Abstract: In one example in accordance with the present disclosure an electronic device with a multi-layer heat reduction component is described. The device includes a number of integrated circuits and a first layer in contact with at least one of the number of integrated circuits to remove heat from at least one integrated circuit. The device also includes a second layer separated from the first layer by an air gap to reduce heat transfer between the first layer and the second layer. The second layer is retractable to expose the first layer when docked to a station. The electronic device operates in a first mode when docked to a station and a second mode when not docked to the station.

Abstract: An electronic, optoelectronic or electric arrangement contains a circuit carrier having a metallic heat conductor, and a component, which is embedded, inserted or formed in the circuit carrier. The component has at least one electric, electronic or optoelectronic construction element and a rewiring layer, which contains a metallic heat conducting path. A metallic-thermal connection of the rewiring layer and the metallic heat conducting layer of the circuit carrier is provided by the heat conducting path.

Abstract: A thermal dissipation system for a server includes a compressed air generating device, a compressed air transmission device, and a controller coupled to the compressed air generating device and the compressed air transmission device. The compressed air generating device includes at least one compressed air source for outputting compressed air. The compressed air transmission device is coupled to the compressed air generating device, and is configured to transmit the compressed air to a server, to make the temperature of air inside the server can be outputted with the compressed air. The controller is configured to detect the heat in the server through the compressed air transmission device, and control values of the pressure and airflow of the compressed air output from the compressed air generating device, according to the heat detected of the server. Therefore, the thermal dissipation system can output compressed air with higher pressure and greater airflow.

Abstract: Some embodiments of an apparatus and system are described for a volumetric resistance blower. An apparatus may comprise a motor, a rotor comprising a cylindrical foam block, and a casing having one or more inlets arranged in an axial direction of the rotor and one or more outlets arranged in a radial direction of the rotor. Other embodiments are described.

Abstract: A uniform flow heat sink is described that is configured to employ variable spacing for air flow channels to account for non-uniformities in air flow due to arrangements of components within a housing of a computing device. Non-uniformities may be ascertained by analysis of an air flow profile for a computing device to detect regions of high and low flow. Air flow rates for the computing device may be balanced by configuring air flow channel spacing for the heat sink to vary around a perimeter of the heat sink and account for the ascertained non-uniformities. Air flow channel spacing may be controlled by changing the concentration, spacing, pitch, positioning and/or other characteristics of heat transfer surfaces associated with the heat sink. Generally, air flow channel spacing is increased in areas of high system impedance and decreased in areas of low system impedance to increase uniformity of flow.

Abstract: One or more racks in a rack computing system include shelving systems with mounting portions to receive computer systems in the mounting portion. The mounting portion can include an air flap structure that can restrict airflow through internal space of the mounting portion when a rack computer system is absent from the mounting portion. The air flap structure can retract to enable a computer system to be mounted in an internal space of the mounting portion. A mounting portion can include at least a portion of a backplane assembly that can be aligned to couple with a rack computer system mounted in the mounting portion to communicatively couple the rack computer system with one or more communication networks. The mounting portion can include an ejection mechanism that can eject an installed computer system from the mounting portion.

Abstract: The exemplary embodiments herein provide an electronic display assembly having an electronic display surrounded by a front panel and a housing. An ingestion gap may be placed near a portion of the perimeter of the front panel while an exhaustion gap may be placed near an opposing portion of the perimeter of the front panel. A buffer zone may be defined between the ingestion gap and the exhaustion gap. A fan may be positioned to draw open loop fluid into the ingestion gap, through a channel behind the electronic display, and out of the exhaustion gap. This fan may also draw open loop fluid through an optional heat exchanger. A circulating fan may force circulating air through an optional heat exchanger.

Abstract: A heat exchanging module comprises a casing, a plurality of first air guiding elements and a plurality of first separation elements. The first air guiding elements are disposed in the casing. Each of the first air guiding elements comprises a plurality of first structures and a plurality of second structures, the first structures are disposed parallelly, and the second structures are disposed between the first structures and connected with the first structures to form a plurality of first channels. Each of the first separation elements is disposed between the two adjacent first air guiding elements to form a second channel. An airflow direction of the first channels is different from that of the second channels. The present invention further provides an electronic device using the same.

