Patents Examined by Allen J. Flanigan
  • Heat dissipation device
    Patent number: 7654309
    Abstract: A heat dissipation device includes a heat sink (10), a fan (20) disposed on top of the heat sink, a fan duct (30) arranged on the fan and a fan guard (40) sandwiched between the fan and the fan duct. The fan defines a through hole (26) at each corner and includes a plurality of positioning blocks (28) extending from each side edge thereof. The fan duct includes a plurality of connecting portions (32) extending from a circumference of the fan duct near the fan. Each connecting portion includes a post fitted in the through hole and a hook engaging with the positioning block.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: February 2, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Qiang Wu, Chun-Chi Chen
  • Loop heat pipe
    Patent number: 7654310
    Abstract: A loop heat pipe includes an evaporator and a closed loop. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, the closed loop includes a first pipe body and at least a second pipe body. One end of the first and the second pipe bodies is a heat reception end, which are securely fastened to the two retaining holes of the evaporator. The other end of the first and the second pipe bodies is a heat reception end, thereby sequentially forming a circulating loop. Meanwhile, a flattened liquid seal region is formed between the heat reception end and the connection end of the first pipe body.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: February 2, 2010
    Assignee: Jaffe Limited
    Inventor: Jia-Hao Li
  • Method for removing vapor within heat pipe
    Patent number: 7650915
    Abstract: A method for removing vapor within a heat pipe includes providing a predetermined amount of working fluid injected into the heat pipe. An opening is reserved at one end of the heat pipe. The opening is communicated with a vacuum environment. The communication between the opening and the vacuum environment is normally disconnected, such that at the instant the communication is connected ,the vacuum level of the vacuum environment is maintained at a certain range. The communication between the opening of the heat pipe and the vacuum environment is intermittently connected for several times. Within the duration while the communication between the opening and the vacuum environment is connected, the working fluid is evaporated without being boiled and vapor is exhausted from the opening.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: January 26, 2010
    Inventor: Hul-Chun Hsu
  • High performance compact thermosiphon with integrated boiler plate
    Patent number: 7650928
    Abstract: A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: January 26, 2010
    Assignee: Coolit Systems Inc.
    Inventors: Mohinder Singh Bhatti, Ilya Reyzin, David P Rusch, Shrikant Mukund Joshi
  • Cooler module
    Patent number: 7650929
    Abstract: A horizontal cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, and heat pipes each having a first extension arm respectively tightly inserted through the radiation fins and a second extension arm respectively fitted into the bottom open grooves of the base block with a respective flat wall portion of the second extension arm exposed to the outside of the base block and kept in flush with the bottom wall of the base block for direct contact with an external electronic chip to transfer heat energy from the electronic chip to the heat sink for quick dissipation.
    Type: Grant
    Filed: September 30, 2007
    Date of Patent: January 26, 2010
    Inventor: Tsung-Hsien Huang
  • Heat exchanger
    Patent number: 7650934
    Abstract: The invention relates to a heat exchanger, particularly a radiator for a heating or air conditioning unit in motor vehicles, which cools a coolant. Said heat exchanger (1) is penetrated by air, comprises collector pipes (S1, S2, S2, S4) and several essentially horizontally disposed pipes (5), and is divided into several partial blocks (T1, T2, T3, T4). The surfaces of the inventive partial blocks are selected according to the dimensions of structural space-related zones having different air temperatures inside the assembly space of the heat exchanger, the partial block which is first penetrated by the coolant being arranged within a structural space-related zone having a higher air temperature, preferably within the zone having the highest air temperature.
    Type: Grant
    Filed: July 3, 2003
    Date of Patent: January 26, 2010
    Assignee: BEHR GmbH & Co.
