Patents Examined by Allen J. Flanigan
  • Patent number: 7604040
    Abstract: A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper portion of the cooling housing from the lower portion. A heat rejecter is disposed on and above the upper wall of the cooling housing with a first header extending from and in fluid communication with the liquid coolant outlet. A second header extends upwardly from a rejecter outlet. A plurality of first tubes extend between and in fluid communication with the first header and the second header with a plurality of first air fins disposed between the upper wall and the first tubes. A single unit defines both the cooling housing and the air cooled heat rejecter to thereby allow the manufacture of the unit in a single process with the attendant reduction in shipping, handling and installation.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: October 20, 2009
    Assignee: Coolit Systems Inc.
    Inventors: Debashis Ghosh, Mohinder Singh Bhatti
  • Patent number: 7604041
    Abstract: A heat sink clip for securing a heat sink to a heat generating electronic component includes a spring member including an elongated main body. A connecting portion is formed at one end of the main body and a first locking leg extends from the other end thereof. A second locking leg is coupled to the connecting portion of the spring member. An actuating member connects pivotally with the second locking leg. An assisting member, which is located between the actuating member and the connecting portion, includes a wedged main body. When the actuating member is rotated from a first orientation to a second orientation, the assisting member horizontally moves a distance thereby moving the actuating member to a raised level. The actuating member has teeth engaging with teeth formed on an inclined face of the wedged main body.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: October 20, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Fang-Xiang Yu, Chin-Lung Chen
  • Patent number: 7600558
    Abstract: A cooler comprises a base, a set of radiator fins and a plurality of heat pipes going through the base and the radiator fins. The lower surface of the base is further provided with a recess wherein part of the heat pipes is exposed, whereby a heat-generating element will be embedded with in the recess, and whereby the heat generated in the element will be conducted quickly through the heat pipes to the radiator fins. Therefore, the heat-dissipation efficiency is enhanced.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: October 13, 2009
    Inventor: Shyh-Ming Chen
  • Patent number: 7600557
    Abstract: A heat sink mechanism includes a fixed and a movable clamping piece, at least one adjusting gearwheel rotatably mounted to and between the fixed and the movable clamping piece via a fixing shaft while an end of the fixing shaft is screwed to the movable clamping piece, and an adjusting worm shaft rotatably mounted to the fixed clamping piece for driving the adjusting gearwheel to rotate via meshed worm threads on the worm shaft and gear teeth on the adjusting gearwheel. When the adjusting worm shaft is rotated, the meshed worm threads and gear teeth bring the adjusting gearwheel and the fixing shaft thereof to rotate, so that the movable clamping piece screwed to the rotating fixing shaft is brought to move toward or away from the fixed clamping piece to thereby fix the heat sink mechanism to a heat-producing source to achieve the purpose of heat dissipation.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: October 13, 2009
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Shih-Chieh Chiang, Lin-Yu Lee
  • Patent number: 7597134
    Abstract: A heat dissipation device comprises at least two heat pipes (10) and a plurality of fins (20) thermally connected with the heat pipes (10). Each of the heat pipes (10) comprises a flattened evaporating portion (12) and a condensing portion (14). The evaporating portions (12) are closely connected with each other. A flat bottom surface (125) of the evaporating portions (12) of the heat pipes (10) directly engages with an electronic component. A flat top surface (120) of the evaporating portions (12) of the heat pipes (10) directly engages with a bottom surface of the fins (20). The condensing portions (14) of the heat pipes (10) extend through the fins (20).
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: October 6, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xu-Xin Min, Meng Fu, Chun-Chi Chen
  • Patent number: 7578339
    Abstract: A heat exchanger including plate fins and, the tubes fins being stacked at respective intervals relative to one another, and heat exchanger tubes penetrating the fins in a fin-stacking direction. The heat exchanger exchanges heat between fluids flowing, respectively, inside and outside the heat exchanger tubes, through the heat exchanger tubes and the fins. Each of the fins includes cut-raised portions with a bridge shape having leg and beam segments. The cut-raised portions associated with each of the heat exchanger tubes are located substantially only in a region of the fin satisfying Ws=(1??)Dp+?D ?>0.5, where Ws is spread width of the cut-raised portions in a direction (column direction) extending along an end of the fin on the upstream side of the second fluid, and D is outer diameter of the heat exchanger tube. Dp is alignment pitch of the heat exchanger tubes in the column direction.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: August 25, 2009
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kunihiko Kaga, Shinji Nakadeguchi, Akira Ishibashi, Shinichi Wakamoto, Toshinori Ohte, Hiroki Murakami, Tadashi Saito
  • Patent number: 7575044
    Abstract: Ventilating system including a case in communication with a room, an air supply passage in the case for drawing outdoor air into the room, an air discharge passage in the case for discharging room air to an outside of the room, and a fan both in the air supply flow passage and the air discharge flow passage in the case, thereby providing a compact, low noise, and low cost ventilating system.
