Patents Examined by Hoa C. Nguyen
  • Patent number: 11740419
    Abstract: Provided is an optical subassembly, which is compact, is easy to manufacture, and has satisfactory high-frequency characteristics. The optical subassembly includes: an eyelet including a first surface, a second surface and a plurality of through-holes; a plurality of lead terminals; a relay substrate including a lead connection surface and a first bonding surface and having first and second conductor patterns formed across the lead connection surface and the first bonding surface; a device mounting unit including a second bonding surface having formed thereon third and fourth conductor patterns; and an optical device configured to convert one of an optical signal and the differential electrical signals into the other. The first and second conductor patterns on the first bonding surface are connected to the third and fourth conductor patterns by bonding wires, respectively, and the first and second bonding surfaces have normal directions in the same direction.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 29, 2023
    Assignee: CIG PHOTONICS JAPAN LIMITED
    Inventors: Daisuke Noguchi, Hiroshi Yamamoto
  • Patent number: 11735336
    Abstract: A wiring body includes a wire-like transmission member and a base member to which the wire-like transmission member is fixed. A temporary joint part joins portions where a first part and a second part mutually extending in an opposite side from a bending position in the wiring body overlap with each other in a state where the wiring body is bended in an intermediate portion of the wire-like transmission member in an extension direction to maintain a bending state of the wiring body. The temporary joint part is formed to be able to resolve a state of joining the first part and the second part by a relative separation movement of the first part and the second part.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 22, 2023
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Haruka Nakano, Motohiro Yokoi, Kenta Ito, Takuya Kaba, Suguru Yasuda, Makoto Higashikozono
  • Patent number: 11735335
    Abstract: A water stop structure for a shield cable includes a lead-in port formed in a sheet metal of a housing, a grommet to be liquid-tightly fitted into the lead-in port, a shield shell disposed outside the housing so as to surround the grommet and with an end portion of a braid of the shield cable being crimped, and a spacer configured to adjust an attachment height of the shield shell with respect to the sheet metal so as to fasten the shield shell to the sheet metal in a state where conduction is ensured.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: August 22, 2023
    Assignee: YAZAKI CORPORATION
    Inventor: Yuji Okada
  • Patent number: 11729913
    Abstract: A display device includes a display panel including a front surface and a rear surface, a first circuit board electrically connected to a first side of the display panel, a second circuit board electrically connected to a second side opposite to the first side of the display panel, a third circuit board disposed on the rear surface and electrically connected to the first circuit board and the second circuit board, the third circuit board extending in a first direction, and a support plate disposed on the rear surface. The display panel is foldable along a folding line extending in a second direction. The support plate has a first opening extending along the folding line, and an opening pattern near a portion of the first opening. The third circuit board overlaps the portion of the first opening. The opening pattern includes slits and the third circuit board overlaps the slits.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: August 15, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung Hwa Ha, Ja Seung Ku, Seung-Ho Jung, In-Woo Jeong
  • Patent number: 11728069
    Abstract: A coaxial cable 10 includes a hollow-core-body 1 having an integral structure of thermoplastic resin including an inner annular portion 2 that insulation-coats an inner conductor 12, a plurality of rib portions 3 that radially extend from the inner annular portion 2, and an outer annular portion 4 that is connected to outer ends of the rib portions 3; three or more gap portions 5 surrounded by the inner annular portion 2, the rib portions 3, and the outer annular portion 4; and outer side reinforcing portions 7 being formed on both sides of an outer end in the rib portion 3, in which a size ratio of a minimum value W1 of a rib width in the rib portion 3 and a maximum value W2 of the rib width in the rib portion 3 is within a range of 1:1.6 to 1:3.0.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: August 15, 2023
    Assignee: TOTOKU ELECTRIC CO., LTD.
    Inventors: Takeyasu Nakayama, Hiroto Imamura, Satoshi Yamazaki
  • Patent number: 11728090
    Abstract: Micro-scale devices, such as transformers and capacitors, having a floating conductive layer are disclosed. A floating conductive layer may be disposed in an insulator layer and can reduce a maximum electric field between a first planar conductor and a second planar conductor of a micro-scale passive device. Reduction of a maximum electric field between a first planar conductor and a second planar conductor can reduce undesirable effects on electrical components.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: August 15, 2023
    Assignee: Analog Devices International Unlimited Company
    Inventors: Patrick M. McGuinness, Paul Lambkin, Laurence B. O'Sullivan, Bernard Patrick Stenson, Steven Tanghe, Baoxing Chen
  • Patent number: 11728071
    Abstract: The present disclosure relates to a cable assembly including a sleeve and a plurality of cables that extend through the sleeve. The cable assembly also includes a grommet positioned within the sleeve at a location offset from one end of the sleeve. The grommet forms a dam location. The cable assembly further includes a bonding material at least partially filling a region of the sleeve located between the dam location and the end of the sleeve. The bonding material bonds the fiber optic cables and the grommet relative to the sleeve. The cables extend through the grommet and the bonding material and include break-out portions that extend outwardly beyond the end of the sleeve.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: August 15, 2023
    Assignee: CommScope Technologies LLC
    Inventors: Oscar Fernando Bran De León, Thomas Marcouiller
  • Patent number: 11728070
    Abstract: An adapter probe configured for injecting fluid (e.g., liquid, gas) into at least one electrical cable. Particularly for injecting an electrical cable with a fluid when the electrical cable is affixed to a separable connector (e.g., elbow separable connector). Separable connector may be configured to connect sources of energy (e.g., transformer, circuit breaker) with distribution systems via electrical cable (or cable section).
