Abstract: A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.

Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, and a control unit that determines a mounting state of another component mounted in advance around the mounting position based on height information of a region around the mounting position.

Abstract: Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.

Abstract: In a first aspect, the present disclosure relates to a method for designing a pattern of a stress relief layer for a flat device to be transformed into a shape-retaining non-flat device by deformation of the flat device. The flat device (and thus also the non-flat device) may comprise at least two components and at least one electrical interconnection between two components. In a second aspect, the present disclosure is related to a method of manufacturing a shape-retaining non-flat device by deformation of a flat device, wherein the flat device is attached to a patterned stress relief layer designed in accordance with the first aspect of the present disclosure. In preferred embodiments, the stress relief layer is a thermoplastic layer or a layer comprising a thermoplastic material and deformation of the flat device comprises deformation by a thermoforming process, after attachment of the flat device to the stress relief layer.

Abstract: A manufacturing method for a laminated iron core includes conveying a sheet steel strip in an intermittent manner in a lift up state, with upward movement of the strip being limited by a guiding member provided on a lower holder; punching an outer shape of each iron core laminae; and applying adhesive agent to a surface of the strip before the punching. The adhesive agent is applied in a state in which a pilot pin is inserted in a pilot hole of the strip and when the strip is about to be pressed against or is being pressed against the die plate by a stripper provided on an upper holder. After application of the adhesive agent, the strip is returned to the lift up state by raising the upper holder, with a lifter and the stripper plate being in abutment with the lower and upper surfaces of the strip, respectively.

Abstract: A method is provided that integrates an autonomous energy harvesting capacity in vehicles in an aesthetically neutral manner. A unique set of structural features combine to implement a hidden energy harvesting system on a surface of the vehicle to provide electrical power to the vehicle, and/or to electrically-powered devices in the vehicle. Color-matched, image-matched and/or texture-matched optical layers are formed over energy harvesting components, including photovoltaic energy collecting components. Optical layers are tuned to scatter selectable wavelengths of electromagnetic energy back in an incident direction while allowing remaining wavelengths of electromagnetic energy to pass through the layers to the energy collecting components below.

Abstract: A method of manufacturing a capacitor component includes preparing a laminate structure in which a plurality of ceramic sheets, each having an internal electrode pattern formed thereon, are layered, attaching an auxiliary member to an upper surface and a lower surface of the laminate structure, and disposing the laminate structure having the auxiliary member attached thereto on a lower mold on which jigs for blocking a length direction portion and a width direction portion of the laminate structure are disposed and compressing the laminate structure. The ceramic sheet has a thickness of 0.6 ?m or less, and the auxiliary member has higher elasticity than elasticity of the lower mold.

Abstract: In various embodiments, a non-circular electrical cable having a reduced pulling force attributable to the exterior surface of an outer sheath, and method of producing the same is provided. In various embodiments, an outer sheath of the cable may comprise a first and second sheath layer, the second sheath layer being located external to the first sheath layer, and comprising a nylon material configured to reduce the pulling force necessary for installing the cable. In various embodiments, the first sheath layer may be extruded using a tube extrusion method into a substantially circular shape, and the second sheath layer may be extruded using a pressure extrusion methods onto the exterior surface of the first sheath layer while maintaining the at least substantially circular shape of the sheath. The sheath may then be pulled onto the surface of a plurality of conductors to form the non-circular electrical cable.

Abstract: A method for preparing a film bulk acoustic wave device by using a film transfer technology includes: 1) providing an oxide monocrystal substrate; 2) implanting ions from the implantation surface into the oxide monocrystal substrate, and then forming a lower electrode on the implantation surface; or vice versa; and forming a defect layer at the preset depth; 3) providing a support substrate and bonding a structure obtained in step 2) with the support substrate; 4) removing part of the oxide monocrystal substrate along the defect layer so as to obtain an oxide monocrystal film, and transferring the obtained oxide monocrystal film and the lower electrode to the support substrate; 5) etching the support substrate from a bottom of the support substrate to form a cavity; 6) forming an upper electrode on the surface of the oxide monocrystal film.

Abstract: A lead component mounting method includes: a component insertion process in which two lead wires are inserted into two corresponding through-holes which are formed in a circuit board from one side of the circuit board in a state in which at least a pair of pawl portions pinches and holds each of the two lead wires which are included in a lead component; and a clinching process in which protruding portions, which are portions protruding from another side of the circuit board, of the two lead wires which are inserted into the two corresponding through-holes, are bent in a state in which the two lead wires are held by at least the pair of pawl portions.

Abstract: Articles on flexible webs with different pitches are assembled together by displacing portions between articles of one web out of plane to move the articles on that web to the same pitch as the other web, aligning the two webs to register corresponding articles on the two webs, and assembling the corresponding articles together. The assembly may be used for example in the making of RFID tags, labels and inlays.

