Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital transducer electrodes including a predetermined number of electrode fingers disposed on an upper surface of the substrate, and a dielectric material layer having a first portion and a second portion. The first portion is disposed on the upper surface of the substrate and between the interdigital transducer electrode fingers. The second portion is disposed above the interdigital transducer electrode fingers. The acoustic wave device further includes at least one thermally conductive bridge disposed within the dielectric material layer and contacting upper surfaces of at least two adjacent interdigital transducer electrode fingers to dissipate heat therefrom.

Abstract: An electronic filter includes a plurality of series arm acoustic wave resonators electrically connected in series between an input port and an output port, a plurality of parallel arm acoustic wave resonators electrically connected in parallel and electrically connected on first sides between respective ones of the plurality of series arm acoustic wave resonators and electrically connected on second sides to ground, and at least one additional acoustic wave resonator electrically connected in parallel to one of one of the plurality of series arm acoustic wave resonators or one of the plurality of parallel arm acoustic wave resonators and having a temperature coefficient of frequency (TCF) lower than a TCF of the acoustic wave resonator to which it is electrically connected in parallel.

Abstract: An amplification apparatus includes an amplifier having an inverting terminal, and a non-inverting terminal connected to a reset voltage node, a first capacitor connected to the inverting terminal, an input voltage being applied to the first capacitor, a second capacitor connected to the inverting terminal and an output terminal of the amplifier, and a duty-cycled resistor, connected in parallel to the second capacitor, including a first resistor. The duty-cycled resistor is configured to connect the first resistor and the inverting terminal and to disconnect the first resistor and the reset voltage node during a first time interval included in a period to complete an on-and-off cycle of the duty-cycled resistor, and disconnect the first resistor and the inverting terminal and to connect the first resistor and the reset voltage node during a second time interval included in the period.

Abstract: An acoustic wave filter device includes first and second terminals, an inductor connected to the first terminal, and a longitudinally coupled resonator coupled between the inductor and the second terminal. The longitudinally coupled resonator includes at least one first IDT electrode coupled to the first terminal, and at least one second IDT electrode connected to the second terminal. A total capacitance value of the at least one first IDT electrode is greater than a total capacitance value of the at least one second IDT electrode.

Abstract: A filter device includes a filter between an input terminal and an output terminal, and an additional circuit connected in parallel with the filter between the input terminal and the output terminal. The additional circuit includes at least two longitudinally coupled resonators connected in parallel with each other and including longitudinally coupled resonators, and at least one capacitance element between the input terminal and the at least two longitudinally coupled resonators or between the output terminal and the at least two longitudinally coupled resonators. The average pitch of a plurality of electrode fingers of IDT electrodes of the longitudinally coupled resonator and the average pitch of a plurality of electrode fingers of IDT electrodes of the longitudinally coupled resonator are different from each other.

Abstract: Enhanced operational amplifier trim circuitry and techniques are presented herein. In one implementation, a circuit includes a reference circuit configured to produce a set of reference voltages, and a digital-to-analog conversion (DAC) circuit. The DAC circuit comprises a plurality of transistor pairs, where each pair among the plurality of transistor pairs is configured to provide portions of adjustment currents for an operational amplifier based at least on the set of reference voltages and sizing among transistors of each pair. The circuit also includes drain switching elements coupled to drain terminals of the transistors of each pair and configured to selectively couple one or more of the portions of the adjustment currents to the operational amplifier in accordance with digital trim codes.

Abstract: Aspects of this disclosure relate to a surface acoustic wave filter with an acoustic velocity adjustment structure. The surface acoustic wave filter can include a first interdigital transducer electrode disposed on a piezoelectric layer, an acoustic reflector disposed on the piezoelectric layer, and a second interdigital transducer electrode disposed on the piezoelectric layer. The second interdigital transducer electrode is longitudinally coupled to the first interdigital transducer electrode and positioned between the first interdigital transducer electrode and the acoustic reflector. The acoustic velocity adjustment structure can be positioned over at least a gap between the first interdigital transducer electrode and the second interdigital transducer electrode.

Abstract: Aspects of this disclosure relate to a surface acoustic wave device that includes a first reflector over a piezoelectric layer, a second reflector over the piezoelectric layer, and an interdigital transducer electrode structure over the piezoelectric layer and positioned between the first reflector and the second reflector. The surface acoustic wave device includes a velocity adjustment layer arranged to adjust acoustic velocity in a region of the surface acoustic wave device. The velocity adjustment layer can be a high speed layer or a low speed layer.

Abstract: A dielectric filter, a duplexer, and a communications device are provided. The dielectric filter includes a dielectric body, and a wideband filtering structure and a narrowband filtering structure that are disposed in the dielectric body. The wideband filtering structure includes a groove disposed on a first surface of the dielectric body and configured to adjust a frequency position of a passband of the wideband filtering structure; and at least one first resonator including a through hole penetrating the bottom of the groove and a second surface of the dielectric body; and an open loop located on a bottom surface of the groove and is disposed around an opening of the through hole. The narrowband filtering structure includes at least one second resonator including a blind hole disposed on the second surface of the dielectric body. The first surface and the second surface of the dielectric body are disposed oppositely.

