Abstract: The alignment method of the electrical conductors includes an aligning step of aligning a plurality of electrical conductors 40 in an annular shape while being overlapped in a circumferential direction of the annular shape by moving gripping devices 230 inward in a radial direction of the annular shape, in which the gripping device 230 has a pair of claws 232g1 and 232g2 capable of pinching one leg portions 41 of the substantially U-shaped electrical conductors 40 one by one, one claw 232g1 has a length capable of gripping one leg portion 41, and the other claw 232g2 has a length capable of gripping one leg portion 41 of one substantially U-shaped electrical conductor 40-1 and gripping the other leg portion 44 of the other substantially U-shaped electrical conductor 40-2.

Abstract: A mounting management device sets a production job of production jobs having a largest production parameter to a production job of the production jobs having an Nth largest production parameter as reference jobs of each of N groups, respectively; determines arrangement positions of tape feeders on a pallet so that a production time required for processing each of the reference jobs is as short as possible as determined based upon the arrangement positions of the tape feeders; allocates remaining production jobs excluding the reference jobs of the production jobs to the N groups; and determines arrangement positions of the tape feeders on the pallet based on the remaining production jobs.

Abstract: A method for making an ultra-thin dielectric printed circuit board (PCB) is provided. A first side of a first conductive layer is removably coupled to a disposable base. A first ultra-thin dielectric layer and a second conductive layer are laminated to a second side of the first conductive layer, where the first ultra-thin dielectric layer is positioned between the first and second conductive layers, and the first ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may then be patterned to form electrical paths. The patterned second conductive layer is then filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may then be coupled to the second conductive layer. The disposable base may then be detached from the first conductive layer.

Abstract: A wire and a stripping method thereof, and a light strip are provided. The stripping method includes the following steps: holding a wire by a holder, the wire including an insulation layer and a conductor covered by the insulation layer; mounting the holder on a worktable of a an optical device; and activating a light emitter of the optical device to emit a light beam irradiating onto the insulation layer to ablate a portion of the insulation layer to form at least one through hole that penetrates the insulation layer to expose a portion of the conductor.

Abstract: An assembling apparatus is adapted to assemble a case made of thin plate. The case has a bottom case and a top case, a latch formed on each side wall of the bottom case, and a locking spring formed on each side plate of the top case. When side plates of the top case are located at a predetermined position with respect to the top wall of the top case, the locking springs are fitted into the latches. The assembling apparatus includes a base configured to position and support the bottom case, an operation mechanism adapted to hold and move the top case, and a guide device disposed at the inner side of the latch. The guide device guides the side plate to the predetermined position, so that the locking spring on the side plate of the top case is capable of being fitted into the latch.

Abstract: Magnetic orientation-independent magnetically actuated switches may be made by producing an outer cylinder and an actuator cylinder from ferromagnetic sheets and non-ferromagnetic sheets in alternating order. A first ferromagnetic body is attached to an end of the outer cylinder. The actuator cylinder is positioned within a first bore of the outer cylinder, the actuator pin is positioned within a second bore of the actuator cylinder and a third bore of the first ferromagnetic body with a portion of the actuator pin extending beyond the third bore of the first ferromagnetic body. A second ferromagnetic body is attached to the portion of the actuator pin, thus forming the magnetic orientation-independent magnetically operated switch.

Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.

Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.

Abstract: An unmanned vehicle line and cable string apparatus is provided and the method of use thereof. A small drone has a shot line canister loaded with an inside wound shot line string spool. Shot line is strung between power line towers wherein the inside shot line string end is attached to a remotely controlled released shot line sinker. The sinker is deployed near the proximate tower, the drone is directed to the distal tower deploying shot line from the shot line canister. The shot line canister, having a remotely controlled jettison mechanism and an end of shot line detection mechanism, is jettisoned at the distal power line tower. As shot line is dispensed, the vehicle loses weight thereby extending the flying time, distance, and maneuverability particularly as the vehicle approaches the distal tower. Because the shot line is deployed and not dragged, the impact of inclement weather conditions is minimized.

