Abstract: A plate heat exchanger comprising plates (21, 31) interconnected by soldering and adapted to exchange heat between a high and a low temperature fluid may be designed to improve the cooling of the parts of the plates located near inlets (3) for the high temperature fluid by providing separate fluid channels (23, 26) in pairs of plates (21, 31) guiding low temperature fluid, said separate channels (23, 26) at least partly surrounding said inlets (3) for the high temperature fluid.

Abstract: A sectional modular heat sink is formed from a plurality of stacked modular heat radiating units, each of which is provided on one side along at least one longitudinal edge with a pair of arm portions, each of which being vertically extended or upward and outward inclined; and on an opposite side with a U-shaped or a V-shaped channel corresponding to the pair of arm portions. A horizontally extended flange is provided along a free edge of each arm portion, and a horizontally extended groove is provided along each of two innermost edges of the channel corresponding to the flanges on the arm portions. When two modular heat radiating units are stacked, the arm portions and the flanges on a first modular heat radiating unit respectively engage with the channel and the grooves on a second modular heat radiating unit to firmly connect the two units to one another.

Abstract: A cooling system for removing heat from a heat generating component, includes a base (100) and a heat sink (200) mounted on the base. The base includes a bottom wall (20) and a side wall (10) surrounding the bottom wall. The bottom wall and the side wall cooperatively define a space (40) receiving working fluid therein. The heat sink defines an evaporating passage (220) and a condensing passage (230) therein. The two passages are in fluid communication with the space. Cooperatively the space and the passages define a loop for circulating the working fluid therein. The working fluid has a phase change for dissipating heat generated by a heat-generating electronic component.

Abstract: A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.

Abstract: In a bulldozer, a radiator module is separated from an engine and is disposed on the rear of the bulldozer. Louver plates on the upper portion of a grill are installed so as to cover the outside of the radiator module and point in a substantially horizontal direction. Louver plates on the lower portion of the grill point diagonally upward.

Abstract: A heat exchanger including at least a first manifold and a second manifold connected by a bundle of horizontal tubes. An air flow circulates to be cooled by a cooling air flow. The bundle includes at least: a first portion including a first series of tubes with turbulators of passage section corresponding to the section; a second portion including a first series of tubes with no turbulators of passage section and a second series of tubes with turbulators of passage section corresponding to the section; and a distribution box of internal air flow to be cooled including a connection mechanism between the first portion and the second portion.

Abstract: A fan holder is used for securing a fan to a heat sink. The fan holder includes a cover mounting the fan thereon, and a base mounting the cover thereon. The cover includes a plurality of separate claws and at least one jut. The base includes a through hole receiving the claws of the cover therein, thereby rotatably mounting the cover onto the base, and at least one slot. The at least one slot has a first pit and a second pit at two ends thereof respectively. The at least one jut is slidable along the slot between the first pit and the second pit to have the cover rotatable between a first location and a second location.

Abstract: The invention relates to a hollow chamber profile made of metal, especially for heat exchangers. Said profile is made of an extruded base profile (10) having two broad parallel sides and two narrow sides or is made of a base profile which is a circular tube type or coaxial tube type. At least one channel (11) extends inside said base profile in the longitudinal direction thereof. The hollow profile has improved heat transfer properties on the sides and webs (13) which are deformed perpendicular to the longitudinal direction thereof.

Abstract: The invention relates to an exhaust gas heat exchanger comprising a bundle of pipes which consists of exhaust gas pipes and a bypass channel, and a housing which can be cross-flown by an aqueous cooling agent. The bundle of pipes and the bypass channel joins in a common exhaust gas inlet, wherein an exhaust gas valve is arranged for controlling the exhaust gas flow through the bundle of pipes or the bypass channel. According to the invention, the bypass channel is embodied as a special steel tube (10) comprising a covering (11) which is made of a high-temperature resistant plastic and wherein the housing, which can be cross-flown by the cooling agent, is arranged.

Abstract: A tube bundle apparatus for thermal exchange operations at high pressures and temperatures, under conditions of high aggressiveness of process fluids. The tube bundle includes a series of tubes whose internal wall includes a material selected from titanium, zirconium, or an alloy thereof, resistant to aggression of fluids, in which at least one of access chambers to the tube bundle is delimited by a wall including at least the following three metallic layers in succession: a) an external layer for tolerating pressure load, subject to corrosion by contact with the highly aggressive process fluid; b) an intermediate layer of stainless steel; (c) an anticorrosive lining in contact with the highly corrosive fluid, of a material selected from titanium, zirconium, or an alloy thereof. The apparatus can be particularly used as an exchanger/reactor, for example as a stripper, in the high pressure cycle of synthesis processes of urea.

