Abstract: A an open relay device and system includes a chassis having one or more openings; external connectors on a first wall of the chassis, the external connectors having a plurality of external connection terminals; ground bussing modules attached to a second wall of the chassis; junction bussing modules attached to a third wall of the chassis; relay sockets attached to a fourth wall of the chassis; and wiring electrically connecting the external connectors to the ground bussing modules, the junction bussing modules, and the relay sockets, the wiring further electrically connecting the relay sockets to the junction bussing modules and the ground bussing modules.

Abstract: The description relates to devices, such as computing devices that have hinged portions. One example can include a first portion and a second portion. This example can also include a hinge assembly and a magnetic assembly. The hinge assembly can rotatably secure the first portion to the second portion. The magnetic assembly can be positioned relative to the hinge assembly and the first and second portions that bias the first and second portions to a closed position where the first and second portions overlay one another and to an open position where the first and second portions are juxtaposed and coplanar.

Abstract: The disclosed apparatus may include (1) a cage that houses at least one field-replaceable electronic module that, when operational, emits heat within a computing device, wherein the cage comprises (A) a front entry side that facilitates installation of the field-replaceable electronic module and (B) a back side that is located opposite the front entry side, (2) a heatsink that removably interfaces with the field-replaceable electronic module when the field-replaceable electronic module is installed in the cage and (3) a spring mechanism that (A) is coupled to the back side of the cage and (B) applies force to the heatsink such that the heatsink (I) is pressed against the field-replaceable electronic module and (II) establishes thermal contact with the field-replaceable electronic module to facilitate heat transfer from the field-replaceable electronic module to the heatsink. Various other apparatuses, systems and methods are also disclosed.

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Abstract: The present invention relates to a module for cooling heat generating components, in particular for cooling electronic components of a computer device, such as processors, memory modules, storage modules, that may be arranged on a motherboard. The method according to the invention, comprises at least one heat generating component, a gastight chamber having an interior volume having arranged therein a heat-transfer fluid in liquid phase that is in heat transfer contact with at least part of the heat generating component and a heat exchanging surface for transferring heat from the heat-transfer fluid out of the gastight chamber, wherein the gastight chamber comprises a displaceable wall by means of which the interior volume of the gastight chamber is variable, and wherein the interior volume of the gastight chamber is in pressure equilibrating connection with the ambient pressure outside the gastight chamber via the displaceable wall of the gastight chamber.

Abstract: Discussed are a supporting cover for curved display and a curved display device including the same, which include a fastening part for preventing a screw fastening defect. The supporting cover may include a fastening part including a screw thread which is provided in an edge of a floor having a curved shape and is inclined at an angle of N degrees from a normal line direction with respect to a curved surface of the floor, where N is a real number greater than zero, thereby preventing a screw fastening defect from occurring in assembling the fastening part and a housing.

Abstract: An apparatus may include an enclosure and a variable frequency drive (VFD) assembly disposed within the enclosure, and comprising at least one VFD. The apparatus may also include a heat sink thermally coupled to the VFD assembly, and a fan system disposed adjacent the VFD assembly and including at least one fan arranged to direct air flow to the heat sink and at least one fan to direct air flow from the heat sink.

Abstract: A system includes a primary Printed Circuit Board (PCB) and a heat transfer device that is attached to the primary PCB. The primary PCB includes a heat generating device and a thermal conductive inlay attached to the heat generating device. The heat transfer device includes a secondary PCB that is thermally coupled to the primary PCB, and a heat dissipation block. The heat dissipation block has a first side attached to the thermal conductive inlay of the primary PCB and a second side attached to the secondary PCB.

Abstract: A power conditioner is provided that includes a heat dissipating member, multiple circuit boards, and a mounting auxiliary plate. A power conditioner circuit including an electric heat generating element is formed on each of the circuit boards. The circuit boards are mounted on a front surface of the heat dissipating member. Heat dissipating fins are arranged on a back surface of the heat dissipating member. Preferably, the heat dissipating member is formed from a material having high heat dissipation property. The mounting auxiliary plate is fixed to the back surface side of the heat dissipating member and provided with a through hole for mounting to a wall. The mounting auxiliary plate has higher rigidity than the heat dissipating member.

Abstract: A cooling mechanism used inside a gimbal includes a heat dissipating module, a main board and fasteners. The main board is fixed to a lower surface of the heat dissipating module through the fasteners. The main board includes a main chip. The heat dissipating module includes an upper sealing cover; a lower sealing cover fixedly connected to the upper sealing cover, wherein a lower surface of the lower sealing cover has a hole for accommodating the main chip; an air storehouse, wherein a bottom surface of the air storehouse contacts with the main chip, a side surface of the air storehouse is adjacent to a cooling chamber; and sealing rings located between the upper sealing cover and the lower sealing cover. A cooling chamber is formed by the upper sealing cover, the lower sealing cover and a baffle, the cooling liquid is provided in the cooling chamber.

