Abstract: Provided is a manufacturing method of a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, the manufacturing method including a lamination process of alternately laminating the plurality of electrode layers and a dielectric film and forming a laminated body which will be the capacitance portion, a first etching process of forming an opening extending in a laminating direction with respect to the laminated body and exposing the dielectric film laminated directly on one of the plurality of electrode layers on a bottom surface of the opening, and a second etching process of exposing the one electrode layer at the bottom surface of the opening. In the second etching process, an etching rate of the one electrode layer is lower than an etching rate of the dielectric film.

Abstract: A component insertion device including a robot and a control portion is provided. The control portion is configured to control the operation of the robot. The robot includes a gripper, a dummy component and a force sensor. The gripper is configured for gripping a workpiece component. The dummy component is mounted protruding outward on a location in the gripper and away from the gripped workpiece component. The dummy component has a corresponding part with the same shape as that of a specific part of the workpiece component and exhibits rigidity. The force sensor is configured for detecting, through the gripper, a contact reaction force received by the dummy component from the surrounding of a slot or hole of a receiving portion by which the specific part of the workpiece comment is to be inserted via using the device. Component insertion method and program of using the device are also provided.

Abstract: A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.

Abstract: A fabrication method achieves bump bonds (to connect two electronic devices) with a pitch of less than 20 ?m using UV-curable conductive epoxy resin cured with an array of nano-LEDs. Nano-LEDs are devices with sizes less than or equal to 5 ?m, typically arranged in an array. After deposition of the uncured conductive epoxy layer, the nano-LED array enables a fast curing of the bumps with high spatial resolution. Next, the uncured resin is washed off and the chips are assembled, before final thermal curing takes place.

Abstract: The present disclosure relates to a fabrication process for a current transformer. For example, the process may include wrapping first windings around a first core half of a magnetic core of a current transformer. The process may include wrapping second windings around a second core half of the magnetic core. The magnetic core may be inserted into an overmold tool. The process may include overmolding a first overmold over the first core half of the magnetic core and a second overmold over the second core half of the magnetic core. After overmolding, the magnetic core may be cut in half.

Abstract: Provided are an alignment method and an alignment device by which, immediately before aligning, the leg parts of adjacent conductors do not interfere with each other. The alignment method, in which by providing a plurality of coil elements (40) in an annular shape and moving the plurality of coil elements (40) in a direction in which the diameter of the annular shape is reduced, the plurality of coil elements (40) are aligned in a state where turn sections (42) provided at substantially apex portions are alternately overlapped, wherein the plurality of coil elements (40) are aligned by moving each of the plurality of coil elements (40) toward an annularly shaped center, and while doing so, rotating the plurality of coil elements about a rotation axis (231e) that is parallel to the central axis (C1) of the annular shape.

Abstract: A method for manufacturing antenna pattern according to an embodiment includes an adhesive arranging step, a metal sheet arranging step, a cutting step, a removing step, and a pressurizing step. In the adhesive arranging step, an adhesive is arranged inside with respect to a perimeter line of the antenna pattern arranged on a continuous body while conveying the continuous body of a base material.

Abstract: A method for producing a solid-insulated circuit-breaker pole includes forming a pole shell housing with an elastic layer that is integrally joined to the pole shell housing; and mounting a vacuum fault interrupter into the pole shell housing provided with the elastic layer. Also disclosed is a solid-insulated circuit-breaker pole.

Abstract: A control device of an electronic mounting machine that controls an operation of a mounting head when an electronic component is mounted on a printed circuit board including multiple divided boards by using the mounting head having multiple suction nozzles; sets some of the multiple divided boards within the printed circuit board as one group based on positions of the multiple suction nozzles and positions of the multiple divided boards within the printed circuit board; and controls the multiple suction nozzles to mount the electronic components on the some of the divided boards within the one group at a same time.

Abstract: An apparatus for inserting and retention testing an electrically conductive contact in an electrical connector. The apparatus includes a connector holder, an insertion tip, an insertion tip displacement assembly, a test probe, and a test probe displacement assembly. The connector holder holds an electrical connector. The insertion tip contacts one end of a contact partially inserted in a hole in the electrical connector while providing clearance for a wire. The insertion tip displacement assembly displaces the insertion tip in a first direction along a first linear path to further insert the insertion tip in the hole in the electrical connector. The test probe contacts another end of the contact after the contact has been inserted further into the hole. The test probe displacement assembly displaces the test probe in a second direction (opposite to the first direction) along a second linear path which partially overlaps the first linear path.

Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas when the distal ends of the truss structure engage and are compressed between the two areas.

Abstract: Methods of manufacturing and assembling a catheter shaft may include depositing electrical traces on an interior surface of the shaft of the catheter, rather than using separate wires, forming a bore in a sensor, and electrically coupling the sensor to the trace through a bore in the sensor.

Abstract: Provided is a method for operating an electronic component mounting system including component storages including a keeping rack, a dry box and a dryer. The method includes, after a reel of a moisture sensitive device is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, measuring a exposure time for which the moisture sensitive device is in an atmospheric exposure state is in a reel unit, and comparing the exposure time with an exposure limit time set for the moisture sensitive device and stored in a storage. The method includes stopping using the reel of the moisture sensitive device whose exposure time exceeds the exposure limit time.

Abstract: A method of forming a metal silicide nanowire network that includes multiple metal silicide nanowires fused together in an orderly arrangement on a substrate. The metal silicide nanowire network can be formed by printing a first set of multiple parallel silicon nanowires on the substrate and printing a second set of multiple parallel silicon nanowires over the first set of multiple parallel silicon nanowires such that said first set is perpendicular to said second set. A metal layer can be formed on the silicon nanowires. A silicidation anneal process is performed such that metal silicide nanowires are formed and fused together in an orderly arrangement, forming a grid network. After the silicidation anneal is performed, any unreacted silicon or metal can be selectively removed.

Abstract: An operation checking device of an electronic component mounting machine is provided with a first memory section configured to memorize an operation program of the electronic component mounting machine including at least a collection operation of an electronic component by a collecting device; a second memory section configured to memorize shape data of the electronic component and shape data of the collecting device; a first acquiring section configured to acquire information of the electronic components and information of the collecting device based on the operation program required for a current operation memorized on the first memory section; and a second acquiring section configured to acquire corresponding shape data of the electronic component and shape data of the collecting device from the second memory section based on the information of the electronic component and the information of the collecting device acquired by the first acquiring section.

Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.

Abstract: A loose component supply device includes a loose component support section that supports multiple components in a loose state, an imaging device that images the components supported on the loose component support section, a component holding head provided with at least one component holding tool capable of picking up and holding each of the components supported on the loose component support section, a holding head moving device that moves the component holding head at least to and from the loose component support section and a component transfer section at which transfer to a next process is possible, and a holding tool changing device that changes at least one of the one component holding tools based on image data obtained by the imaging of the imaging device.

Abstract: Mounting apparatus executes a first mode of, at least when tray member is first moved to a collection position, capturing an image of fiducial marks and obtaining a correction value by which the collection position of component P is corrected based on the positions of fiducial marks in the captured image. Further, mounting apparatus executes a second mode of, when tray member is moved to the collection position, capturing an image of fiducial marks and obtaining a correction value by which the collection position of component P is corrected based on the positions of fiducial marks in the captured image, the correction value being obtained more frequently than in the first mode.

Abstract: A method of manufacturing an actuator includes a first electrode layer forming step, a dielectric elastomer layer forming step, and a second electrode layer forming step, and obtains the actuator in which dielectric elastomer layers and electrode layers have been concentrically laminated. In the first electrode layer forming step, an electrode material is provided to an outer circumferential surface of a shaft section to form the electrode layer. In the dielectric elastomer layer forming step, a sheet-like or paste-like dielectric elastomer material is provided to an outer circumferential surface of the electrode layer to form the dielectric elastomer layer. In the second electrode layer forming step, the electrode material is provided to an outer circumferential surface of the dielectric elastomer layer to form the electrode layer.

Abstract: A method for forming a coil that is formed by winding a flat rectangular conductor wire a plurality of times, the method includes forming, in the coil end portion, an offset portion bent in a stacking direction of the flat rectangular conductor wire with an offset in the stacking direction of the flat rectangular conductor wire by an amount corresponding to a width of the single flat rectangular conductor wire by moving the outer die on the one side in the divided outer die relative to the outer die on the other side in a direction along the stacking direction.