Abstract: A snap-in zip connector with a clamp for gripping a wire between a first bracket and a second bracket. The first bracket includes a clamp seat and a first fastener opening formed by an elongated slot and hole joined together and extending through the clamp seat. The second bracket includes a fastener opening that aligns with the hole. An insert positioned in the elongated slot includes a spring arm extending into the circular hole extend into the circular hole that engages a threaded shaft of the fastener to restrict removal except through rotation of the at least one fastener.

Abstract: A circuit board has a main board with a base material of insulating material, at least one metal base copper clad laminate, and each metal base copper clad laminate is provided with at least one component and a pin connected with the main board. The circuit board and the driving power supply with the circuit board have simple structure and low manufacturing cost, and are convenient for automatic manufacturing. The power device can be directly mounted on the metal substrate through the automation equipment, so that the metal substrate can realize the function of the heat sink, thereby improving the production efficiency and reducing the process quality hidden danger; at the same time, the grounding problem of the metal substrate is solved, and the EMC problem is avoided.

Abstract: A signal transmission circuit packaging structure is disclosed. The signal transmission circuit packaging structure includes a body, a main circuit unit, power pins, input pins, output pins, control pins and ground pins. The main circuit unit is arranged in the center of the body. The power pins are arranged in the center of the body. The input pins are arranged at a first side of the body and are electrically connected to the main circuit unit. The output pins are arranged at a side of the body opposite to the first side and are electrically connected to the main circuit unit. The control pins are arranged at a second side of the body and are electrically connected to the main circuit unit. The ground pins are arranged at corners of the body to separate the input pins, the output pins and the control pins.

Abstract: A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.

Abstract: An expansion card having a mezzanine level communication port is disclosed herein. The mezzanine level communication port frees space on the primary substrate (e.g., printed circuit board) for any one or more of a variety of expansion card components. The expansion card includes a bracket, a first communication port, a primary substrate, and a secondary substrate. The first communication port is coupled to the bracket. The primary and secondary substrates are disposed on one side of the bracket. The secondary substrate has a termination of the first communication port.

Abstract: A waterproof seal for electrical assemblies wherein an outer sheath of an electrical cable is removed to expose the wires and the insulation is removed from the wires to form a window of exposed electrical conductor, the electrical conductors being maintain apart from each other and contained in a cover that may comprise a connector, an epoxy applied to the electrical conductors to fill in all the space in and around the electrical conductors and the cover to form a waterproof seal that prevents water from wicking past the waterproof seal via an interior of the electrical cable.

Abstract: Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

Abstract: The purpose of the present disclosure is to provide electro-conductive particles and a signal-transmitting connector having same, wherein the electro-conductive particles are improved to prevent the phenomenon of irregular scrub between the electro-conductive particles and to have improved signal delivery characteristics. Electro-conductive particles according to the present disclosure are provided on a signal-transmitting connector having multiple electroconductive portions supported by an insulating portion made of an elastic insulating material to be spaced apart from each other such that the signal-transmitting connector can be connected to an electronic component and can transmit electric signals.

Abstract: A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.

Abstract: An electronic device according to various embodiments of the disclosure may include a printed circuit board constructed with a layered structure of a plurality of boards, and may include, among the plurality of boards, a circuit board constructed around a first region to which an acoustic component is disposed, and having at least one slit constructed to block a low-frequency band noise.

Abstract: A flexible printed circuit board includes: a substrate; and a circuit pattern disposed on the substrate, wherein the substrate includes a chip mounting region, and the circuit pattern includes a wiring portion and a pad portion, wherein the circuit pattern includes: a first circuit pattern including a first-first pad portion disposed inside the chip mounting region, a first-second pad portion disposed outside the chip mounting region, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and extending in a first direction based on the chip mounting region; a second circuit pattern including a second-first pad portion disposed inside the chip mounting region, a second-second pad portion disposed outside the chip mounting region, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and extending in a second direction; and a third circuit pattern including a plurality of third pad portions disposed inside the ch

Abstract: A high-frequency board includes an insulating substrate, a first line conductor, a second line conductor, a capacitor, a first bond, and a second bond. The insulating substrate has a recess on its upper surface. The first line conductor extends from an edge of the recess on the upper surface of the insulating substrate. The second line conductor faces the first line conductor across the recess on the upper surface of the insulating substrate. The capacitor overlaps the recess. The first bond joins the capacitor to the first line conductor. The second bond joins the capacitor to the second line conductor, and is spaced from the first bond.

Abstract: A printed circuit board includes a front layer including frame ground regions on which connectors to be connected with external apparatuses or communication cables are mounted and which are connected with a ground, a signal ground region which is separated from the frame ground regions at the front layer, on which electronic devices configured to receive signals from the connectors are mounted, and which is connected with a ground, and a static electricity removal ground region separated from the frame ground regions and the signal ground region at the front layer, situated outside the frame ground regions, and connected with a ground.

Abstract: A magnetic data cable includes a cable body and data connectors. The data connectors are respectively connected to two ends of the cable body. The cable body includes a cable core and a wrapping material layer wrapped around the cable core. At least one layer of the wrapping material layer is a magnetic material layer. When the magnetic data cable is wound into coils, each two adjacent coils arranged from top to bottom or each two adjacent coils arranged from left to right are magnetically attracted to each other by the magnetic material layer. Since the magnetic material layer is integrally distributed in the wrapping material layer, so the cable body 100 is magnetic and it is easy and simple to adjust a diameter of the coils by winding.

Abstract: A circuit board may include a traditional via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board and a slotted via formed within the circuit board proximate to the traditional via, the slotted via comprising an opening through a first surface and a second surface of the circuit board and a layer of conductive material formed on interior walls of the opening.

Abstract: An electronics box for insertion into a wall box includes a housing having a top surface, a bottom surface, a rear surface, at least one side surface, and an intermediate surface disposed part way between the top surface and the bottom surface and extending inward from the at least one side surface. A chamfer surface is disposed between an edge of the bottom surface and an edge of the rear surface, and is disposed at a particular angle with the respect to the bottom surface and has a particular length. The particular angle and the particular length are selected such that the housing is able to be tilted and then inserted into the wall box with the chamfer surface clearing the wall box.

Abstract: A printed circuit board includes: a first substrate including a first cavity and first circuit units; and a second substrate disposed in the first cavity of the first substrate with an electronic component disposed therein, and including second circuit units having a higher density than the first circuit units, wherein the second substrate includes a first region and a second region, the first region of the second substrate includes an outermost circuit layer among the second circuit units, and circuit layers in the first region of the second substrate have a higher density than circuit layers in the second region of the second substrate.

Abstract: An automation field device comprises a housing that surrounds an inner space; a sensor- and/or actuator element arranged at the housing; an electronic circuit arranged in the housing and having a round, outer contour and a plurality of spring contacts in an edge region. The inner contour of the housing and the edge contour of the first circuit board are adapted to one another so that the first circuit board is introducible into the housing with a main plane orthogonal to a longitudinal axis of the housing. The spring contacts are so arranged on the first circuit board and embodied to hold the first circuit board in the inner space and to produce an electrical connection between the first circuit board and the housing to drain away disturbance currents from the first circuit board.

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.