Abstract: A light emitting component mounting method for holding a light emitting component with a light emitter by a mounting head and mounting the light emitting component on a board is provided. The method includes energizing the light emitter to emit a light, measuring a luminance distribution of the light emitter and detecting a position of a luminance distribution center in the light emitter based on the measured luminance distribution.

Abstract: A method of manufacturing a press-fit apparatus suitable for press-fitting multiple connectors to a circuit board is provided. A machine press head that is movable by a power supplier of the press-fit apparatus is provided. A universal press block is fixed to the machine press head to allow the universal press block to be movable with the machine press head. A locating block is fixed to the bottom plate of the universal press block, by inserting a locating fastener of the locating block into a locating hole. A press block is fixed to the locating block at a predetermined position suitable for press-fitting one of the connectors.

Abstract: A system for producing a proof-mass assembly includes a translation stage to receive a flapper hingedly supported by a bifilar flexure that extends radially inwardly from a support ring, wherein the bifilar flexure comprises a pair of flexure arms spaced apart by an opening or window; and a femtosecond laser optically coupled to the translation stage with focusing optics, the femtosecond laser applying a laser beam on the flexure arms over a plurality of passes to gradually thin the bifilar flexure regions, the laser periodically reducing a laser output to minimize damage from laser scanning and maximize bifilar flexure strength until the bifilar flexure reaches a predetermined thickness.

Abstract: Described is a cable rejuvenation apparatus for a cable used in a subsea environment. The apparatus applies a bias signal to a conducting element of the cable, the bias signal being selected to improve the insulation properties of the cable. The bias signal is generated by a bias signal generator that includes a voltage source that generates a bias voltage having a time varying component. The bias voltage promotes an electrochemical reaction between the conducting element and the salt containing liquid of the subsea environment resulting in the formation of a barrier material at the fault location restricting further leakage current flow and enhancing the insulation resistance of the cable. The bias signal is a voltage selected such that the electrochemical reaction promoted by the bias voltage maintains the presence of the barrier material at the fault location.

Abstract: A method of adjusting a watt density distribution of a resistive heater includes designing a baseline heater circuit. A detection circuit is designed having a constant trace watt density and the detection circuit overlaps the baseline heater circuit. The detection circuit is manufactured, and its baseline thermal map is obtained. The baseline heater circuit is manufactured, and a nominal thermal map is obtained. A subsequent detection circuit is manufactured, and an actual thermal map is obtained. A subtraction thermal image is created by subtracting the baseline thermal map from the actual thermal map, and a subsequent baseline heater circuit is modified according to the subtraction thermal image.

Abstract: A system for connecting wires of an electrical cable harness to an electrical connector includes a base that defines a base plane and is configured to support a connector. The system also includes a guiding device having first and second moveable gripping portions. The first and second gripping portions cooperate to define one or more channels that extend perpendicularly to the base plane and are configured to receive one or more wire ends for insertion. An inner surface of the first gripping portion is parallel with a corresponding inner surface of the second gripping portion and an outer surface of the first gripping portion is nonparallel with a corresponding outer surface of the second gripping portion. The system further includes a robotic arm configured to move the guiding device relative to the base while the one or more channels remain perpendicular to the base plane.

Abstract: A pick-and-place tool including a plurality of movable holder structures, and a plurality of pick-and-place structures, each holder structure accommodating two or more of the pick-and-place structures, wherein at least one of the two or more pick-and-place structures of a respective holder structure is able to move along a respective holder structure independently from another at least one of the two or more pick-and-place structures of the respective holder structure, and wherein each pick-and-place structure includes a pick-up element configured to pick up a donor component at a donor structure and place the donor component an acceptor structure.

Abstract: Resin films, all of which are formed of the same resin material, are laminated to form a laminate. Heat and pressure are applied to the laminate to integrate the resin films into one piece; then the pressure applied to the laminate is released and the laminate is cooled. In a predetermined region of the laminate which is to constitute a bent part, one or more of the resin films are arranged on each of one side and the other side in a lamination direction of the resin films with respect to one conductor pattern; and the total thickness of the one or more resin films arranged on the one side is larger than the total thickness of the one or more resin films arranged on the other side. Consequently, the predetermined region can be bent by utilizing the difference between contraction force generated in the one or more resin films arranged on the one side and contraction force generated in the one or more resin films arranged on the other side during the cooling after the application of heat and pressure.

Abstract: A method of forming a metal silicide nanowire network that includes multiple metal silicide nanowires fused together in a disorderly arrangement on a substrate. The metal silicide nanowire network can be formed by applying a solution that contains silicon nanowires onto the substrate, forming a metal layer on the silicon nanowires, and performing a silicidation anneal such that the metal silicide nanowires are fused together in a disorderly arrangement, forming a mesh. After the silicidation anneal is performed, any unreacted silicon or metal can be selectively removed.