Patents Examined by Hoa C. Nguyen
  • Patent number: 11634842
    Abstract: An object is to solve problems associated with a stretchable wire member that includes, for example, a garment with stretchable wires formed thereon, that is, to solve the problems of wrinkles and undulations that often occur after the garment is stretched. A stretchable wire member includes a fabric; a base layer disposed on a surface of the fabric; a conductive layer disposed in part of the fabric, the conductive layer being on a surface of the base layer; and a protective layer covering the conductive layer. In the stretchable wire member, an elastic modulus E?3 of a multilayer body portion including the fabric, the base layer, and the protective layer ranges from 1 MPa to 6 MPa.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: April 25, 2023
    Assignee: SEKISUI POLYMATECH CO., LTD.
    Inventor: Takaya Kimoto
  • Patent number: 11630355
    Abstract: A display device is disclosed. The display device includes a display panel configured to display an image, and a printed circuit board electrically connected to the display panel and disposed at a back surface of the display panel. The printed circuit board includes an insulating layer, a first metal layer disposed at one surface of the insulating layer, pads including a first pad disposed on the first metal layer while being disposed inside a mounting area where an integrated circuit is mounted, and second pads disposed around the first pad, and a groove provided to extend from an inside of the mounting area to an outside of the mounting area.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: April 18, 2023
    Assignee: LG Display Co., Ltd.
    Inventors: Jeong-Kyu Lee, Dong-Won Park, Min-Gyu Park, Nam-Kon Ko
  • Patent number: 11631529
    Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: April 18, 2023
    Assignee: TDK CORPORATION
    Inventors: Takahiro Kawahara, Manabu Ohta, Kenei Onuma, Yuuya Kaname, Ryo Fukuoka, Hokuto Eda, Masataro Saito, Kohei Takahashi
  • Patent number: 11631970
    Abstract: A junction box includes a housing having a plurality of side wall portions, and a liquid detector including a first terminal portion and a second terminal portion. The junction box is disposed in a housing case housing a power storage module. The first terminal portion and the second terminal portion are directed toward a lower side of one of the side wall portions and drawn out from the inside of the housing to the outside of the housing.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 18, 2023
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuki Ohira, Yoshiki Yanagita, Yoshimasa Tanuma, Takumi Ejima, Tatsuya Fujisaka, Takayuki Takeuchi
  • Patent number: 11619212
    Abstract: Provided is an electric cable for a wind turbine, wherein the electric cable includes at least one cooling element) to cool the electric cable, wherein the cooling element protrudes from the surface of the electric cable.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: April 4, 2023
    Assignee: SIEMENS GAMESA RENEWABLE ENERGY A/S
    Inventor: Mahsa RafieeArashtnab
  • Patent number: 11622460
    Abstract: Hermetically sealed, hygienic electrical enclosures that do not require mechanical fasteners and methods of making the same. In some examples, an open housing is sealed with a cover using a seal that includes an arrangement of a gasket and a sealant. Once cured, the seal provides a hermetic seal between the housing and cover, providing a crevice-free device enclosure.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: April 4, 2023
    Assignee: Advanced Illumination, Inc.
    Inventor: John Thrailkill
  • Patent number: 11622448
    Abstract: Embodiments include package substrates and method of forming the package substrates. A package substrate includes a first encapsulation layer over a substrate, and a second encapsulation layer below the substrate. The package substrate also includes a first interconnect and a second interconnect vertically in the first encapsulation layer, the second encapsulation layer, and the substrate. The first interconnect includes a first plated-through-hole (PTH) core, a first via, and a second via, and the second interconnect includes a second PTH core, a third via, and a fourth via. The package substrate further includes a magnetic portion that vertically surrounds the first interconnect. The first PTH core has a top surface directly coupled to the first via, and a bottom surface directly coupled to the second via. The second PTH core has a top surface directly coupled to the third via, and a bottom surface directly coupled to the fourth via.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 4, 2023
    Assignee: Intel Corporation
    Inventors: Brandon C. Marin, Tarek Ibrahim, Srinivas Pietambaram, Andrew J. Brown, Gang Duan, Jeremy Ecton, Sheng C. Li
  • Patent number: 11616331
    Abstract: An adapter assembly including a power box that has a housing containing internal components, a longitudinal axis and a storage portion. The adapter assembly also includes a first cord coupled to and extending from the housing, an adapter including an engagement portion that is removably coupled to the storage portion of the housing and that selectively engages a power source-receiving portion of a tool, and a second cord having a first end coupled to the adapter and a second end coupled to the housing.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: March 28, 2023