    Inventors: Walter Demuth, Martin Kotsch, Karl-Heinz Staffa, Christoph Walter
  • Heat exchanger, particularly for a motor vehicle
    Patent number: 7650935
    Abstract: The invention relates to a heat exchanger comprising tubes (2, 3) that can be flown through along a number of hydraulically parallel flow paths (2c, 2d) that are comprised of sections.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: January 26, 2010
    Assignee: BEHR GmbH & Co. KG
    Inventors: Walter Demuth, Martin Kotsch, Michael Kranich, Hans Joachim Krauss, Hagen Mittelstrass, Karl-Heinz Staffa, Christoph Walter
  • Vapor augmented heatsink with multi-wick structure
    Patent number: 7650931
    Abstract: A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: January 26, 2010
    Assignee: Covergence Technologies Limited
    Inventor: Wing Ming Siu
  • Loop heat pipe
    Patent number: 7650932
    Abstract: A loop heat pipe includes an evaporator and a sealed pipe. The evaporator includes an evaporator body made of a heat conductive material. The evaporator body has at least two retaining holes and at least a channel hole penetrating the retaining holes. In addition, the sealed pipe includes at least two sealed ends. The two sealed ends are securely fastened to the two retaining holes of the evaporator. Meanwhile, at least one of the two retaining holes is a through hole, which penetrates through two sides of the evaporator body, and at least one of the sealed ends protrudes the evaporator via the penetrable retaining hole.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: January 26, 2010
    Assignee: Jaffe Limited
    Inventor: Jia-Hao Li
  • Heat dissipation device
    Patent number: 7647960
    Abstract: A heat dissipation device includes a base, a first and second fin sets on the base, and a fan located atop the first and second fin sets. The base has a first face for contacting with an electronic device, and two sloped faces extending from the first face and toward each other. The first fin set defined a channel receiving the base therein. A plat extends from an end of the first face of the base. The second fin set is arranged on the plat of the base. The first face of the base has two grooves defined therein. A retaining member is attached to the first face of the base and has two retaining bars thereof fitted in the two grooves of the first face, respectively.
    Type: Grant
    Filed: February 8, 2006
    Date of Patent: January 19, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xue-Wen Peng, Bing Chen
  • Clip for heat sink
    Patent number: 7644751
    Abstract: A heat sink clip (100) includes a spring member (10), a moveable locking member (20) and an actuating member (30). The spring member includes an elongated main body (11) and a first locking leg (14) connecting at one end of the main body. The locking member is coupled at the other end of the main body, including an engaging plate (22) and a second locking leg (26) extending from the engaging plate. The actuating member includes a handle (32) and an extension portion (34) formed at one end of the handle. The handle and the extension portion form an angle therebetween. The extension portion is operatively engageable with the engaging plate of the locking member.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: January 12, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tong-Hua Lin, Chin-Lung Chen, Jian-Qing Sheng
  • Heat exchanger manifold sealing system
    Patent number: 7640971
    Abstract: A heat exchanger manifold with improved sealing between the tank and header. The manifold includes a plastic heat exchanger tank having an opening for mating with a header and a lip extending substantially around a periphery of the opening. The lip has an outer surface and an upper surface extending outward of the tank opening, and a ridge extending upward from a portion of the upper surface extending substantially around the tank. The manifold further includes an aluminum heat exchanger header adapted to connect to a heat exchanger core. The header has a groove around the periphery thereof receiving the tank lip and a plurality of plastically deformable tabs extending from an edge of the groove. The tabs are bent inward and contact the ridge on the tank lip to secure the tank to the header.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: January 5, 2010
    Assignee: Centrum Equitites Acquisition
    Inventor: John A. Kolb
  • Heat dissipation device with a heat pipe
    Patent number: 7640968
    Abstract: A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: January 5, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xue-Wen Peng, Rui-Hua Chen
  • Heat exchanger
    Patent number: 7637314
    Abstract: The present invention relates to a heat exchanger for carbon dioxide, in which a tank having a number of domes is coupled with a header and a connection member having a connection flow channel is interposed between the header and the tank, thereby easily changing a refrigerant flow channel, reducing the volume of a header tank, and improving productivity, pressure resistance and durability.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: December 29, 2009
    Assignee: Halla Climate Control Corporation
    Inventors: Taeyoung Park, Kwangheon Oh, Duckho Lee
  • Heat dissipation device
    Patent number: 7637311
    Abstract: A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: December 29, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong-Bo Zheng, Meng Fu, Chun-Chi Chen
  • Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluid
    Patent number: 7628198
    Abstract: A heat sink has a heat spreader structure containing magneto-hydrodynamic fluid. Also, the heat spreader includes a central metallic cylinder and a metal ring screen surrounding the central metallic cylinder. Electrical and magnetic fields induce the magneto-hydrodynamic fluid to undergo a swirling motion. The swirling motion acts as an MHD pump and provides efficient heat dissipation from a heat source contacting the heat spreader. A heat sink spreader has a central metallic cylinder surrounded by a metallic ring screen, and a magneto-hydrodynamic fluid.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: December 8, 2009
    Assignee: Sun Microsystems, Inc.
