Abstract: Generating an assessment of the suitability of cables, ducts, tubes, pipes and/or other hollow-type of conduits to extraction of cores, conductors, insulation, etc. included therein while still buried in the ground or otherwise positioned out-of-sight so as to be unavailable for visual and/or physical inspection is contemplated. The assessment may be used to indicate a suitability of a cable buried in the ground of a hybrid fiber coaxial (HFC) cable plant to extraction of the type whereby a core of the cable may be extracted using hydraulics while still buried.

Abstract: In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.

Abstract: A reactive beamformer includes a radiator disposed within a substrate and configured to radiate a received electromagnetic signal, a plurality of receptors disposed within the substrate, each of the plurality of receptors configured to receive a portion of the radiated electromagnetic signal, and a plurality of signal lines. Each signal line of the plurality of signal lines is coupled to a respective receptor of the plurality of receptors to convey the portion of the radiated electromagnetic signal from the respective receptor and to provide the portion of the radiated electromagnetic signal to an output.

Abstract: A loose component supply device including a stage configured to support scattered components; a holding tool configured to hold a component scattered on the stage; and a component reception member in which is formed a component reception recess in accordance with the component, the device supplying components in a state with the component held by the holding tool loaded in the component reception recess of the component reception member. With the loose component supply device, a setting section is provided for setting any of multiple of the component reception members. An identification plate is provided on the component reception member and a 2D code for identifying the type of the component that is able to be loaded in the component reception recess is provided on the identification plate.

Abstract: A method includes forming a single-crystal-like metal layer on a metal seed layer, the metal seed layer formed on a sacrificial wafer. An anchor layer is formed on the single-crystal-like metal layer. The single-crystal-like metal layer is separated from the sacrificial wafer via the anchor layer. The single-crystal-like metal layer is transported via the anchor layer to a target substrate having one or more recording head subassemblies. The single-crystal-like metal layer is joined with the recording head, the single-crystal-like metal layer being integrated with the recording head as a near-field transducer.

Abstract: A spring clip for securing contact partners is presented, wherein the contact partners can be connected electrically and in a form fitting manner. The spring clip has a socket section with at least one guide lug for a form fitting connection to a first contact partner, a snap-fit section with at least one snap-fit hook that snaps into a second contact partner, and a bending section between the socket section and the snap-fit section. The bending section can be bent thereby, between a relaxed state and a tensioned state.

Abstract: A MEMS piezoelectric device includes a monolithic semiconductor body having first and second main surfaces extending parallel to a horizontal plane formed by first and second horizontal axes. A housing cavity is arranged within the monolithic semiconductor body. A membrane is suspended above the housing cavity at the first main surface. A piezoelectric material layer is arranged above a first surface of the membrane with a proof mass coupled to a second surface, opposite to the first surface, along the vertical axis. An electrode arrangement is provided in contact with the piezoelectric material layer. The proof mass causes deformation of the piezoelectric material layer in response to environmental mechanical vibrations. The proof mass is coupled to the membrane by a connection element arranged, in a central position, between the membrane and the proof mass in the direction of the vertical axis.

Abstract: Methods are provided for manufacturing flat devices to be used for forming a shape-retaining non-flat device by deformation of the flat device. Based on the layout of a non-flat device, a layout of a flat device is designed. A method for designing the layout of such a flat device is provided, wherein the method includes inserting mechanical interconnections between pairs of elements to define the position of the elements on a surface of the non-flat device, thus leaving zero or less degrees of freedom for the location of the components. Based on the layout of a flat device thus obtained, the flat device is manufactured and next transformed into the shape-retaining non-flat device by means of a thermoforming process, thereby accurately and reproducibly positioning the elements at a predetermined location on a surface of the non-flat device.

Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

Abstract: A method for treating a layer of composition ABO3, wherein A is a first material composition consisting of at least one element selected from the group consisting of: Li, Na, K, H, Ca, Mg, Ba, Sr, Pb, La, Bi, Y, Dy, Gd, Tb, Ce, Pr, Nd, Sm, Eu, Ho, Zr, Sc, Ag, and Tl, and wherein B is a second material composition consisting of at least one element selected from the group consisting of: Nb, Ta, Sb, Ti, Zr, Sn, Ru, Fe, V, Sc, C, Ga, Al, Si, Mn, Zr, and Tl, is described. The method includes implanting an ionic species into a donor substrate of the composition ABO3, thereby forming a weakened zone delineating the layer, detaching the layer from the donor substrate along the weakened zone, and exposing the detached layer to a medium containing ions of a constituent element A, such that the ions penetrate into the layer.

Abstract: In a component refill management system, a refill specifying unit specifies a component supply device which is to be refilled with a new reel. The refill specifying unit includes a first specifying unit, a second specifying unit, and a third specifying unit. The first specifying unit specifies refillable time intervals of new reels with the time intervals being associated with each of the component supply devices. The second specifying unit recognizes, in each of the refillable time intervals, a first refillable time interval having an earliest second time at which a sum of residual components reaches a predetermined value, and specifies a component supply device, which is associated with the first refillable time interval, as a first component supply device. The third specifying unit specifies a component supply device, which can be refilled with a reel within the first refillable time interval, as a second component supply device.

Abstract: A method of manufacturing an electronic component includes preparing an unfired multilayer body including first and second main surfaces facing each other in a stacking direction, first and second side surfaces facing each other in a width direction, and first and second end surfaces facing each other in a length direction, bonding one main surface of the unfired multilayer body to an elongated first adhesive sheet, conveying the first adhesive sheet in a first direction in which the first adhesive sheet approaches an elongated second adhesive sheet, and bonding one side surface of the unfired multilayer body to the second adhesive sheet, conveying the second adhesive sheet in a second direction different from the first direction to peel off the unfired multilayer body from the first adhesive sheet, polishing another side surface of the unfired multilayer body, and forming a first insulating layer on the polished another side surface.

Abstract: The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

Abstract: A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.

Abstract: An object of the present invention is to suppress reduction of insulation reliability between stator coils. A method of manufacturing a rotary electric machine according to the present invention is a method of manufacturing a stator including an insulating member intervening between a plurality of coil end portions each protruding from a stator core, the method including: a first step of disposing an interposed member to cover part of the insulating member between the plurality of coil end portions; and a second step of welding part of each of the plurality of coil end portions.

Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.

Abstract: A terminal crimping process includes using a plurality of terminal holders to respectively hold various types of the terminal fittings and arranging the terminal holders in a terminal magazine. The terminal magazine is detachably installed on the terminal feeding mechanism. The terminal feeding process further includes moving the terminal magazine to convey the terminal fittings held on the terminal holders to the crimping position, and subsequently crimping the terminal fitting with a wire disposed therein.

Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

Abstract: A method of assembly of an open-cavity, wire-in-air fuse which provides improved manufacturing yield and fuse reliability, involving coiling, braiding or twisting a fusible element around a sacrificial member during the manufacturing process to provide support for the fusible element to prevent mechanical breakages and necking problems commonly encountered during manufacture.

Abstract: A component mounting machine performs a mounting operation of mounting an electronic component to a board. The component mounting machine includes: multiple related operation devices each including an electrically-operated section configured to perform a related operation that is an operation related to the mounting operation, and an output section configured to output an operation signal representing a state of the electrically-operated section that is operating; and circuitry configured to limit the quantity of the related operation devices for which the electrically-operated section is in an operating state to a specified quantity or fewer based on whether there is presence of the operation signal of the multiple related operation devices.