Abstract: Self-cooling stretchable electrical circuits with a conduit forming an electrical component and containing electrically conductive liquid are disclosed. They are formed of a platform made of a stretchable material. At least one fluid conduit is formed in the platform and the conduit is formed into an electrical component and filled with the electrically conductive liquid metal. A portion of the conduit is positioned adjacent a heat sink while a pump circulates the liquid through the conduit wherein the metal is cooled at the heat sink.

Abstract: A heat dissipation unit of handheld electronic device is applied to and assembled with a handheld electronic device. The heat dissipation unit includes a main body having a heat absorption section and a heat dissipation section respectively disposed on two sides of the main body. The heat absorption section is made of ceramic material. The heat dissipation section is a heat dissipation conductor. The heat absorption section and the heat dissipation section are respectively correspondingly positioned in the handheld electronic device and outside the handheld electronic device. The heat generated inside the handheld electronic device can be quickly conducted from the ceramic-made heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device. Accordingly, the lifetime of the handheld electronic device is prolonged and the efficiency of the handheld electronic device is enhanced.

Abstract: The invention relates to an electric assembly to be mounted on a top-hat rail, comprising: an electric current supply component (200): a multi-layered support (206) including a metal plate (300), a conductive layer (302) for electrically contacting the electric current supply component (200) and an electric insulation layer (304) which is arranged between the metal plate (300) and the conductive layer (302); the electric current supply component (200) is connected in an heat-conductive manner to the metal plate (300) in order to withdraw thermal energy from the electric current supply component (200).

Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.

Abstract: A heat transfer assembly may be used to provide a thermal conduit from a module mounted on a circuit board through the circuit board, allowing a thermal path away from the module. The heat transfer assembly generally includes a thermally conductive base with at least one raised thermal pedestal accessible through at least one heat transfer aperture in the circuit board and in thermal contact with the module. In an embodiment, the heat transfer assembly is used in a remote PHY device (RPD) in an optical node, for example, in a CATV/HFC network. The RPD includes an enclosure having a base with at least one raised thermal pedestal in thermal contact with an optical module (e.g., an optical transmitter or transceiver) on a circuit board through at least one heat transfer aperture in the circuit board.

Abstract: A heat dissipation device includes: a plurality of heat receiving members disposed on a plurality of electronic components mounted on a substrate; a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate and includes a plurality of openings formed corresponding to the heat pipes, wherein the heat pipes are inserted in the respective openings, and an inner diameter of the openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the heat pipes in the perpendicular direction to the surface of the substrate.

Abstract: An electric power converter includes a semiconductor module, a cooler, and a pair of direct current bus bars. The direct current bus bars are connected to the semiconductor. The direct current bus bars serve as current paths between the direct current power supply and the switching element. The cooler is made of metal, and is electrically connected to ground. A proximal bypass capacitor is formed close to the switching element by a heat radiating plate integrated with the semiconductor module, the cooler, and an insulating layer interposed between them. The electric power converter further includes a pair of distal bypass capacitors, each of which has a larger capacitance than the proximal bypass capacitor has, and has a current path to the switching element of which a length is longer than a current path to the switching element from the proximal bypass capacitor.

Abstract: A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

Abstract: TA gas cooler for a medium voltage switchgear assembly with a gas compartment, having a housing with a hollow body for accommodating the heated gas, which flows through the medium voltage switchgear assembly and is heated by at least one heat-generating current conductor, wherein the hollow body of the housing is divided at least partly in several parallel hollow bodies, which are shaped as fins.

Abstract: Provided is a base for a server rack, the base comprising a first arm extending in a first direction; a second arm extending in a second direction, different from the first direction, the first arm and second arm each having a bottom configured to face a floor and a top configured to face toward rack-mounted computing equipment; a plurality of height-adjustable stands extending from the bottom of the first arm and the second arm; and a plurality of ball-bearings extending from the top of the first arm and the second arm.

