Abstract: A Scanning Time-Resolved Emission (S-TRE) microscope or system includes an optical system configured to collect light from emissions of light generated by a device under test (DUT). A scanning system is configured to permit the emissions of light to be collected from positions across the DUT in accordance with a scan pattern. A timing photodetector is configured to detect a single photon or photons of the emissions of light from the particular positions across the DUT such that the emissions of light are correlated to the positions to create a time-dependent map of the emissions of light across the DUT. Updating the time-dependent map of the emissions based on variable dwell times at respective locations of the DUT.

Abstract: The invention relates to a contacting module (1) by means of which the individual electrical and optical inputs and outputs (AoC) of optoelectronic chips (2) are connected to the device-specific electrical and optical inputs and outputs of a test apparatus. It is characterized by a comparatively high adjustment insensitivity of the optical contacts between the chips (2) and the contacting module (1), which is achieved, for example, by technical measures which result in the optical inputs (EoK) of the chip (2) or on the contacting module (1) being irradiated in every possible adjustment position by the optical signal (So) to be coupled in.

Abstract: Embodiments according to the invention can provide methods of testing a SiC MOSFET, that can include applying first and second voltage levels across a gate-source junction of a SiC MOSFET and measuring first and second voltage drops across a reverse body diode included in the SiC MOSFET responsive to the first and second voltage levels, respectively, to provide an indication of a degradation of a gate oxide of the SiC MOSFET and an indication of contact resistance of the SiC MOSFET, respectively.

Abstract: A testing apparatus for measuring a strength of a chip includes: a cassette mounting base on which to mount a cassette capable of accommodating wafer units; a frame fixing mechanism that fixes an annular frame of the wafer unit; a conveying mechanism that conveys the wafer unit between the cassette and the frame fixing mechanism; a pushing-up mechanism that pushes up a predetermined chip included in the wafer supported by the annular frame fixed by the frame fixing mechanism; a pick-up mechanism having a collet picking up the chip pushed up by the pushing-up mechanism; a strength measuring mechanism having a support unit supporting the chip picked up by the collet; and a collet moving mechanism that moves the collect from a position facing the pushing-up mechanism to a position facing the support unit.

Abstract: There is provided an inspection apparatus, including: a housing having an upper surface on which an interface part for electrical connection with a probe card is provided; a first frame configured to be movable to a connection position where the first frame covers an upper portion of the interface part and to a retraction position where the first frame is retracted from the upper portion of the interface part; and a second frame configured to support a test head, arranged inside the first frame, and held by the first frame so as to be switchable between a fixed state in which the second frame is fixed to the first frame and a movable state in which the second frame is movable at least in a direction parallel to the interface part at the connection position.

Abstract: A testing apparatus includes multiple testing units arrayed in a first axial direction in plan view, the multiple testing units being configured to respectively press probes against electronic devices on chucks to test the electronic devices, multiple gas circulating units respectively disposed in areas each corresponding to one or more testing units among the multiple testing units, the multiple gas circulating units respectively including first fans configured to circulate a gas in the areas along a second axial direction in plan view, multiple temperature detecting units configured to respectively detect temperatures of the chucks, and a controller configured to control drive of the first fans of the multiple gas circulating units based on the detected temperatures of the chucks.

Abstract: A system for locating an underground utility line using a beacon positioned within a downhole tool. The beacon comprises a magnetic sensor formed from one or more ferrite rods. The rods are arranged such that no rod is orthogonal to the longitudinal axis of the beacon housing. The magnetic sensor detects the presence of an underground utility line and sends a signal to an above-ground tracker indicating that a line has been detected. An above-ground locator may be used to determine the position of the line relative the beacon, so that the downhole tool may be steered away from the line.

Abstract: An inspection method includes a step S20 of electrically connecting electrical signal terminals of a semiconductor device to electric connectors, and optically connecting optical signal terminals of the semiconductor device to optical connectors, a step S30 of measuring a test light output signal output from a monitoring element provided in an inspection object in response to a test input signal having been input to the monitoring element while adjusting conditions of a position and an inclination of the inspection object, and extracting conditions in which an optical intensity of the test light output signal is a predetermined determination value or greater as inspection conditions, and a step S40 of inspecting the semiconductor device under the inspection conditions.

Abstract: A plurality of plate pairs that includes at least three plate pairs are positioned over a surface of the composite object. A resistance of a plurality of plies in the composite object is measured in at least three different fiber orientations. Each of the at least three different fiber orientations is measured via a corresponding one of the at least three plate pairs.

Abstract: Provided is a live measurement method for three-winding transformer loss based on windowed frequency shift. The method includes: step 1: providing an improved live calculation equation of a three-winding transformer loss; step 2: processing a collected x(t) signal by windowed frequency shift calculation; step 3: solving an amplitude and a phase of the collected x(t) signal via discrete Fourier transform of a frequency shift signal; and step 4: calculating a no-load loss and a load loss of a three-winding transformer.