    Type: Grant
    Filed: May 19, 2005
    Date of Patent: August 18, 2009
    Assignee: LG Electronics Inc.
    Inventors: Keun Hyoung Choi, Jeong Yong Kim
  • Patent number: 7565923
    Abstract: A rotary total heat exchange apparatus includes at least an air-providing member, a first air passage and a second air passage, a sensible heat exchanger (21), and a total heat exchange wheel (1). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through. The sensible heat exchanger spans across the first and second air passages simultaneously for conducting a sensible heat exchange between the first and second airflows. The total heat exchange wheel is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.
    Type: Grant
    Filed: August 25, 2005
    Date of Patent: July 28, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Shu-Cheng Yang, Chih-Peng Lee
  • Patent number: 7562697
    Abstract: A heat exchanger includes an inlet header, an outlet header and a plurality of flat, multi-channel heat exchange tubes extending therebetween. A longitudinally extending member divides the interior of the header into a first chamber on one side thereof for receiving a fluid and a second chamber on the other side thereof. A plurality of multi-channel heat exchange tubes extend between the headers with the respective inlet end of each heat exchange tube passing into the second chamber of the inlet header. Fluid passes through a series of longitudinally spaced openings in the longitudinally extending member for distribution to the inlets to the channels of the multi-channel heat exchange tubes. The fluid may undergo expansion as it passes through the openings.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: July 21, 2009
    Assignee: Carrier Corporation
    Inventors: Mikhail B. Gorbounov, Igor B. Vaisman, Parmesh Verma, Moshen Farzad, Mark A. Daniels, Joseph B. Wysocki
  • Patent number: 7562696
    Abstract: A juxtaposing structure for the heated ends of a plurality of heat pipes includes a plurality of heat pipes and a locking unit. Each heat pipe has a heated end. The surface of the heated end of each heat pipe has an upper plane and a lower plane facing to each other and sidewall faces formed between both sides of the two planes. Sidewall faces of any two adjacent heat pipes adjoin and abut against each other. The locking unit locks the heated end of each heat pipe to form into one body. With the combination of each lower plane, a heated surface having a larger area can be formed.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: July 21, 2009
    Assignee: Cpumate, Inc.
    Inventors: Kuo-Len Lin, Wen-Jung Liu
  • Patent number: 7552758
    Abstract: According to the present invention, there is provided a system for removing heat from server blades densely packaged in a rack of server blades. The system includes a liquid distribution manifold. In addition, the system includes a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades. Moreover, the system includes at least one server blade attached to each of the cold blades.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: June 30, 2009
    Assignee: International Business Machines Corporation
    Inventors: Robert Barton Garner, Winfried Wolfgang Wilcke
  • Patent number: 7543630
    Abstract: A heat pipe includes an outer pipe (10), an inner pipe (20), and a hermetic cap (30). The outer pipe has an evaporating end (12) and a condensing end (14). The evaporating end is integrally sealed and receives working fluid. The inner pipe includes an open top and an open bottom. A very narrow gap (40) is defined between the inner pipe and the outer pipe. A plurality of granules is put into the gap to form a porous wicking structure. When the evaporating end is heated by an external heat source, the working fluid is vaporized and flows up along the inner pipe to the condensing end. The working fluid condenses at the condensing end, and flows back down to the evaporating end through the gap. Because the gap is very narrow, surface tension of the working fluid and capillary action of the outer and inner pipes is enhanced.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: June 9, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Tsung-Lung Lee, Shenghua Wang
  • Patent number: 7540320
    Abstract: The present invention relates to an improved air conditioning filter and cooling/heating coil that can easily be applied to new and existing air handling systems. The slant design of these components allows a more efficient heat transfer and particle entrapment than their conventional counterparts. By residing at an angle in their air handling enclosures, and by virtue of their oblique prismatic construction, more filter media can be used and more heat transfer surface area can be incorporated without offering any substantial additional impediments to the flow of air. At angles of 45 degrees air friction of the coil and filter are reduced by 40 to 55 percent.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: June 2, 2009
    Inventor: Thomas Middleton Semmes
  • Patent number: 7527089