    Inventor: Chien Ouyang
  • Heat exchanger
    Patent number: 7614442
    Abstract: A heat exchanger comprising two tanks, and a plurality of tubes for a medium which is to be cooled/heated are arranged in stacked, transverse rows, with the tubes arrayed to extend from the entrance to the exit side of the heat exchanger. The tubes are disposed between and transmit the medium between the tanks. Ducts between the stacked rows of the tubes for flow of a different cooling/heating medium. The ducts are arranged to run transversely to the longitudinal direction of the tubes. The opposing connection surfaces of the tanks converge in the direction of flow of the cooling/heating medium through the heat exchanger. The ducts closer to the connection surfaces are angled convergingly like the connection surfaces. Such a heat exchanger may be used, e.g. as a cooler, and in a motor vehicle.
    Type: Grant
    Filed: June 28, 2005
    Date of Patent: November 10, 2009
    Assignee: Scania CV AB (publ)
    Inventor: Morgan Colling
  • Steam condenser with two-pass tube nest layout
    Patent number: 7610952
    Abstract: A compact two-pass steam condenser with at least one improved tube nest configuration, having, a steam inlet through which steam is received; at least one tube nest in two distinct bundles, the top and the bottom bundle each have a plurality of cooling tubes arranged in two distinct bundles and separated by a pass-partition for condensing the steam received through the steam inlet; and at least one non-condensable gas extracting tube through which non-condensable gas contained in the steam is extracted; a condensate outlet through which condensate condensed by the cooling tubes is discharged; and a vessel surrounding the tube nest.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: November 3, 2009
    Assignee: Bharat Heavy Electricals Limited
    Inventors: Konala Lakshmana Reddy, Nagapatnam Sundararajan, Guddanti Ramamohana Rao, Vinod Kumar Saxena
  • Heat-dissipating model
    Patent number: 7610947
    Abstract: A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with a capillary structure and a working fluid therein. The heat-dissipating body has a through hole for connecting to the outer periphery of the heat-conducting member. Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the effect of heat conduction or dissipation can be improved and the life is extended.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: November 3, 2009
    Assignee: Pyroswift Holding Co., Limited
    Inventors: Chin-Wen Wang, Ching-Chung Wang, Pei-Choa Wang
  • Cooler module
    Patent number: 7610948
    Abstract: A non-welding cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, heat pipes tightly inserted through the radiation fins and partially fitted into respective bottom open grooves of the base block with a respective flat wall portion thereof kept in flush with the bottom wall of the base block, and a thermal pad affixed to the bottom wall of the base block to hold down the heat pipes in the bottom open grooves of the base block for transferring heat energy from an external electronic chip to the heat pipes and the heat sink for quick dissipation.
    Type: Grant
    Filed: July 25, 2007
    Date of Patent: November 3, 2009
    Inventor: Tsung-Hsien Huang