Abstract: Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

Abstract: A method of making modular multi-function active optical cables (AOC) that enables multiple functions with minimal non-recurring engineering is described herein. In a non-limiting embodiment, one or more modular boards may be assembled into an assembly at a first end and a second end of the modular multi-function active optical cable, where each modular board may include at least a first connector. An electrical connector may be connected to the assembly using an interface to connect the electrical connector to the first connector associated with each module board. A hybrid cable assembly then may be connected between the assembly at the first end and the second, where the hybrid cable assembly includes one or more optical fibers and one or more electrical conductors.

Abstract: A method of manufacturing a multilayer ceramic electronic component which includes preparing first and second ceramic green sheets; forming an internal electrode pattern on the first ceramic green sheet using a conductive metal paste; forming a ceramic member on first and second end portions of a first surface of the second ceramic green sheet to form a step portion absorption layer; stacking two or more of the first ceramic green sheets on each other in a stacking direction to form a first group; stacking two or more of the first ceramic green sheets on each other in the stacking direction to form a second group; and placing the second ceramic green sheet between the first group and the second group in the stacking direction to form a ceramic body, wherein the first and second end portions oppose each other in a first direction perpendicular to the stacking direction.

Abstract: A method of forming a 3D package. The method may include joining an interposer to a laminate chip carrier with the solid state diffusion of a first plurality of solder bumps by applying a first selective non-uniform heat and first uniform pressure; joining a top chip to the interposer with the solid state diffusion of a second plurality of solder bumps by applying a second selective non-uniform heat and second uniform pressure; heating the 3D package, the first and second pluralities of solder bumps to a temperature greater than the reflow temperature of the first and second pluralities of solder bumps, where the second plurality of solder bumps achieves the reflow temperature before the first plurality of solder bumps, where the first and second selective non-uniform heats being less that the reflow temperature of the first and second pluralities of solder bumps, respectively.

Abstract: Embodiments of the invention are directed to a system for detecting neurotransmitters. A non-limiting example of the system includes a porous electrode. A system can also include a pH sensor attached to the porous electrode, wherein the pH sensor includes a sensing electrode and a reference electrode. The system can also include electronic circuitry in communication with the pH sensor.

Abstract: A method includes raising a pickup area of a pickup member including one or more arms extending between the pickup area and one or more sidewalls of a frame of a board level shield (BLS), such that the pickup area is raised relative to and above an upper surface of the one or more sidewalls of the frame, and such that the pickup area rotates in place as the pickup area is raised relative to and above the upper surface of the one or more sidewalls.

Abstract: A method of attaching an electrical contact to a cable is presented herein. The electrical contact is crimped to the cable, at different heights, in such a way as to obtain a mechanical retention portion and an electrical conduction portion. The difference between the final crimping heights of the mechanical retention portion and the electrical conduction portion is between 0.5 and 0.6 mm. A tool for implementing this method is also described herein.

Abstract: An electronic component mounting method is performed by an electronic component mounting system including a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit.

Abstract: A shape cutting device of a skin electrode patch includes: a substrate conveyor for transmitting a coated substrate portion and a conductive adhesive portion; a positioning conveyor; a fitted shape cutting module installed in a successive portion of the positioning conveyor and having two pressing wheels and a shape cutting unit, and the two pressing wheels being provided for pressing the coated substrate portion and the conductive adhesive portion, and the shape cutting unit including a roller body with at least one cutting knife which is in a geometrical shape and includes two side cutters and a first-end cutter at an axial end, and opposite ends of the first-end cutter having two second-end cutters, and a gap being formed in the two second-end cutters. The cutting knife has a design that integrates the transmission feature and the efficiency of the whole production line.

Abstract: Embodiments of the present invention relate to transponder fabrication. In an embodiment, a plurality of antenna elements is applied to a first substrate at a first pitch. A plurality of fully functioning first transponders is positioned on to the first substrate in a manner to each be in electrical communication with an antenna element included in the plurality of antenna elements and thereby forms a plurality of fully functioning second transponders. The plurality of fully functioning first transponders are positioned on a second substrate at a second pitch. The plurality of fully functioning first transponders have a first read range. Second transponders have an increased read range relative to second transponders. The second pitch is greater than the first pitch.

Abstract: A mixed pitch method of placing pads in a ball grid array (BGA) package having a. BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch PT. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.