    Abstract: A heat exchanger includes a plurality of flat, multi-channel heat exchange tubes extending between spaced headers. Each heat exchange tube has an inlet end in fluid flow communication with one of the headers and an outlet opening to the other header. Each heat exchange tube has a plurality of flow channels extending longitudinally in parallel relationship from its inlet end to its outlet end. A plurality of connectors are positioned between the inlet header and the heat transfer tubes to define a flow path providing fluid flow communication between the inlet header and the inlet ends of the heat exchange tubes. Two or more flow restriction ports are arranged in the series in the flow path through each connector whereby fluid flowing from the inlet header to the flow channels of the heat exchange tube associated therewith undergoes an expansion as the fluid passes through each flow restriction port.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: May 5, 2009
    Assignee: Carrier Corporation
    Inventors: Mikhail B. Gorbounov, Joseph J. Sangiovanni, Igor B. Vaisman
  • Patent number: 7527090
    Abstract: Embodiments of the invention includes a heat dissipating device. The heat dissipating device includes a main body having a surface, wherein the surface is plated or coated with at least two different metals to form a design effective for bonding to solder and for adhering to polymer in a polymer solder hybrid. The heat dissipating device also includes surface perturbations.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: May 5, 2009
    Assignee: Intel Corporation
    Inventors: Ashay A. Dani, Sabina J. Houle, Christopher L. Rumer, Thomas J Fitzgerald
  • Patent number: 7523782
    Abstract: There is disclosed a heat exchanger for transferring heat between at least two fluids and a method for forming the heat exchanger. The heat exchanger preferably includes one or more end tanks, one or more inlets and outlets, one or more tubes, one or more fins, and one or more improved baffle combinations including at least one single piece double baffle. The improved single piece double baffles act as part of a baffle system, with advantages over multiple-piece only double baffle systems due to being assembled in one piece.
    Type: Grant
    Filed: July 31, 2004
    Date of Patent: April 28, 2009
    Assignee: Valeo, Inc.
    Inventors: Jay Lorentz, Bradley A. Smith
  • Patent number: 7523780
    Abstract: An isosceles triangular cross section shaped microchannel-cooling device conducts a working fluid for the removal of heat from a heat source. The triangular shaped microchannel provides an increased thermal transport coefficient for improved heat transport with an improved mass flow rate. The microchannel-cooling device is well suited for removing heat from electronics, semiconductor components, and systems.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: April 28, 2009
    Assignee: The Aerospace Corporation
    Inventors: James Todd Dickey, Tung Ting Lam
  • Patent number: 7520314
    Abstract: A heat dissipation apparatus (10) for dissipating heat from a heat-generating electronic component includes a fin assembly (12) and a centrifugal blower (14). The fin assembly includes a plurality of laminar fins (121) thermally connecting with the heat-generating electronic component to absorb heat therefrom. The centrifugal blower provides an airflow flowing through the fin assembly to take heat away therefrom. The centrifugal blower includes a housing (141), a cover (142) disposed on the housing, and a rotor (143) rotatably received in a space formed between the housing and the cover. The fins of the fin assembly are disposed in the housing of the centrifugal blower and stacked together along a direction substantially parallel to a rotation axis (A) of the rotor.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: April 21, 2009
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jin-Gong Meng
  • Patent number: 7520318
    Abstract: The present invention relates to a heat exchanger for a vehicle, in which a second radiator as a heat exchanger for cooling electronic components, such as an inverter and a motor, and a first radiator as a heat exchanger for cooling an engine are manufactured into an integral-type heat exchanger, and a reservoir tank is integrally coupled to the integral-type heat exchanger.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: April 21, 2009
    Assignee: Halla Climate Control Corporation
    Inventor: Daebok Kwon
  • Patent number: 7520319
    Abstract: A stacking-type, multi-flow, heat exchanger includes a plurality of heat transfer tubes and fins stacked alternately, a tank formed at an end of the heat transfer tubes, and an end plate provided at an end of the tank. The heat exchanger has a projecting portion provided to a surface of an outermost tube plate, a raised portion with an opening formed through the projecting portion, and an engaging portion and a closing portion provided integrally to the end plate for engaging the raised portion and for closing an opening of the raised portion. A positional shift of the end plate at the time of temporary assembling may be prevented, and the brazing properties and the pressure resistance of the tank end portion may be increased.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: April 21, 2009
    Assignee: Sanden Corporation
    Inventor: Takayuki Ohno