Abstract: There are disclosed matrix filters having an input port and sub-filters connected between the input port and respective output ports. Each of the sub-filters includes a ladder circuit with n transversely-excited film bulk acoustic resonator (XBAR) series elements and n?1 capacitor shunt elements, where n, the order of the sub-filter, is an integer greater than 2. The sub-filters having noncontiguous passbands.

Abstract: Disclosed is an amplifier capable of minimizing shortcircuit current of an output stage of a buffer upon transition of an output voltage while having a high slew rate without increasing power consumption. The amplifier includes an input unit, a conversion unit, an amplification unit, a frequency compensation circuit, and a short-circuit current minimization circuit. Alternatively, the amplifier includes an input unit, a conversion unit, an amplification unit, a frequency compensation circuit, a short-circuit current minimization circuit, and a slew rate improvement circuit.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode in the diaphragm. A back-side partial Bragg reflector is formed on the back surface of the diaphragm, and a front-side partial Bragg reflector is formed on the front surface of the diaphragm.

Abstract: There are disclosed acoustic filters and radios incorporating the acoustic filters. A filter includes a first filter port, a second filter port, and n sub-filters, where n is an integer greater than one. Each sub-filter has a first sub-filter port connected to the first filter port and a second sub-filter port connected to the second filter port. A first acoustic resonator is connected from the first filter port to ground, and a second acoustic resonator is connected from the second filter port to ground. The first and second acoustic resonators are configured to create respective transmission zeros adjacent to a lower edge of a passband of the filter.

Abstract: According to one embodiment, a semiconductor device includes the following configuration. A detection circuit detects a state of a clock signal. An amplification circuit changes a gain based on the state of the clock signal detected by the detection circuit. An amplification circuit amplifies a first voltage with the gain and outputs a second voltage obtained as a result of amplification. A conversion circuit converts the second voltage output from the amplification circuit to first data. An isolation circuit includes a driver and a receiver electrically isolated from the driver. The driver transmits a signal corresponding to the first data to the receiver. The receiver outputs second data corresponding to the signal transmitted from the driver. The output circuit outputs the second data output from the isolation circuit.

Abstract: A differential amplifier circuit includes a first and second amplifiers that output a differential signal in a radio-frequency band, a first inductor having a first end connected to an output end of the first amplifier, a second inductor having a first end connected to an output end of the second amplifier, a choke inductor connected to second ends of the first and second inductors, a first and second capacitors, and a switch that connects the second capacitor in parallel to the first capacitor or terminates a parallel connection of the first and second capacitors. A resonant circuit formed by connecting the first or second inductor in series with the first capacitor has a different resonant frequency from a resonant circuit formed by connecting the first or second inductor in series with the parallel-connected first and second capacitors. These resonant frequencies correspond to second harmonic frequencies of the differential signal.

Abstract: An operational amplifier includes a first amplifying unit, a second amplifying unit, a current source, a first compensation capacitor, and a second compensation capacitor. The first amplifying unit includes a first input transistor, a second input transistor, a third input transistor, and a fourth input transistor. The second amplifying unit includes a fifth input transistor, a sixth input transistor, a seventh input transistor, and an eighth input transistor. One end of the first compensation capacitor is coupled to a drain of the seventh input transistor, and the other end of the first compensation capacitor is coupled to a gate of the eighth input transistor. One end of the second compensation capacitor is coupled to a drain of the eighth input transistor, and the other end of the second compensation capacitor is coupled to a gate of the seventh input transistor.

Abstract: A MoCA splitter device may include an input port, a first output port and a second output port, a first transmission line configured to connect the input port to the first output port, a second transmission line configured to connect the input port to the first output port, a first isolation element configured to connect the first transmission line to the second transmission line, a second isolation element configured to connecting the first transmission line to the second transmission line. The first isolation element and the second isolation element are configured to provide an isolation level between the first output port and the second output port that is less than a predetermined isolation level of about less than 16 dB in a MoCA frequency band.

Abstract: Methods and devices for amplifying an input RF signal according to at least two gain-states is described. According to one aspect, a multi gain amplifier circuit including a low noise amplifier having a stack of transistors is used for amplification of the input RF signal. When switching from a low gain-state to a high gain-state, the drain-to-source voltage of the output transistor of the stack is increased to affect region of operation of the output transistor, and thereby reduce non-linearity at the output of the amplifier. When switching from the high gain-state to the low gain-state, the drain-to-source voltage of the input transistor of the stack is increased to affect region of operation of the input transistor, and thereby reduce non-linearity at the output of the amplifier.

Abstract: An electronic device includes a signal processor, a substrate, and a conductive housing. The signal processor includes an oscillator that outputs oscillation signal. The substrate has a ground component, the signal processor being disposed on the substrate. The conductive housing is connected to a first site of the ground component and to a second site that is different from the first site. The first site and the second site being disposed at positions where a first area of the housing in which an impedance is higher than a first threshold due to the first site overlaps at least part of a second area of the housing in which an impedance is lower than a second threshold due to the second site.

Abstract: An apparatus includes an RF apparatus, and a multi-band matching balun coupled to the RF apparatus. The multi-band matching balun includes at least one three-element frequency-dependent resonator (TEFDR) and at most three reactive elements.