Abstract: A heat exchanger includes first, second, and third heat sinks, multiple heat pipes located within the heat sinks, and a first aluminum bar located within the heat sinks. The first aluminum bar extends from an outside edge of the first heat sink, through the first, second, and third heat sinks, and to an outside edge of the third heat sink.

Abstract: An electronic apparatus includes a casing provided with a ventilating opening disposed in a front surface of the casing; a plurality of fan devices disposed in a rear portion of the casing; a board that includes a heat generating device disposed on an upper surface of the board and includes a heat radiating device disposed on a lower surface of the board, and is housed in the casing, and is configured to divide the flow of the air into two in an upward-downward direction of the casing; a heat transport member configured to couple the heat generating device to the heat radiating device; and a seal member configured to form a duct structure extending in the front-rear direction of the casing between the board and a bottom wall portion of the casing by sealing a gap penetrating in a thickness direction of the board between the board and the casing.

Abstract: Examples disclosed herein provide a computing device. One example computing device includes a base member, a support member connected to the base member via a shaft at a first end of the support member, and a display member connected at a second end of the support member opposite the first end. The computing device includes magnetic members disposed within the display member, wherein the magnetic members disposed within the display member is to magnetically couple with magnetic members disposed within the support member to operate the computing device in a first operation mode or a second operation mode. The computing device includes a mechanism disposed within the support member and connected to the base member via the shaft. The mechanism includes a feature to overcome the magnetic coupling between the magnetic members when the computing device is to change between the first and second operation modes.

Abstract: An arrangement for a computer system includes a heat-producing expansion card and a cooling device. The cooling device has at least one fan and a hollow body with a first opening and a second opening to cool the expansion card. The hollow body is arranged with the first opening on the expansion card. The at least one fan is arranged on the hollow body in a region of the second opening or is at least partly surrounded by the hollow body by the second opening. The at least one fan produces a flow of air through the hollow body to cool the expansion card.

Abstract: A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.

Abstract: A system for controlling industrial and domestic devices includes a monitor and a cylindrical body. The monitor comprises a multitouch screen of the capacitive type and a panel that has an interface adapted to receive the cylindrical body. The cylindrical body further includes a cavity that is adapted to contain a data receiving device and is further adapted to be fixed to industrial and domestic devices.

Abstract: An electronic display assembly for suspending an electronic display from one or more elongate members is disclosed. A closed loop of circulating fluid, such as air, may be placed within a sealed electronics compartment. An open loop channel may permit fluid, such as ambient air, to pass through the assembly via a channel defined by the space between the back pan and the electronic display. A pair of passageways preferably extend vertically along the assembly and are configured to accommodate the passage of an elongate member. Clamps may be utilized within these passageways to secure the assembly to the elongate members.

Abstract: Thermally conductive assemblies that provide a heat conduction path include at least one thermally conductive inner member with longitudinally opposing first and second ends and an open center channel and an outer member surrounding the at least one thermally conductive inner member. The outer member is sufficiently flexible to expand outward in response to an outward force applied by the at least one thermally conductive inner member. The at least one inner member can be a plurality of cooperating inner members that have inner surfaces that align to form an inner perimeter surrounding the open center channel.

Abstract: In a heat dissipating device adapted to a plurality of memory modules, a base surrounds the memory modules and has two long edges parallel to the memory modules, a first short edge and a second short edge. A plurality of heat conducting members of a comb-shaped frame extends from a heat dissipating wall connected to the first short edge to the second short edge. The heat conducting members are arranged side by side to form a plurality of receiving spaces for receiving the memory modules. A cover is pivotally connected to the comb-shaped frame and can rotate with respect to a first axis parallel to the first short edge. A movable portion is fixed with the comb-shaped frame and two resilient wings of the cover push two outmost heat conducting members inwardly, such that the heat conducting members and the memory modules abut against each other tightly.

Abstract: An optoelectronic system includes an optoelectronic module and a heat sink. The optoelectronic module includes a housing and first and second housing slide locks. The first and second housing slide locks extend outward from opposite sides of the housing. The heat sink includes a heat sink bottom, first and second heat sink legs, and first and second heat sink slide locks. The first and second heat sink legs extend downward from opposite ends of the heat sink bottom. The first and second heat sink slide locks extend inward from the first and second heat sink legs. The heat sink bottom is configured to be in thermal contact with a housing top of the housing. Each of the first and second heat sink slide locks is configured to be respectively disposed beneath the first and second housing slide locks when the heat sink is removably secured to the housing.