Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.

Abstract: A cooled power conversion assembly comprising a first chamber, a second chamber at least partially separated from the first chamber, at least one first type device located in the first chamber, at least one second type device located in the second chamber, and cooling means comprising a first cooling element and a second cooling element. The first cooling element is adapted to transfer heat out of the first chamber, and the second cooling element is adapted to transfer heat out of the second chamber. The first cooling element is in direct contact with the at least one first type device, and the second cooling element is in a heat transfer connection with the at least one second type device through a gaseous cooling medium.

Abstract: A display device includes a backplate and a supporting member. The backplate has a positioning hole formed thereon. The positioning hole includes a first area and a second area arranged along a first direction; an average width of the second area in a direction perpendicular to the first direction is smaller than an average width of the first area in the direction perpendicular to the first direction. The supporting member includes a base, a positioning shaft and an engaging protrusion disposed on a bottom face of the base, wherein the positioning shaft includes an axle and a flange portion connected to an end of the axle. The flange portion passes through the first area so that the axle extends into the positioning hole; when the axle moves along the first direction to the second area, the flange portion interferes with a periphery of the second area, the engaging protrusion contacts against an inner wall of the first area to prevent the axle from moving back to the first area.

Abstract: The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an exterior of an electronic component; and a baffle plate which is away from the housing by a preset distance and is disposed on an inner side of the housing, where at least one opening is disposed on each of the housing and the baffle plate, where positions of the opening of the baffle plate and the opening of the housing are mutually staggered in a perpendicular direction, and the opening of the housing faces a non-opening area of the baffle plate in the perpendicular direction.

Abstract: A power-electronics assembly includes a plurality of power modules each having a body, a power stage disposed in the body and having opposing major sides, and a coolant channel defined in the body at a location adjacent to one of the major sides. The modules are arranged in a stack such that the coolant channels are interleaved with the power stages. At least one of the bodies defines a passageway extending between adjacent channels to connect the adjacent channels in fluid communication.

Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.

Abstract: An electric component has a housing part and a component support which is provided with a conductor path structure. The conductor path structure has an interruption, by which a connection section of the conductor path structure is galvanically separated from a main section of the conductor path structure. The component support is arranged on the housing part such that a heat-conductive connection is produced between the component support and the housing part. The main section remains galvanically separated from the housing part. The electric resistance between the main section of the conductor path structure and the housing part is measured. The component support is secured to the housing part by a securing element. The interruption is electrically bridged by the securing element and the main section is electrically conductively connected to the housing component.

Abstract: An electrical device configuration enables heat to be dissipated from a multi-layer printed circuit board (PCB) while handling electrical currents in excess of 200 amps. The semiconductor devices that convert input DC current to output AC current are mounted to a side of the PCB that is opposite the side of the PCB that receives the input DC current. A base plate that acts as a heat sink includes recessed areas to receive the semiconductor devices and enable the PCB to be positioned close to the base plate. Thermal vias are provided in the PCB to conductive heat from the semiconductor devices to the side of the PCB that receives the input current. Also, the busbars for receiving the input current are positioned to provide short resistive paths to the current to reduce the generation of heat by the current flowing in the PCB.

Abstract: A slot assembly configured for being inserted by a workpiece. The slot assembly comprises a holder body, a substrate, a push member and a heat spreader. The substrate and the holder body together form an accommodating space therebetween. The push member is movable between a released position and a pressed position. The push member is configured for being moved from the released position to the pressed position by being pushed by the workpiece. The heat spreader is movably disposed on the substrate and located in the accommodating space. The heat spreader has a thermal contact surface facing away from the substrate. The thermal contact surface is configured for being in thermal contact with the workpiece. When the push member is located at the pressed position, the heat spreader is located at a thermal contact position where the thermal contact surface is in thermal contact with the workpiece.

Abstract: A display device includes a display panel configured to display an image, a light blocking member under the display panel, a bracket facing the display panel such that the light blocking member is between the display panel and the bracket, a bridge member between the light blocking member and the bracket, and configured to support a position of the light blocking member and the bracket, and a buffer member at a same layer as the bridge member, and contacting the bridge member.

Abstract: A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing module includes a housing, an spacer and two pivoting components. The housing includes a substrate and several lateral boards. The spacer includes a main body, two pivoting portions and a locking portion. The pivoting portions are disposed on corresponding sides of the main body, the locking portion stretches from a lower side of the main body and is fixed on the circuit board via an external fixing component. The pivoting portions pass through the lateral boards and are connected to the pivoting portions. While the circuit board slides relative to the substrate to push the spacer, the main body is rotated inside the housing via the pivoting portions to lift the lower side.

Abstract: A support stand leg is pivotally supported by a leaf spring relative to a back cover of a computer device or a computer device case. The support stand leg is pivotal between a retracted position against the back cover and an extended position. The leaf spring urges the support stand leg towards the retracted position.

Abstract: An air deflecting system includes an air deflector that is physically mounted against a hot air exhaust vent of a network equipment element using a rack coupling mechanism that is adjustable to accommodate a variable lateral distance of the hot air exhaust vent from the computing rack. The air deflector receives an airflow from the hot air exhaust vent at a first direction and deflects the airflow in a second direction.

Abstract: Apparatuses and methods are provided for facilitating air-cooling of, for instance, one or more electronics racks within a data center. The apparatus includes an air-moving assembly and one or more flywheels. The air-moving assembly includes a shaft, one or more mechanical fans coupled to the shaft to rotate, at least in part, with the shaft, and a motor coupled to the shaft to rotatably drive the shaft. The flywheel(s) is sized and coupled to the shaft of the air-moving assembly to store rotational energy, and to facilitate, for a specified period of time, continued rotation of the shaft during interruption in power to the motor. In one implementation, the flywheel(s) is sized and coupled to the shaft to facilitate, for the specified time period, continued rotation of the shaft at a specified percentage, or greater, rotational speed of the shaft compared with shaft speed when rotatably driven by the motor.

Abstract: A heat dissipation assembly includes a heat sink, an electronic component and an elastic fastener. The heat sink includes a contact surface, an engaging part and a wing part. The engaging part and the wing part are protruded externally from the contact surface. An accommodation space is defined by the engaging part, the wing part and the contact surface. The engaging part has a concave structure disposed within the accommodation space. The electronic component is disposed on the contact surface. The elastic fastener includes a first free end, a bent segment and a second free end. The first free end is locked on an inner wall of the concave structure. The bent segment is contacted with a first sidewall of the wing part. The second free end is locked on an external surface of the electronic component. Consequently, the electronic component is attached and fixed on the contact surface.

Abstract: A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.

Abstract: An image processing board and a display apparatus having the same are provided. The image processing board includes a substrate, common input terminals installed on the substrate, and an additional input terminal selectively installed on the substrate. The additional input terminal is selectively installed on the substrate according to a type of display apparatus, and thus the image processing board may be used in various types of display apparatuses.

Abstract: An electronic device and a method of waterproofing a key thereof are provided. The electronic device includes a body, a display device disposed in the body, a key disposed in the body, and a key-waterproof structure including an insert-injected product that includes an insert-injected sealing area, and a bonding area where a silicon-not-attached portion is formed. The method includes assembling a flexible printed circuit board, to which a key is attached, through a silicon-not-attached portion of an insert-injected product, which is made by insert-injecting a bracket and silicon rubber, and bonding the silicon-not-attached portion.