Abstract: An electronics equipment cabinet includes a plurality of walls defining a first space and a second space adjacent the first space. A wall of the plurality of walls separates the first space and the second space and includes an opening. The cabinet further includes a heat generating module having an inlet side, an outlet side opposing the inlet side, a heat generating component between the inlet side and the outlet side, and an internal fan for directing air heated by the heat generating component into the second space via the opening of the wall. One or more walls of the plurality of walls defining the second space includes a thermally conductive material for transferring heat from the second space to a surrounding environment external to the cabinet to reduce a temperature in the cabinet. Other example cabinets and methods for reducing temperature in cabinets are also disclosed.

Abstract: Some embodiments of the present disclosure provide a transceiver extension device. A transceiver extension device is provided for connection with an enclosure including a cage for a circuit board and a transceiver. The transceiver extension device includes an extension cage configured to accommodate the transceiver, an extension connector configured to be inserted into the cage of the enclosure, and an extension circuit board configured to transmit a signal of a second transceiver to the circuit board in the enclosure.

Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.

Abstract: An electronic module with EMI protection is disclosed. The electronic module comprises a component with contact terminals and conducting lines in a first wiring layer. There is also a dielectric between the component and the first wiring layer such that the component is embedded in the dielectric. Contact elements provide electrical connection between at least some of the contact terminals and at least some of the conducting lines. The electronic module also comprises a second wiring layer inside the dielectric. The second wiring layer comprises a conducting pattern that is at least partly located between the component and the first wiring layer and provides EMI protection between the component and the conducting lines.

Abstract: An electrical module contains at least one electrical component which is accommodated in a module housing. The module housing has at least two housing parts which lie one on the other and, on their own or together with one or more further housing parts of the module housing, delimit the interior of the module housing. There is at least one adhesive layer between the two housing parts, the adhesive layer adhesively bonding the two housing parts to one another.

Abstract: The disclosure relates to an inverter having a first housing module, a second housing module, removably connected to the first housing module, and power-electronic components in both housing modules, wherein a cooling air channel, opening in the surroundings of the inverter, is delimited in the circumferential direction partially by the first housing module and partially by the second housing module. The first housing module is configured to mount to an external structure and the second housing module is configured to mount to the first housing module. The cooling air channel extends at a distance to a mounting plane of the inverter defined by the first housing module opposite the external structure.

Abstract: A circuit layout includes two or more high performance processing nodes that are cooled by a cooling fan. The cooling fan resides in a cooling fan assembly that relies on principles of aerodynamics to maximize airflow. The cooling fan assembly is coupled to the opposite side of a backplane to which the circuit layout is mounted. The backplane includes large ventilation holes to permit the cooling fan to induce significantly more airflow across the circuit layout than possible with conventional designs. At least one advantage of the approaches discussed herein is circuit layouts can be constructed to meet the competing objectives of high node performance and high node density. Accordingly, data centers can be built that offer high performance computing without requiring a significant increase in physical real estate.

Abstract: Disclosed is a water cooling system for a circuit board with heat generating components. The water cooling system includes a fin module, a water block, a liquid guiding tube and a fan. The fin module is installed on the circuit board and has a through hole; the water block is clamped between the fin module and the circuit board and has a side thermally coupled to the heat generating components, and further has a liquid inlet end and a liquid outlet end; the liquid guiding tube communicates with the liquid inlet end and the liquid outlet end and passes and is fixed into the through hole and thermally coupled to an inner wall of the through hole; and the fan is configured to be corresponsive to the fin module. Therefore, the water cooling system has the advantages of reduced volume and high cooling efficiency.

Abstract: A venting system for an electronic headset including a fan to be disposed on an outer surface of the electronic headset, a channel to receive air from the fan and direct air toward an outlet. An air channel ring may be mountable to the electronic headset. The air channel ring receives air from the outlet and directs air to an interior portion of the electronic headset.