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: August 15, 2023
    Assignee: Instrument Manufacturing Company
    Inventors: Benjamin Thomas Lanz, Wayne J. Chatterton, Matthew Helm Spalding, Charles William Shannon
  • Patent number: 11723149
    Abstract: A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: August 8, 2023
    Assignee: Kioxia Corporation
    Inventor: Stephen Pardoe
  • Patent number: 11723144
    Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: August 8, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 11721468
    Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwi Jong Lee, Jung Min Kim, Sung Jin Huh, Jin Hyuck Yang, Jae Wook Lee, Ji Hyun Eom
  • Patent number: 11721966
    Abstract: There is provided a supporting member having excellent durability and an apparatus including the supporting member. The supporting member includes an elastic member and a plurality of block members formed thereon. The supporting member is deformable from a shape in which end surfaces of the block members are in contact with each other to a shape in which the end surfaces are separated from each other. The elastic member includes a fixed region whose deformation is restricted by being fixed to a bottom surface of the block member, and the supporting member includes a flexure reduction unit for reducing flexure at a position near the fixed region of the elastic member.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: August 8, 2023
    Assignee: JUNKOSHA INC.
    Inventors: Daiki Hiraoka, Hiroshi Takeuchi, Yasuhiro Misu, Tetsuya Hirose
  • Patent number: 11711888
    Abstract: A power line structure includes a dielectric layer, a first conductive component, a second conductive component, and a third conductive component. The first conductive component is disposed at a first side of the dielectric layer. The second conductive component is disposed at the first side of the dielectric layer. The third conductive component is disposed at the first side of the dielectric layer and between the first conductive component and the second conductive component. Each of the voltage of the first conductive component and the second conductive component is equal to a ground voltage. The third conductive component is configured to receive a first power voltage.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: July 25, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chun-Ming Huang, Ruey-Beei Wu, Shih-Hung Wang, Ting-Ying Wu, Ming-Chung Huang
  • Patent number: 11706867
    Abstract: A system is described for providing an electrical ground connection for a circuit assembly. The system may include a housing for the circuit assembly, the housing having an electrically conductive fixation member configured for attachment to an electrically conductive element outside the housing. The system may also include an electrically conductive feature having a first end and a second end, the first end configured to cooperate with the electrically conductive fixation member inside the housing and the second end configured for attachment to the circuit assembly. Attachment of the electrically conductive fixation member to the electrically conductive element outside the housing enables an electrical ground connection for the circuit assembly via the electrically conductive feature.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: July 18, 2023
    Assignee: LEAR CORPORATION
    Inventors: Joan Balana Avila, Josep Maria Combalia, Gloria Simo Quinonero, Jordi Angel Serrano
  • Patent number: 11703913
    Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member may include: a first supporter and a second supporter overlapping with the non-folding portions; and an adhesive member attaching the display module to the second supporting member.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: July 18, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Changmin Park, Sangwol Lee, Kyungmin Choi
  • Patent number: 11703912
    Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member includes: a first supporter and a second supporter overlapping with the non-folding portions; and a plurality of supporting units overlapping with the folding portion.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: July 18, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Changmin Park, Sangwol Lee, Kyungmin Choi
  • Patent number: 11700694
    Abstract: An electronic device is disclosed, which includes: a support unit; a display panel disposed on the support unit; a first circuit board, wherein the support unit is disposed between the display panel and the first circuit board; an electronic component disposed on the first circuit board; and a second circuit board electrically connected to the display panel, wherein the second circuit board includes a first portion and a second portion, and the support unit is disposed between the first portion and a second portion, wherein the first circuit board is electrically connected to the display panel through the second circuit board.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: July 11, 2023
    Assignee: INNOLUX CORPORATION
    Inventors: Chun-Lung Tseng, Hsin-Hung Chen
  • Patent number: 11700711
    Abstract: According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: July 11, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chung-Hyo Jung, Kang-Sik Kim, Young-San Kim, Won-Min Kim, Chi-Hyun Cho
  • Patent number: 11696408
    Abstract: A circuit board includes a substrate having an end surface, and a principal surface on which an electronic component is mounted, a first region, provided on the principal surface, and coated with a moistureproof agent, a second region, provided on the principal surface, and prohibited from being coated with the moistureproof agent, and a groove having two ends, formed in the principal surface, between the first region and the second region. The two ends of the groove reach the end surface of the substrate. The groove includes a guiding part, configured to guide the moistureproof agent overflowing from the first region into the groove, provided at a portion of the groove farthest away from the end surface.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: July 4, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kenichi Mori
  • Patent number: 11690189
    Abstract: A fluid measuring or fluid control device has a housing the housing parts of which are fastened to each other by at least one screwed connection, in which a screw engages through an opening in a peripheral wall of the first housing part and is screwed into a threaded opening in the second housing part. An elastic seal is arranged between the housing parts. The first housing part has a first resting face, and the second housing part has a second resting face which are both in peripherally circumferential contact with the seal. The screw shank and an edge of the opening have cooperating frustoconical surfaces which are oriented such that the second housing part is displaced in the direction towards the first housing part when the screw is screwed into the threaded opening, the resting faces coming into contact with the seal.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: June 27, 2023
    Assignees: Buerkert Werke GmbH & Co. KG, Burkert S.A.S.
    Inventors: Jan Magnussen, Lukas Ungerer, Markus Herrmann, Jürgen Wiedemann