Abstract: A substrate processing method includes a substrate holding step of holding a substrate by a substrate holding unit, a chemical liquid supplying step of supplying a chemical liquid to a main surface of the substrate while rotating the substrate around a rotational axis passing through a central portion of the substrate, a foreign matter detecting step of detecting foreign matter, contained in the chemical liquid expelled from the substrate, in parallel with the chemical liquid supplying step, and a flow destination switching step of switching, based on the detection of the foreign matter by the foreign matter detecting step, a flow destination of the chemical liquid expelled from the substrate from a drain piping to a recovery piping during the chemical liquid supplying step.

Abstract: Present disclosure provides a substrate processing apparatus, including a rotatable pedestal configured to hold a substrate, a driving mechanism connected to the rotatable pedestal, a liquid pouring nozzle over the pedestal, a temperature sensor configured to probe a temperature of the substrate processing apparatus, and a controller communicating with the temperature sensor and the driving mechanism. Present disclosure also provides a method for processing a substrate, including providing a substrate on a pedestal of a processing chamber, probing a temperature of the processing chamber, calculating a temperature difference between the temperature of the processing chamber and a predetermined temperature, and determining a rotational speed difference with respect to a predetermined rotational speed of the pedestal according to the temperature difference.

Abstract: A method for dispensing photoresist over a semiconductor wafer is provided. The method includes moving a dispensing nozzle to a predetermined position where the longitudinal axis of the dispensing nozzle aligns with the central axis of the semiconductor wafer. The method further includes dispensing a chemical liquid over the semiconductor wafer via the dispensing nozzle. The method also includes dispensing a photoresist over the semiconductor wafer that is coated with the chemical liquid via the dispensing nozzle. During the dispensing of the chemical liquid and the photoresist, the dispensing nozzle stays in the predetermined position.

Abstract: A method and/or system for coating a substrate with a coating material. The coating material may be a polymer such as a photoresist. The method involves dispensing a coating material onto a substrate during which a temperature differential between the coating material and the substrate is at least 5° C. This temperature differential may be achieved by cooling the substrate and/or heating the coating material prior to dispensing the coating material onto the substrate. Due to the temperature differential, as the coating material contacts the substrate the viscosity of the coating material will increase, assisting the coating material in adhering to the substrate. Then, when the substrate is spun, the coating material with the increased viscosity will remain adhered to the substrate thereby providing a more conformal coating.

Abstract: A composition for promoting the release of bituminous materials and other adhesive materials from a substrate and methods of use thereof. More particularly, a composition comprising a silicone oil-in-water emulsion, which is stabilized by an alkoxylated polysiloxane surfactant, for use as a release agent that can be applied to a substrate, such as a truck bed, prior to use for promoting the free release of a bituminous material, such as asphalt, from the substrate.

Abstract: A rotary plate for holding a substrate for a coating device, which rotary plate comprises a plurality of suction points, is intended to be characterized by an annular elevation, wherein a diameter of the annular elevation substantially corresponds to a diameter of the substrate.

Abstract: Embodiments of the invention include methods and structures for controlling developer critical dimension (DCD) variations across a wafer surface. Aspects of the invention include an apparatus having developer tubing and an internal cam. The internal cam is coupled to a fixed axis. A flexible divider is positioned between the developer tubing and the internal cam. The flexible divider is coupled to the internal cam such that rotation of the internal cam about the fixed axis is operable to change an inner diameter of the developer tubing.

Abstract: A low surface tension liquid is supplied from a low surface tension liquid supplying unit to a heated substrate to replace a processing liquid by the low surface tension liquid. The heating of the substrate is weakened and the low surface tension liquid is supplied from the low surface tension liquid supplying unit to the substrate, so that a liquid film of the low surface tension liquid is formed. The liquid film on the substrate is removed by strengthening the heating of the substrate without supplying the low surface tension liquid from the low surface tension liquid supplying unit to a central region of the substrate.

Abstract: Structured films containing multi-walled carbon nanotubes (“MWCNTs”) have enhanced mechanical performance in terms of strength, fracture resistance, and creep recovery of polyimide (“PI”) films. Preferably, the loadings of MWCNTs can be in the range of 0.1 wt % to 0.5 wt %. The strength of the new PI films dried at 60° C. increased by 55% and 72% for 0.1 wt % MWCNT and 0.5 wt % MWCNT loadings, respectively, while the fracture resistance increased by 23% for the 0.1 wt % MWCNTs and then decreases at a loading of 0.5 wt % MWCNTs. The films can be advantageously be created by managing a corresponding shift in the annealing temperature at which the maximum strength occurs as the MWCNT loadings increase.

Abstract: There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.

