Abstract: A heat dissipation device includes a heat sink, a fan placed on a top of the heat sink for providing an airflow through the heat sink and a fan duct located at a side of the heat sink. The heat sink includes a plurality of upwardly extending first fins and a plurality of laterally extending second fins located below the first fins. A plurality of first airflow channels are defined in the adjacent first fins and a plurality of second airflow channels are defined in the adjacent second fins. The fan duct guides a significant part of the airflow produced by the fan to the second airflow channels from a lateral side of the heat sink to have a sufficient contact with the second fins of the heat sink.

Abstract: A tube shield assembly for protecting tubes includes a guard, a securing member and a holding tooth, wherein welding is not required to secure the guard to the tube. The guard is axially elongated and can have a semi-cylindrical cross-section to define a main body portion. The securing member includes at least one pair of fastening clips to secure the guard to the tube. The fastening clips permit radial expansion and contraction of the tube and the tube shield assembly in response to, for example, temperature fluctuations. The holding tooth is a tooth-like protrusion between the tube shield assembly and the tube to which it is secured to prevent axial slippage of the tube shield assembly up or down the length of the tube.

Abstract: A heat sink having a very high heat transfer capability may be made from a plurality of unit elements. Each unit element includes a series of inlet tubes having a range of diameters and a series of outlet tubes also having a range of diameters. At least one inlet tube having a minimum inlet tube diameter may be in flow communication with at least one outlet tube having a minimum outlet tube diameter.

Abstract: A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof.

Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.

Abstract: Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

Abstract: A two fluid thermal storage device that may allow for independent heating and cooling includes a plurality of plate members with a set of dividers brazed between two of them. The set of dividers, which may define a series of passageways therein, may include a first sub-series of alternate passageways filled with a phase change material, and a second sub-series of remaining passageways that transports a fluid, the remaining passageways alternating between transporting a cooling fluid through a first fluid circuit and transporting a heating fluid through a second and independent fluid circuit. The remaining passageways that transport the cooling fluid through the first fluid circuit are defined by a first subset of dividers and the remaining passageways that transport the heating fluid through the second fluid circuit are defined by a second subset of dividers.

Abstract: A protective device (10) for protecting thermal interface material (30) spread on a central surface (512) of a bottom of a base (51) of a heat sink (50). The device includes a case (12) and a tab (18) extending from an edge of the case. The heat sink (50) has air channels (552) extending vertically therethrough and around the base. The case comprises an annular frame (120) and a cap (15) protruding downwardly from inside edges of the frame. The cap covers the thermal interface material. The frame is attached to the heat sink around the thermal interface material. The frame blocks portions of the air channels adjacent to the base, thereby to prevent dust or foreign particles from contaminating the thermal interface material through the air channels.

Abstract: A heat exchanger for a fluid handling system is disclosed. The heat exchanger may have an inlet configured to receive a fluid at a first temperature, and an outlet configured to discharge the fluid at a second temperature lower than the first. The heat exchanger may also have at least one fluid passageway disposed to conduct the fluid from the inlet to the outlet. The at least one fluid passageway may have a first section fabricated from a first material, and a second section fabricated from a dissimilar second material. At least one of the first and second materials may include a thermally conductive polymer.

Abstract: Provided is a loop type micro heat transport device including: a lower plate having a reservoir for storing operating fluid at its upper surface, an evaporating part spaced apart from the reservoir to evaporate the operating fluid, and a condensing part for condensing vapor evaporated from the evaporating part; and an upper plate engaged with an upper surface of the lower plate and formed at a position corresponding to the evaporating part and the condensing part, and including a vapor space having a vapor line through which the vapor evaporated from the evaporating part is transported to the condensing part, wherein the operating fluid is circulated through the reservoir, the evaporating part, and the condensing part. Therefore, it is possible to remarkably improve productivity since its simple structure helps to make the manufacture simple, as well as to improve cooling performance and enabling long distance heat transport.

Abstract: A heat exchanger includes a plurality of multi-channel heat exchange tubes extending between spaced inlet and outlet headers. Each heat exchange tube has a plurality of flow channels defining discrete flow paths extending longitudinally in parallel relationship from its inlet end to its outlet end. The inlet header has a channel for receiving a two-phase fluid from a fluid circuit and a chamber for collecting the fluid. The chamber has an inlet in flow communication with the channel and an outlet in flow communication with the plurality of fluid flow paths of the heat exchange tubes. The channel defines a relatively high turbulence flow passage that induces uniform mixing of the liquid phase refrigerant and the vapor phase fluid and reduces potential stratification of the vapor phase and the liquid phase within the fluid passing through the header.

Abstract: A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.