Abstract: A vapor chamber heat sink attached to a heat-generating electronic component includes a base (10) defining an opening therein. A plurality of fins (20) is mounted on the base. A heat pipe (30) thermally connects the electronic component and the fins. The heat pipe comprises a plate-type lower portion (32) contacting a bottom surface of the base and a bottom surface (22) of the fins and overlaying a top surface of the electronic component, a plate-type upper portion (34) parallel to the lower portion contacting a top surface (24) of the fins, and a connecting portion (36) interconnecting opposite two ends of the lower and upper portions. The heat pipe is configured in such a manner so as to enhance contact area and thermal conductivity between the heat pipe and the electronic component and between the heat pipe and the fins.

Abstract: A cover assembly (10) is provided and includes a flexible fabric cover (21) within which a plurality of elongate, hollow thermal transfer fluid profiles (12) is positioned. Each of the profiles includes an arcuate outer surface (13) adapted to conform with an exterior of a fluid conduit (20). The cover assembly may be fastened circumferentially about a fluid conduit to position and maintain the profiles in thermal contact therewith.

Abstract: A water block is used to be adhered to a heat-generating element and includes a cavity. The cavity has a chamber therein. One side or both sides of the chamber is provided with an inlet pipeline and an outlet pipeline respectively, thereby communicating with the chamber. Further, the chamber is provided therein with a heat-exchanging means for performing a heat-exchanging action with a working fluid. Finally, the top face of the cavity is provided with a membrane. An activating element is adhered on the membrane for driving the membrane to swing up and down, thereby forcing the working fluid within the chamber to circulate in single direction. The activating element is used as a power source, and in addition, the water block can be made much thinner.

Abstract: A sectional modular heat sink is formed from a plurality of stacked modular heat radiating units, each of which is provided on one side along each longitudinal edge with an upright ridge portion having two inclined sidewalls, at least one of which being provided with a groove; and on an opposite side with a channel corresponding to the ridge portion to have two inclined sidewalls, at least one of which being provided with a flange corresponding to the groove on the ridge portion. A plurality of the modular heat radiating units may be sequentially stacked and connected through engagement of the ridge portions and the grooves on a first modular heat radiating unit with the channels and the flanges on a second modular heat radiating unit, respectively, and thereby form a sectional modular heat sink.

Abstract: A heat exchanger for cooling a heat generating device including a base having a recess with a base coolant inlet opening and a base coolant outlet opening. A porous core is positioned within the recess of the base, and has a core coolant inlet opening and a core coolant outlet opening that are arranged in corresponding relation with base coolant inlet opening and a base coolant outlet opening so as to be in fluid communication. A porous gasket is pinched between the porous core and the base.

Abstract: A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.

Abstract: A jointing structure of a heat dissipating fin, disposed on an upper level edge and a lower level edge of each fin body of the heat dissipating fin, comprises at least one hole or more on each of the level edges, at least one lock tab or more on the fin body of the heat dissipating fin corresponding to the hole, and the lock tab is formed by directly folding the fin body instead of extendingly disposed from the upper and lower level edges. More than one protrusion is disposed on each of the lock tabs. The protrusions on the lock tabs of the upper and lower level edges in a previous fin body are coupled into the corresponding holes of the upper and lower level edges in a next fin body, so as to join multiple heat dissipating fins integrally and stably.

Abstract: A thermal module includes at least one heat dissipating element, at least one cooling chip, and a heat radiating unit. The cooling chip has a cold end in contact with one side of the heat dissipating element and a hot end in contact with the heat radiating unit. With the cooling chip in direct contact with the heat radiating unit and the heat dissipating element, the heat dissipating element can be directly cooled by the cooling chip, and the thermal module can have a simplified structure to occupy a reduced room while providing enhanced heat dissipating efficiency and accordingly upgraded heat-dissipating effect.

Abstract: A heat exchange module (1) is disclosed, which includes an evaporator (20), a condenser (50) and a heat sink (22). The evaporator defines therein a chamber for containing a wick structure (20c) saturated with a working fluid. The wick structure occupies a portion of the chamber. The condenser is disposed adjacent to the evaporator, wherein the working fluid turns into vapor in the evaporator after absorbing heat of a heat-generating component and the vapor turns into condensate at the condenser after releasing the heat. The heat sink is attached to an outer surface of the evaporator and located in alignment with the wick structure contained in the evaporator.

Abstract: A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cooling units are connected to the cooling pipes and each cooling unit includes fins and a cooling fan which generates air flows toward the fins and cooling the parts around the CPU.