Abstract: In a substrate processing method, a liquid film 30 of a processing liquid is formed on an upper surface of a substrate W, a gas which comprising vapor of a low surface tension liquid is sprayed to the liquid film 30 to form a liquid film-removed region 31. The liquid film-removed region 31 is expanded. A coolant 29 is supplied to a lower surface of the substrate W, while the liquid film 30 is cooled to a temperature lower than the boiling point of the low surface tension liquid, a heated gas is sprayed to selectively remove the coolant 29, and a range 33 in which the coolant 29 is removed is heated by a heated gas, by which the liquid film-removed region 31 on the upper surface of the substrate W is selectively heated to a temperature not less than the boiling point of the low surface tension liquid, and also a range which heats the liquid film-removed region 31 is expanded in synchronization with expansion of the liquid film-removed region 31.

Abstract: The present disclosure provides a composite structure and associated method for preparing a composite substrate comprising an inorganic coating that is adhered to an organic-based substrate via an adhesion promoting agent comprising a molecule having a urea moiety at one end of the molecule and an alkoxysilane moiety at the other end of the molecule. The use of adhesion promoting agent having at least one of an amine or imine moiety and an alkoxysilane moiety promotes tight adhesion of the inorganic coating to the substrate.

Abstract: A substrate processing method comprises: a liquid film forming step of forming a liquid film of a rinsing liquid on a pattern forming surface of a substrate formed with a pattern; a liquid pool forming step of forming a liquid pool of an organic solvent by supplying the organic solvent to the liquid film near a center of rotation of the substrate; a replacement step of replacing the rinsing liquid constituting the liquid film with the organic solvent by supplying the organic solvent to the liquid pool while rotating the substrate at a rotational speed higher than in the liquid pool forming step; an application step of applying a filler solution to the pattern forming surface coated with the organic solvent; and a filling step of causing a filler contained in the filler solution and applied to the pattern forming surface to sink and filling concave portions of the pattern with the filler.

Abstract: An injection device having at least one flexible diaphragm. The injection device for forming a preform into a container and filling the container, and further including a main housing having an inlet, an outlet and an injection chamber, a closing body movable relative to the outlet between a closed position and an opened position, a closing diaphragm attached at least to the closing body, the injection chamber being delimited at least by an inner surface of the closing diaphragm, the closing diaphragm having an outer surface defining an outside area, a bearing surface against which a supported portion of the outer surface of the closing diaphragm is applied. The closing diaphragm further includes a free portion forming with the supported portion the whole outer surface of the closing diaphragm. The bearing surface is arranged such that the surface of the free portion decreases when the closing body moves from the closed position to the opened position.

Abstract: A thermoplastic prepreg includes a mat, web, or fabric of fibers and hollow glass microspheres that are positioned atop the mat, web, or fabric of fibers or dispersed therein. The thermoplastic prepreg also includes a thermoplastic polymer that is fully impregnated through the mat, web, or fabric of fibers and the hollow glass microspheres so that the thermoplastic prepreg has a void content of less than 3% by volume of the thermoplastic prepreg. The thermoplastic material is polymerized monomers and oligomers in which greater than 90% by weight of the monomers or oligomers react to form the thermoplastic material.

Abstract: Disclosed is a substrate treating method including a solvent supplying step of supplying a solvent to a center part of a substrate while increasing a rotation speed of the substrate. In the solvent supplying step, the solvent is successively supplied to the substrate until the solvent reaches a periphery edge of the substrate. With such a substrate treating method, the solvent is able to cover a substrate surface entirely with effective suppression of particles. In other words, a process of supplying the solvent to the substrate is performable with effectively improved quality.

Abstract: Embodiments describe a method of depositing an MOF, including depositing a metal solution onto a substrate, spinning the substrate sufficient to spread the metal solution, depositing an organic ligand solution onto the substrate and spinning the substrate sufficient to spread the organic ligand solution and form a MOF layer.

Abstract: The present invention is directed to a process for the production of exhaust catalysts. In particular, the process describes a way of coating a substrate in a manner which finally leads to reduced coating times.

Abstract: A substrate processing apparatus comprises: a first solidifier and a second solidifier. The first solidifier solidifies a liquid to be solidified adhering to a front surface of a substrate by supplying a liquid refrigerant to a back surface of the substrate at a first position. The second solidifier solidifies the liquid to be solidified by at least one of a first cooling mechanism and a second cooling mechanism. The first cooling mechanism cools the liquid to be solidified by supplying a gas refrigerant toward the substrate at a second position more distant from a center of rotation of the substrate in a radial direction than the first position. The second cooling mechanism cools the liquid to be solidified by bringing a processing surface into contact with the liquid to be solidified at the second position.

Abstract: Method for coating a substrate with a coating material is described, in particular with a coating or photoresist, wherein said substrate is provided in said method. Said coating material is applied to said upper side of said substrate. A gas flow is generated, said gas flow being directed from said underside of said substrate to said upper side of said substrate, wherein said gas flow prevents a bead of said coating material forming on said edge of said upper side of said substrate or a previously existing bead is removed by means of said gas flow. In addition, a coating system is described.