Abstract: Various approaches can be used to interrogate a surface such as a surface of a layered semiconductor structure on a semiconductor wafer. Certain approaches employ Second Harmonic Generation and in some cases may utilize pump and probe radiation. Other approaches involve determining current flow from a sample illuminated with radiation. Decay constants can be measured to provide information regarding the sample. Additionally, electric and/or magnetic field biases can be applied to the sample to provide additional information.

Abstract: A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.

Abstract: An encoder and a signal processing method are disclosed. The method includes: receiving an analog signal, and generating a filtered analog signal by an analog filter according to the input signal and a first frequency indication signal; generating a digital signal by an analog-to-digital converter according to the filtered analog signal; generating a filtered digital signal by a digital filter according to the digital signal and a second frequency indication signal; generating a seventh signal and an eighth signal by a dynamic offset calibration unit according to the filtered digital signal and a period indication signal; and generating a position information by a position detection unit according to the seventh signal and the eighth signal. The first frequency indication signal, the second frequency indication signal and the period indication signal are generated by a frequency generation module according to the filtered analog signal or the digital signal.

Abstract: Disclosed is a directional coupler having a coupler, a forward resistive attenuator, a reflected resistive attenuator, a forward compensation capacitor, and a reflected compensation capacitor. A forward coupler side arm and reflected coupler side arm of the coupler are configured to obtain a sample of forward energy and a sample of reflected energy from the coupler transmission line section. The forward resistive attenuator and reflected resistive attenuator are configured to attenuate the sample of forward energy and the sample of reflected energy. The forward compensation capacitor and the reflected compensation capacitor are configured to receive the attenuated sample of forward energy and the attenuated sample of reflected energy and produce a frequency-compensated sample of forward energy and a frequency-compensated sample of reflected energy.

Abstract: Embodiments relate to MRI coils with a reduced number of baluns. One example embodiment is a MRI coil comprising: a plurality of coil elements in one or more groups of coil elements, wherein each group of coil elements comprises at least two coil elements and a shared trace comprising portions of associated traces of each coil element of that group RF shorted together, and wherein, for each coil element of that group, the shared trace of the group is RF shorted to a shield of an associated coaxial cable for that coil element; and one or more baluns, wherein, for each group of coil elements, at least one balun of the one or more baluns is configured to mitigate leakage current on the coaxial cable of each coil element of that group of coil elements.

Abstract: A low-profile passive slide screw load pull tuner is used on-wafer, especially in millimeter-wave frequencies from 25 to 110 GHz and above. It uses special rotating tuning probes insertable in a short slabline mounted inside the tuner housing, which holds the control gear. The tuner is mounted at an angle matching the angle of the wafer-probe, is connected directly of the wafer-probe and ensures optimum reflection factor tuning range.

Abstract: A test system includes: a test board on which a plurality of test target devices are mounted while being sequentially connected to one another; a measuring apparatus configured to simultaneously execute direct current tests for the test target devices mounted on the test board; and a determining apparatus configured to determine whether or not the test target devices are acceptable. The measuring apparatus executes the direct current tests every time when the number of test target devices mounted on the test board changes. The measuring apparatus determines whether or not the test target devices are acceptable on the basis of a change between measured values of the direct current tests, which follows the change of the number of test target devices mounted on the test board.

Abstract: An apparatus for detecting a presence of an object includes an inductive sensing coil that is configurable to generate a first magnetic field. The inductive sensing coil is configured to have an electrical characteristic that is detectable when generating the first magnetic field. The electrical characteristic is configured to vary as a function of a second time-varying magnetic field simultaneously applied to the object. The apparatus comprises a controller configured to detect a change in the electrical characteristic and determine a presence of the object based on the detected change in the electrical characteristic. The electrical characteristic comprises one or more of an equivalent resistance, an equivalent inductance, an equivalent impedance, and an impulse response of the inductive sensing coil. The object comprises one or more of a ferromagnetic object, a metallic film and a metallic foil.

Abstract: A chip tray kit and a chip testing apparatus are provided. The chip testing apparatus includes the chip tray kit. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The tray includes a plurality of tray thru-holes, the chip fixing members are detachably fixed to the tray, and the chip fixing members are correspondingly arranged in the tray thru-holes. Each of the auxiliary insertion members is detachably fixed to a side of the chip fixing member, a portion of each of the auxiliary insertion members is arranged in a fixing thru-hole of the chip fixing member, and each of the auxiliary insertion members can limit a movement range of a chip in a chip accommodating slot of the chip fixing member.

Abstract: An online automatic measurement system for a claw-pole overall magnetic property comprising: a feeding part, a claw-pole overall magnetic property measurement unit, and a discharging part disposed in sequence, and a robotic arm disposed there among. The robotic arm receives an operation instruction output by a control unit to grab claw poles to be measured in sequence and removes measured claw poles on the claw-pole overall magnetic property measurement unit. The claw-pole overall magnetic property measurement unit outputs a control power supply to the claw-pole overall magnetic property measurement unit according to the instruction of the control unit, receives an induction current of the measured claw poles, and output a measurement result to the control unit.