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Dean Nowalis, David M. Schwalbach, Paul Rossetto, Brian Alves
  • Patent number: 11617257
    Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: March 28, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youngsun Lee, Eunseok Hong, Byeongkeol Kim, Jongmin Jeon
  • Patent number: 11612053
    Abstract: A circuit board includes a first circuit board portion and a second circuit board portion. The first circuit board portion is provided with a first transmission line for a low-frequency signal or a low-speed signal, and the second circuit board portion is provided with a second transmission line for a high-frequency signal or a high-speed signal. The second circuit board portion is located on the first circuit board portion in a positional relationship in which the first transmission line and the second transmission line are side-by-side with each other. With this structure, signal leakage and interference between different signals are reduced or prevented in a line that transmits signals with different frequencies and different transmission speeds.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: March 21, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuyuki Tenno, Takahiro Baba, Kuniaki Yosui, Yasuko Yoshinaga
  • Patent number: 11610711
    Abstract: An inductor component comprising a laminated body having a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the laminated body; and an external terminal exposed from the laminated body. The external terminal includes a metal part and a resin part, and in a cross section of the external terminal, the resin part is enclosed in the metal part.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: March 21, 2023
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshimasa Yoshioka, Kouji Yamauchi, Hironori Suzuki, Naoya Noo
  • Patent number: 11605480
    Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: March 14, 2023
    Assignee: SAMTEC, INC.
    Inventors: Shashi Chuganey, Yasuo Sasaki, Scott McMorrow, Francisco Noyola, Cindy Lee Diegel, James Alexander Moss
  • Patent number: 11602067
    Abstract: A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 7, 2023
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Joachim Seidl
  • Patent number: 11594348
    Abstract: A power cable or a hybrid power-data cable includes power conductors and a plurality of continuity wires positioned radially outside of the power conductors. The continuity wires are positioned relative to the power conductors such that a cut in the cable will sever one of the plurality of continuity wires before a cut into the power conductors can occur.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: February 28, 2023
    Assignee: COMMSCOPE TECHNOLOGIES LLC
    Inventors: Thomas F. Craft, Jr., Willis F. James, David A. Winkler, Gary L Guilliams, Randall D. Stevens, Thomas G. Leblanc
  • Patent number: 11596056
    Abstract: A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: February 28, 2023
    Assignee: Skyworks Solutions, Inc.
    Inventors: Bhuvaneshwaran Vijayakumar, Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen, Robert Francis Darveaux
  • Patent number: 11594349
    Abstract: The present disclosure relates to a power cable joint system capable of minimizing expansion, deformation or damage of a metal sheath restoration layer, which is formed of a material such as lead sheath, due to internal expansion due to heat generated in an intermediate connection part of the power cable joint system.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: February 28, 2023
    Assignee: LS CABLE & SYSTEM LTD.
    Inventors: Byung Ha Chae, Chae Hong Kang, Si Ho Son, Seung Myung Choi, Myeong Seok Kang, Young June Park, Ho Jung Yun, Kuniaki Sakamoto
  • Patent number: 11589462
    Abstract: A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: February 21, 2023
    Assignee: AT&S(China) Co. Ltd.
    Inventors: Nick Xin, Mikael Andreas Tuominen, Seok Kim Tay
  • Patent number: 11588310
    Abstract: A horizontal surface cover with a cover plate, at least one opening, and at least one access door. The cover plate is configured to cover an electrical device within an electrical box. The at least one opening extends through the cover plate and is sized to allow access to the electrical device through the at least one opening. The at least one access door is sized and shaped to fit within the at least one opening, and has a hinge with a hinge axis. The at least one access door is configured to translate along the hinge axis and rotate about the hinge axis to move between a closed position and an open position. The at least one access door is aligned with and inside of the at least one opening when in the closed position, and is misaligned with the at least one opening when in the open position.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: February 21, 2023
    Assignee: Titan3 Technology LLC
    Inventor: Jeffrey P. Baldwin
  • Patent number: 11589457
    Abstract: A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: February 21, 2023
    Assignee: KYOCERA Corporation
    Inventor: Seiichirou Itou
  • Patent number: 11581718
    Abstract: Electrical box assemblies are provided that have a support that is adjustable to different sizes. The electrical box assemblies provided also include a cable support that moves from a shipping position to an installed position.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 14, 2023
    Assignee: Hubbell Incorporated
    Inventors: Krzysztof Wojciech Korcz, Steven James Johnson