Abstract: A mini-sized heat-dissipating module includes a miniature heat-dissipating plate and a miniature fan unit. The miniature heat-dissipating plate has an assembling area, at least one airflow channel and at least one engaging portion. The assembling area and the airflow channel are provided on a top surface of the miniature heat-dissipating plate, wherein the assembling area is arranged at an end of the airflow channel. The miniature fan unit has an air inlet, an air outlet, a fan wheel and at least one engaging portion. The engaging portion of the miniature fan unit is engaged with that of the miniature heat-dissipating plate when assembled. An adhesive layer is further provided to combine the miniature fan unit with the miniature heat-dissipating plate.

Abstract: The present invention has its object to provide a heat exchanger with plastic tanks type, wherein a seal member is regularly compressed and hooks or tabs of header core crimped in a uniform fashion. Deformations predominantly located in the large sides or sides adjacent to the tank foot of the header, are formed and distributed in the inner or outer wall. The deformations in the periphery, or more particular, on the outside of the header wall, are formed after the brazing process.

Abstract: A combined assembly of a fixing base and heat pipes includes a fixing base and at least one heat pipe. The fixing base has a plate body. The bottom surface of the plate body is formed with a transverse opening trough. The opening trough is provided with a through-hole penetrating the plate body. A longitudinal groove is provided in the opening trough at a position corresponding to that of the through-hole. One end of the longitudinal groove does not penetrate the plate body and is formed into a loose-proof section on the bottom section of the opening trough. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-releasing section penetrates to the outside of the through-hole, and the heat-absorbing section is accommodated in the opening trough. A portion of the heat-absorbing section is inserted into the longitudinal groove and stopped by the loose-proof section, and the other portion thereof is formed with a plane that is in flush with the bottom surface of the plate body.

Abstract: A heat exchanger has a pair of heat exchange conduits having adjacent primary heat exchange surfaces thermally coupled together for the transfer of heat energy between the conduits. A third fluid conduit has a primary heat transfer surface thermally coupled to the primary heat transfer surfaces of the pair of fluid conduits, so that heat can be transferred between any one of the fluid conduits and each of the other fluid conduits.

Abstract: A cold and/or heat accumulator with a plurality of carrier elements which are charged with a cold or heat storage medium, and with at least one heat exchanger which is designed to have a heat transfer medium flow through it in order to cause heat exchange between the cold or heat storage medium and the heat transfer medium. The at least one heat exchanger has a serpentine hollow section, and carrier elements are provided between the legs of the loops of the serpentine hollow section. Two heat exchangers can be provided with the loops of the serpentine hollow section one heat exchanger being interspersed with those of the serpentine hollow section of the other heat exchanger. Preferably, the carrier elements are made of a porous metal foam, and the inlet and outlet for the heat transfer medium are located together at a bottom area at one side of the accumulator.

Abstract: A plurality of first joint tubes 40 connected to a plurality of heat transfer tubes 3 and a plurality of second joint tubes 50 provided at a header 5B are connected to each other at joints J. The joints J include at least one slide joint Ja at which respective ends of the first and the second joint tubes 40 and 50 are fitted to each other slidably in a predetermined direction. The joints J further include at least one butt joint Jb at which an end of either one of the first and the second joint tubes butts against a sealing surface provided at the other one of the first and the second joint tubes. The butt position of the sealing surface and the end is variable in a direction crossing the predetermined direction. With this arrangement, the influence of an error in the arrangement of the first and the second joint tubes 40 and 50 is reduced, so that the header 5B is properly connected to the heat transfer tubes 3 detachably, and the maintenance of the heat exchanger HE is facilitated.

Abstract: An integrated liquid cooling unit comprising a liquid pump and a U-shaped flat tube. An adapter rigidly connects and establishes fluid communication between the pump and the tube creating an integrated unit for cooling an electronic chip via a closed loop. Heat is rejected from the coolant through cooling fins disposed between the legs of the U-shaped tube to passing air being propelled by a blower assembly.

Abstract: A heat exchanger includes a first header and a second header and a plurality of heat exchange tubes extending therebetween. Each heat exchange tube has an inlet end opening to one of the headers and an outlet opening to the other header. Each heat exchange tube has a plurality of channels extending longitudinally in parallel relationship from its inlet end to its outlet end, each channel defining a discrete refrigerant flow path. The inlet end of each of the plurality of heat exchange tubes is positioned with the inlet opening to the channels disposed in spaced relationship with and facing an opposite inside surface of the header thereby defining a relatively narrow gap between the inlet opening to the channels and the facing opposite inside surface of the header. The gap may function either as a primary expansion device or as a secondary expansion device.