Abstract: A horizontal surface cover with a cover plate, at least one opening, and at least one access door. The cover plate is configured to cover an electrical device within an electrical box. The at least one opening extends through the cover plate and is sized to allow access to the electrical device through the at least one opening. The at least one access door is sized and shaped to fit within the at least one opening, and has a hinge with a hinge axis. The at least one access door is configured to translate along the hinge axis and rotate about the hinge axis to move between a closed position and an open position. The at least one access door is aligned with and inside of the at least one opening when in the closed position, and is misaligned with the at least one opening when in the open position.

Abstract: Electric field grading compositions comprise a particulate cupric oxide dispersed in a matrix material, wherein the electric field grading composition has a threshold voltage, a breakdown voltage, and exhibits a reversible electric field switchable current-voltage relationship that substantially follows the equation: I=kV? wherein: I is current in amperes; k is a constant greater than 0; V is applied voltage in volts, wherein V is between the threshold voltage and the breakdown voltage, inclusive; and ? is a real number greater than 1. The electric field grading composition is useful for reducing electric field stress at a joint or termination of a conductive substrate. Articles including the electric field grading disposed on a surface of a conductive substrate are also disclosed.

Abstract: An electrical assembly, such as a multi-layer bus bar, includes an electrical connection pin and a plurality of electrically conductive layers. Each of the electrically conductive layers is formed to define a cutout therein to receive the electrical connection pin and allow access for joining material to join the electrical connection pin with the plurality of electrically conductive layers. Each of the cutouts is formed to include a first through hole arranged around the electrical connection pin and a second through hole located radially outward of the first through hole.

Abstract: The present disclosure provides a flexible circuit board and a display panel. The flexible circuit board is in a non-display region of a display panel and provided with a driving circuit for driving the display panel thereon. The flexible circuit board includes a first main body portion, a second main body portion, and a foldable portion, and the foldable portion is between the first main body portion and the second main body portion. The foldable portion is capable of being bent to fold the second main body portion such that the second main body portion overlaps the first main body portion.

Abstract: A coil component includes a base body containing metal magnetic particles and a binder binding together the metal magnetic particles and having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode, a second external electrode, and a coil conductor electrically connected to the first and second external electrodes. In one embodiment, the coil conductor has a winding portion, the winding portion has first conductor portions and one or more second conductor portions smaller in number than the first conductor portions. The first and second conductor portions alternate with and are connected to each other. A ratio of a first distance between the first conductor portions and the first surface to a second distance between the second conductor portions and the second surface is from 0.5 to less than 1.

Abstract: Apparatus and methods for aligning circuit boards (e.g., for LIDAR systems) are disclosed. According to one embodiment, an electronic device comprises a secondary device and a coupling device coupled to the secondary device. The coupling device comprises a plurality of conductive members, including a first conductive member and a second conductive member. Each of the conductive members comprises a first end configured to electrically and mechanically couple to a primary circuit board and a second end electrically and mechanically coupled to the secondary device. Each of the plurality of conductive members has an attribute adjustable in response to a condition being added to the respective conductive member, and is configured to maintain the adjusted attribute after the condition is removed.

Abstract: A flexible printed circuit board according to an aspect is a flexible printed circuit board including a base film and a wiring layer disposed on at least one surface of the base film and having a plurality of wiring lines. The wiring lines have an average line width of 30 ?m or less and an average spacing of 30 ?m or less. The wiring lines have a copper-based plating layer. The copper-based plating layer has an electrical resistivity of more than 1.68×10?8 ?·m.

Abstract: A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.

Abstract: An imaging unit includes: a semiconductor package including an optical system, an imaging sensor, and connection terminals; a rigid substrate including first connection lands respectively connected to the connection terminals; and an electronic component mount region including second connection lands on which a capacitor is mounted, and an inner lead mount region including third connection lands; and a flexible printed board including inner leads extended from one end of the flexible printed board in a bent manner and respectively connected to the third connection leads in the inner lead mount region; and cable connection leads arranged on another end of the flexible printed board and respectively connected to the inner leads. The rigid substrate and the flexible printed board are arranged in a projection plane in an optical axis direction of the semiconductor package. The third connection lands are arranged along one side of the rigid substrate.

Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, and a plurality of filled vias. The first insulating layer has a first surface and a second surface positioned on a side opposite to the first surface. The first conductor layer is formed on the first surface of the first insulating layer. The plurality of filled vias are formed inside the first insulating layer. The plurality of filled vias each have a structure in which a via hole penetrating the first insulating layer is filled with a metal. The first conductor layer includes a pad. The pad overlaps the plurality of filled vias in a plan view from a thickness direction of the first insulating layer and is connected to the plurality of filled vias.

Abstract: An apparatus includes a switch cabinet and a device housing. The device housing is adapted to accommodate a component of a device and the switch cabinet is adapted to accommodate electrical equipment for the device. The switch cabinet is operable to be moved between an open position and a closed position relative to the device housing. When in the closed position a wall of the switch cabinet closes off an opening in the device housing, and when in the open position the wall of the switch cabinet is removed from the opening in the device housing so as to expose that opening.

Abstract: An antistatic flexible hose, including: a hose body which is formed of a soft material having flexibility; a conductive layer which is provided along an outer peripheral face of the hose body in an axial direction; a conductive wire which is wound in a spiral shape along the outer peripheral face of the hose body and an outer surface of the conductive layer and which is provided so as to be pressure-welded, in a radial direction, to the outer peripheral face of the hose body and the outer surface of the conductive layer; and a reinforcing member which is provided in a spiral shape along the conductive wire so as to protrude from the outer peripheral face of the hose body and the outer surface of the conductive layer.

Abstract: An apparatus includes a strength member including a core formed of a composite material, and an encapsulation layer disposed around the core. A conductor layer is disposed around the strength member. A coating is disposed on the conductor layer. The coating is formulated to have a solar absorptivity of less than 0.5 at a wavelength of less than 2.5 microns, and a radiative emissivity of greater than 0.5 at a wavelength in a range of 2.5 microns to 15 microns, at an operating temperature in a range of 60 degrees Celsius to 250 degrees Celsius. The coating may have an erosion resistance that is at least 5% greater than an erosion resistance of aluminum or aluminum alloys.

Abstract: A grounding bushing with a central opening for electrically grounding a conduit, electrical metal tubing (EMT), or a pipe. The grounding bushing includes a stationary bushing portion and a rotatable bushing portion having slotted ends held together by mounting fasteners. The slotted ends permit rotation of the rotatable bushing portion away from the stationary bushing portion. After attachment to a conduit or similar structure, one or more mounting fasteners can be loosened to allow installation of additional wires through the central opening and into the conduit, EMT, or pipe. An electrically insulated liner extending around the entire inner periphery of the bushing prevents chafing or abrasion of any electrical wires by the end of the conduit.

Abstract: A composite cable is provided with plural wires each having a metal conductor and an insulator, a binder layer that bundles the plural wires together, a shield layer composed of a metal conductor and arranged around the binder layer, and a sheath covering around the shield layer. An outer diameter of the sheath is 2.0 mm or less. An amount of the metal conductor per unit length used in the shield layer is 0.4 times or more and 0.7 times or less than an amount of the metal conductor per unit length used in the plural wires.

Abstract: A method for milling flex foil includes providing a web of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a first cliché pattern including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a second cliché pattern including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

Abstract: A DC/DC converter component has a reduced mounting area and includes an inductor component; a semiconductor integrated circuit including a switch circuit connected to the inductor component, and a control circuit that controls the switch circuit; and a package substrate, to which the semiconductor integrated circuit is mounted, having a mounting face that opposes an other substrate when the package substrate is mounted to the other substrate. The inductor component includes an element body, and a plurality of inductor wiring lines, each extending in the element body and in parallel with a main face of the element body. A value of inductance of a second inductor wiring line is 10% or more greater than a value of inductance of a first inductor wiring line. The inductor component has a dimension equal to or less than 0.25 millimeters in a thickness direction, and is mounted to the package substrate.

Abstract: An electronic board includes: a board including an upper surface ground on an upper surface; at least one first land formed on the upper surface and connected to a first signal line; at least one second land formed on the upper surface and connected to a second signal line; at least one third land disposed on the upper surface between the first land and the second land and connected to the upper surface ground; and at least one fourth land disposed on the upper surface on a side opposite to the third land and connected to the upper surface ground, the first land being interposed between the third land and the fourth land.

Abstract: The present invention relates to a device for dispensing a wire management system which can include a dispenser housing. A kit includes the device for dispensing a wire management system, a base and a cover. The base and cover can be individually dispensed from the dispenser housing. After dispensing of a desired length of the base and/or the cover, the respective end of the base and or cover can be pushed back into the dispenser housing to recoil the base and/or the cover back into the dispenser housing.