g., a memory device) of a computer system to an operational state from a low power state without requiring user input of a device password. A password received for unlocking the device during a boot process is stored in a secure memory. The password-protected endpoint device subsequently enters the low power state, causing it to lock. During a transition from the low power state to an operational state, it is detected that the password for the endpoint device is stored in the secure memory. The password is fetched from the secure memory and used to unlock the endpoint device, thereby restoring the endpoint device to an operational state.

Abstract: Embodiments described herein provide techniques to enable the dynamic reconfiguration of memory on a general-purpose graphics processing unit. One embodiment described herein enables dynamic reconfiguration of cache memory bank assignments based on hardware statistics. One embodiment enables for virtual memory address translation using mixed four kilobyte and sixty-four kilobyte pages within the same page table hierarchy and under the same page directory. One embodiment provides for a graphics processor and associated heterogenous processing system having near and far regions of the same level of a cache hierarchy.

Abstract: Technologies for a high-voltage transmission gate are disclosed. In the illustrative embodiment, a companion chip is connected to a quantum processor. The companion chip provides voltages to gates of qubits on the quantum processor. The companion chip includes one or more high-voltage transmission gates that can be used to charge capacitors linked to gates of qubits on the quantum processor. The transmission gate includes transistors with a breakdown voltage less than a range of input and output voltages of the transmission gate. Control circuitry on the companion chip controls the voltages applied to transistors of the transmission gate to ensure that the voltage differences across the terminals of each transistor is below a breakdown voltage.

Abstract: Disclosed embodiments relate to systems for performing instructions to quickly convert and use matrices (tiles) as one-dimensional vectors. In one example, a processor includes fetch circuitry to fetch an instruction having fields to specify an opcode, locations of a two-dimensional (2D) matrix and a one-dimensional (1D) vector, and a group of elements comprising one of a row, part of a row, multiple rows, a column, part of a column, multiple columns, and a rectangular sub-tile of the specified 2D matrix, and wherein the opcode is to indicate a move of the specified group between the 2D matrix and the 1D vector, decode circuitry to decode the fetched instruction; and execution circuitry, responsive to the decoded instruction, when the opcode specifies a move from 1D, to move contents of the specified 1D vector to the specified group of elements.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of conductive interconnect lines in and spaced apart by a first ILD layer, wherein individual ones of the first plurality of conductive interconnect lines comprise a first conductive barrier material along sidewalls and a bottom of a first conductive fill material. A second plurality of conductive interconnect lines is in and spaced apart by a second ILD layer above the first ILD layer, wherein individual ones of the second plurality of conductive interconnect lines comprise a second conductive barrier material along sidewalls and a bottom of a second conductive fill material, wherein the second conductive fill material is different in composition from the first conductive fill material.