Patents Examined by Hoa C. Nguyen
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Patent number: 11634842Abstract: An object is to solve problems associated with a stretchable wire member that includes, for example, a garment with stretchable wires formed thereon, that is, to solve the problems of wrinkles and undulations that often occur after the garment is stretched. A stretchable wire member includes a fabric; a base layer disposed on a surface of the fabric; a conductive layer disposed in part of the fabric, the conductive layer being on a surface of the base layer; and a protective layer covering the conductive layer. In the stretchable wire member, an elastic modulus E?3 of a multilayer body portion including the fabric, the base layer, and the protective layer ranges from 1 MPa to 6 MPa.Type: GrantFiled: November 1, 2019Date of Patent: April 25, 2023Assignee: SEKISUI POLYMATECH CO., LTD.Inventor: Takaya Kimoto
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Patent number: 11630355Abstract: A display device is disclosed. The display device includes a display panel configured to display an image, and a printed circuit board electrically connected to the display panel and disposed at a back surface of the display panel. The printed circuit board includes an insulating layer, a first metal layer disposed at one surface of the insulating layer, pads including a first pad disposed on the first metal layer while being disposed inside a mounting area where an integrated circuit is mounted, and second pads disposed around the first pad, and a groove provided to extend from an inside of the mounting area to an outside of the mounting area.Type: GrantFiled: December 3, 2020Date of Patent: April 18, 2023Assignee: LG Display Co., Ltd.Inventors: Jeong-Kyu Lee, Dong-Won Park, Min-Gyu Park, Nam-Kon Ko
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Patent number: 11631529Abstract: In an electronic component, a terminal electrode has a thickest portion and a part thinner than the thickest portion. Accordingly, an increase in solder fillet forming region occurs when the electronic component is solder-mounted onto a predetermined mounting substrate. In the electronic component, mounting strength is improved as a result of the increase in solder fillet forming region. In addition, in the electronic component, the thickest portion overlaps a bump electrode in a direction orthogonal to the lower surface of an element body. Accordingly, the impact that is applied to the electronic component during the mounting onto the mounting substrate is reduced and the impact resistance of the electronic component is improved.Type: GrantFiled: March 6, 2020Date of Patent: April 18, 2023Assignee: TDK CORPORATIONInventors: Takahiro Kawahara, Manabu Ohta, Kenei Onuma, Yuuya Kaname, Ryo Fukuoka, Hokuto Eda, Masataro Saito, Kohei Takahashi
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Patent number: 11631970Abstract: A junction box includes a housing having a plurality of side wall portions, and a liquid detector including a first terminal portion and a second terminal portion. The junction box is disposed in a housing case housing a power storage module. The first terminal portion and the second terminal portion are directed toward a lower side of one of the side wall portions and drawn out from the inside of the housing to the outside of the housing.Type: GrantFiled: December 11, 2020Date of Patent: April 18, 2023Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, SUMITOMO WIRING SYSTEMS, LTD.Inventors: Yuki Ohira, Yoshiki Yanagita, Yoshimasa Tanuma, Takumi Ejima, Tatsuya Fujisaka, Takayuki Takeuchi
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Patent number: 11619212Abstract: Provided is an electric cable for a wind turbine, wherein the electric cable includes at least one cooling element) to cool the electric cable, wherein the cooling element protrudes from the surface of the electric cable.Type: GrantFiled: April 28, 2020Date of Patent: April 4, 2023Assignee: SIEMENS GAMESA RENEWABLE ENERGY A/SInventor: Mahsa RafieeArashtnab
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Patent number: 11622460Abstract: Hermetically sealed, hygienic electrical enclosures that do not require mechanical fasteners and methods of making the same. In some examples, an open housing is sealed with a cover using a seal that includes an arrangement of a gasket and a sealant. Once cured, the seal provides a hermetic seal between the housing and cover, providing a crevice-free device enclosure.Type: GrantFiled: October 21, 2020Date of Patent: April 4, 2023Assignee: Advanced Illumination, Inc.Inventor: John Thrailkill
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Patent number: 11622448Abstract: Embodiments include package substrates and method of forming the package substrates. A package substrate includes a first encapsulation layer over a substrate, and a second encapsulation layer below the substrate. The package substrate also includes a first interconnect and a second interconnect vertically in the first encapsulation layer, the second encapsulation layer, and the substrate. The first interconnect includes a first plated-through-hole (PTH) core, a first via, and a second via, and the second interconnect includes a second PTH core, a third via, and a fourth via. The package substrate further includes a magnetic portion that vertically surrounds the first interconnect. The first PTH core has a top surface directly coupled to the first via, and a bottom surface directly coupled to the second via. The second PTH core has a top surface directly coupled to the third via, and a bottom surface directly coupled to the fourth via.Type: GrantFiled: July 8, 2019Date of Patent: April 4, 2023Assignee: Intel CorporationInventors: Brandon C. Marin, Tarek Ibrahim, Srinivas Pietambaram, Andrew J. Brown, Gang Duan, Jeremy Ecton, Sheng C. Li
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Patent number: 11616331Abstract: An adapter assembly including a power box that has a housing containing internal components, a longitudinal axis and a storage portion. The adapter assembly also includes a first cord coupled to and extending from the housing, an adapter including an engagement portion that is removably coupled to the storage portion of the housing and that selectively engages a power source-receiving portion of a tool, and a second cord having a first end coupled to the adapter and a second end coupled to the housing.Type: GrantFiled: April 17, 2019Date of Patent: March 28, 2023Assignee: Milwaukee Electric Tool CorporationInventors: Dean Nowalis, David M. Schwalbach, Paul Rossetto, Brian Alves
