Abstract: A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

Abstract: An interposer for a processor includes: an electrically insulating material having a first main side and a second main side opposite the first main side; an electrical interface for a processor substrate at the first main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material to a lower voltage. The power device module has at least one contact configured to receive the voltage provided at the second main side of the electrically insulating material. Distribution circuitry embedded in the electrically insulating material is configured to carry the lower voltage provided by the power device module to the first main side of the electrically insulating material.

Abstract: Provided is a sheet-like device suitable for a flexible electrical product that is robust, highly flexible, and operates stably. The sheet-like device includes a first part where a first film layer, a first conversion unit, and a second film layer overlap, a second part where the first film layer is absent and the second film layer is present, and a third part where the first film layer, a second conversion unit, and the second film layer overlap. The first part the second part, and the third part are arranged side by side in this order in a first direction. A first region including the first part the second part, and the third part has an elongation per unit length greater than an elongation per unit length of the first film layer alone when a same force is applied in the first direction at 20° C.

Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.

Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member may include: a first supporter and a second supporter overlapping with the non-folding portions; and an adhesive member attaching the display module to the second supporting member.

Abstract: A junction assembly is disclosed herein. The junction assembly includes a junction housing configured to support a phase bar assembly. A heatsink contacts at least a portion of the junction housing and a busbar is arranged adjacent to the junction housing. At least one fastener attaches the junction housing, the heatsink, and the busbar to each other. At least one heatsink seal is provided at an interface defined between the heatsink and the junction housing.

Abstract: A display module including non-folding portions and a folding portion disposed between the non-folding portions; a first supporting member disposed under the display module; and a second supporting member disposed between the display module and the first supporting member, wherein the first supporting member includes: a first supporter and a second supporter overlapping with the non-folding portions; and a plurality of supporting units overlapping with the folding portion.

Abstract: A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.

Abstract: A duct-bank stub-up assembly includes a first pre-formed stub-up module that comprises a first plurality of conduits and a first encasing body. For each of the first conduits, a first end of the conduit provides a mating end on a mating side of the first encasing body and a second end of the conduit provides a mating end on a top surface of the first encasing body. The assembly further includes a second pre-formed stub-up module that comprises a second plurality of conduits and a second encasing body formed to have a stub-up section and a footer section. For each of the second conduits, a first conduit end provides a mating end on a mating side of the footer section and a second conduit end provides a mating end on a top surface of the stub-up section. The first module is positioned on the footer of the second module.

Abstract: A stretchable wiring board that includes a stretchable substrate having a first main surface with a first region, a second region adjacent the first region, and a third region adjacent the second region; a first stretchable wiring line on the first main surface and extending over the first region; an insulating layer extending over the first region and the second region; and a second stretchable wiring line extending over the first region, the second region, and the third region. When a thickness of the insulating layer is defined as Z2, and when a minimum value of a length of the second region in an extending direction of the second stretchable wiring line in a plan view of the stretchable wiring board is defined as Y, Y>Z2.

Abstract: The present disclosure relates to a charging cable having a protective sleeve which extends to an extended position to protect the charging end of the cable. The protective sleeve may be retracted to a retracted position to reveal the charging end and allow the cable to be plugged into an electronic device. Various embodiments are disclosed in which the protective sleeve may be spring loaded by a single spring, by a plurality of springs, or it may be manually operated.

Abstract: A circuit board module includes a first circuit board, a second circuit board facing the first circuit board, a connecting device fixed between the first circuit board and the second circuit board, and an adapter board fixed to the connecting device and disposed between the first circuit board and the second circuit board. The adapter board is inserted into the first circuit board and the second circuit board.

Abstract: A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.

Abstract: A grounding elastic contact and an electronic device including the same. The grounding elastic contact includes an elastic core, and a double-sided polyethylene terephthalate (PET) tape, a polyimide (PI) film, and a conductive layer, where the PI film is laminated and bonded on an outer side of the double-sided PET tape; a middle region of the double-sided PET tape is attached to an upper surface of the elastic core; after passing through left and right sides of the elastic core respectively, two ends of the double-sided PET tape are laminated on a lower surface of the elastic core; the conductive layer includes one end bonded on the upper surface of the elastic core, and the other end passing through the left side of the elastic core; the double-sided PET tape includes a PET backing and an adhesive coated on two sides of the PET backing.

Abstract: A harness assembly may include a cable having a cable shielding around at least a portion of a plurality of wires, a connector with an integrated backshell arranged at an angle with respect to the cable, an external braid disposed around at least a portion of the backshell and the cable, and an overbraid around at least a portion of the external braid, the overbraid having two layers.

Abstract: A circuit board includes a first metal layer; a second metal layer that is arranged on the first metal layer; and a sealing resin with which a space between the first metal layer and the second metal layer is filled, wherein the second metal layer includes an electrode that protrudes from an upper surface of the sealing resin and that has an end face on which an electronic part is mountable; and an interlayer connector whose upper surface is exposed in a position lower than the end face of the electrode from the upper surface of the sealing resin and that makes contact with the first metal layer.

Abstract: Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.

Abstract: The present disclosure provides a foldable support, fabricating method thereof, and a display device. The foldable support includes a metal layer having a non-bending region and at least one bending region, where the metal layer includes a plurality of recessed portions at the at least one bending region, and at least one of sidewalls of the plurality of recessed portions is not perpendicular to a plane where the metal layer is located.

Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures.

Abstract: A coil component includes a body including a plurality of effective layers stacked in one direction; a coil portion embedded in the body, the coil portion including a plurality of coil patterns respectively disposed in the plurality of effective layers, the coil portion further including a lead-out pattern; and a core penetrating through an interior of the coil portion, wherein the coil portion further includes a resistance reducing portion extending from an outer circumferential surface of each of the coil patterns to an outside of the core in a respective one of the effective layers in a radially outward direction of the coil portion.