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Patent number: 11617257Abstract: Various embodiments of the disclosure relate to a printed circuit for transmitting a signal in a high-frequency band and an electronic device including the same. The printed circuit board may include a flexible circuit board configured to transmit a signal in a high-frequency band, and the flexible circuit board may include: first multiple layers including a power line configured to transmit power; and second multiple layers stacked in a first direction of the first multiple layers and including a first signal line and a second signal line configured to transmit a signal in the high-frequency band.Type: GrantFiled: May 17, 2021Date of Patent: March 28, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngsun Lee, Eunseok Hong, Byeongkeol Kim, Jongmin Jeon
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Patent number: 11612053Abstract: A circuit board includes a first circuit board portion and a second circuit board portion. The first circuit board portion is provided with a first transmission line for a low-frequency signal or a low-speed signal, and the second circuit board portion is provided with a second transmission line for a high-frequency signal or a high-speed signal. The second circuit board portion is located on the first circuit board portion in a positional relationship in which the first transmission line and the second transmission line are side-by-side with each other. With this structure, signal leakage and interference between different signals are reduced or prevented in a line that transmits signals with different frequencies and different transmission speeds.Type: GrantFiled: May 21, 2021Date of Patent: March 21, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Nobuyuki Tenno, Takahiro Baba, Kuniaki Yosui, Yasuko Yoshinaga
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Patent number: 11610711Abstract: An inductor component comprising a laminated body having a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the laminated body; and an external terminal exposed from the laminated body. The external terminal includes a metal part and a resin part, and in a cross section of the external terminal, the resin part is enclosed in the metal part.Type: GrantFiled: April 8, 2020Date of Patent: March 21, 2023Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoshimasa Yoshioka, Kouji Yamauchi, Hironori Suzuki, Naoya Noo
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Patent number: 11605480Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.Type: GrantFiled: May 24, 2019Date of Patent: March 14, 2023Assignee: SAMTEC, INC.Inventors: Shashi Chuganey, Yasuo Sasaki, Scott McMorrow, Francisco Noyola, Cindy Lee Diegel, James Alexander Moss
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Patent number: 11602067Abstract: A backplane is for electrically connecting electrical components and a method is for producing a backplane. The backplane includes a base board, conducting tracks arranged on and/or in the base board, and at least one actuator unit arranged on or in the base board.Type: GrantFiled: April 15, 2019Date of Patent: March 7, 2023Assignee: SIEMENS AKTIENGESELLSCHAFTInventor: Joachim Seidl
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Patent number: 11594348Abstract: A power cable or a hybrid power-data cable includes power conductors and a plurality of continuity wires positioned radially outside of the power conductors. The continuity wires are positioned relative to the power conductors such that a cut in the cable will sever one of the plurality of continuity wires before a cut into the power conductors can occur.Type: GrantFiled: May 14, 2021Date of Patent: February 28, 2023Assignee: COMMSCOPE TECHNOLOGIES LLCInventors: Thomas F. Craft, Jr., Willis F. James, David A. Winkler, Gary L Guilliams, Randall D. Stevens, Thomas G. Leblanc
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Patent number: 11596056Abstract: A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.Type: GrantFiled: September 30, 2019Date of Patent: February 28, 2023Assignee: Skyworks Solutions, Inc.Inventors: Bhuvaneshwaran Vijayakumar, Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen, Robert Francis Darveaux
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Patent number: 11594349Abstract: The present disclosure relates to a power cable joint system capable of minimizing expansion, deformation or damage of a metal sheath restoration layer, which is formed of a material such as lead sheath, due to internal expansion due to heat generated in an intermediate connection part of the power cable joint system.Type: GrantFiled: October 25, 2019Date of Patent: February 28, 2023Assignee: LS CABLE & SYSTEM LTD.Inventors: Byung Ha Chae, Chae Hong Kang, Si Ho Son, Seung Myung Choi, Myeong Seok Kang, Young June Park, Ho Jung Yun, Kuniaki Sakamoto
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Patent number: 11589462Abstract: A semi-flexible component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure. The layer structures are stacked on top of each other in a stacking direction s. A recess extends from a first main surface of the stack into the stack and extends only partially into one of the at least one electrically insulating layer structure so that an electrically insulating layer structure having a stepped portion is formed. The stepped portion provides a flexible region of the stack with respect to a rigid region of the stack.Type: GrantFiled: April 30, 2019Date of Patent: February 21, 2023Assignee: AT&S(China) Co. Ltd.Inventors: Nick Xin, Mikael Andreas Tuominen, Seok Kim Tay
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Patent number: 11588310Abstract: A horizontal surface cover with a cover plate, at least one opening, and at least one access door. The cover plate is configured to cover an electrical device within an electrical box. The at least one opening extends through the cover plate and is sized to allow access to the electrical device through the at least one opening. The at least one access door is sized and shaped to fit within the at least one opening, and has a hinge with a hinge axis. The at least one access door is configured to translate along the hinge axis and rotate about the hinge axis to move between a closed position and an open position. The at least one access door is aligned with and inside of the at least one opening when in the closed position, and is misaligned with the at least one opening when in the open position.Type: GrantFiled: February 11, 2021Date of Patent: February 21, 2023Assignee: Titan3 Technology LLCInventor: Jeffrey P. Baldwin
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Patent number: 11589457Abstract: A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.Type: GrantFiled: June 28, 2019Date of Patent: February 21, 2023Assignee: KYOCERA CorporationInventor: Seiichirou Itou
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Patent number: 11581718Abstract: Electrical box assemblies are provided that have a support that is adjustable to different sizes. The electrical box assemblies provided also include a cable support that moves from a shipping position to an installed position.Type: GrantFiled: April 12, 2021Date of Patent: February 14, 2023Assignee: Hubbell IncorporatedInventors: Krzysztof Wojciech Korcz, Steven James Johnson