Abstract: This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.

Abstract: A structure for efficiently transferring heat generated from an electronic part or the like to a heat dissipation member is provided. A bus bar is used for a wiring pattern in an electronic device (60), such as a power line (2), a GND line (6) and the like. A heat transfer member (25) is held between a first bus bar that is a power line (2) connected to an electronic part and a second bus bar that is a GND line (6) connected to a heat dissipation member (7) to configure a heat dissipation structure in which heat generated from the electronic part is transferred through the power line (2), the heat transfer member (25) and the GND line (6) to the heat dissipation member (7).

Abstract: A heat-receiving device includes: a first heat receiver into which a refrigerant flows, and that receives heat from a heat-generating part; and a second heat receiver into which the refrigerant discharged from the first heat receiver flows, and that receives heat from the heat-generating part or another heat-generating part; wherein the first heat receiver includes: a case; a flow path that includes first and second branch paths branch off from each other and are joined again, that is provided within the case, and through which the refrigerant flows; and a thermostat that is provided in the first branch path, and that reduces a flow rate of the refrigerant flowing through the first branch path as a temperature of the refrigerant flowing through the first branch path decreases.

Abstract: A computing device with efficient cooling is provided. The computing device includes a housing with a plurality of components disposed therein. The components can include a pair of fan assemblies, a funnel assembly, and a heat sink assembly. The funnel assembly can direct the air drawn into the housing through a longitudinal channel define in the heat sink assembly and can direct the air across an exterior portion of the heat sink assembly, allowing for efficient cooling of the processors affixed to an exterior of the heat sink assembly.

Abstract: A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components including one or more processors. The card circuit board has a chassis loading end. A heat sink is provided on the circuit board and thermally coupled to one or more electronic components to dissipate heat therefrom. The heat sink has a three-dimensional envelope having a stepped end profile relative to the chassis loading end. Vent openings are provided in shielding of the electronics card for airflow from the electronics card.

Abstract: Cooling systems employing adjacent fan cages having cage walls with interflow passages are disclosed. A cooling system includes cooling fans disposed in adjacent fan cages. Cage walls of the fan cages direct flows from the fans to the outlet ports of the fan cages which are in fluid communication with electrical components within an electronics-containing enclosure. By forming an interflow passage between the adjacent fan cages, upon occurrence of an inoperable fan, a portion of the flow from an adjacent operable fan can pass to the outlet port of the fan cage of the inoperable fan via the passage and provide better cooling of the components impacted by the inoperable fan. In this manner, thermal damage is avoided while minimizing fan noise associated with higher fan speeds.

Abstract: A heat dissipation system used for a communications device is disclosed, where the communications device includes a chassis, a network board, a service board, a backplane, and a high-rate cable; the chassis is configured to house the network board, the service board, the backplane, and the high-rate cable; the backplane is vertically inserted in a middle part or a middle rear part of the chassis, and parallel to a front side of the chassis; the service board and the network board are parallel and are connected to a front side of the backplane; the high-rate cable is connected between the network board and the service board on a rear side of the backplane; and the heat dissipation system further includes multiple fans that are installed in an array form on a rear side of the chassis, and an air vent that penetrates through the backplane.

Abstract: Dual screen display devices are disclosed. The device is able to be a mechanical hinge capable of joining multiple screens to form a single display or a substantially continuous display. The device is also capable of splitting a jointed display into separated screens. In some embodiments, the device comprises detaining mechanisms allowing the device to instantly interchange among several pre-defined angles or positions.

Abstract: A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

Abstract: The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; does not restrict the range of electronic components that can be used; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board 14 having an electronic component 13 thereon is placed in a non-metal (resin) housing having: a housing base 11 integrally comprising via a partition wall 11a a connector inserting section 18 used for electrical connection with an external mating connector (not illustrated); and a housing cover 12 attached to the housing base 11, part of the board 14 is inserted into an insertion hole provided in the partition wall 11a so that it is exposed inside the connector inserting section 16.

Abstract: An equipment chassis includes a rear-mountable fan tray assembly (FTA) having a plurality of fans arranged into two or more FTA housing portions, the rear-mountable fan tray assembly being slidably insertable into and retractable from the equipment chassis for facilitating front-to-back airflow while providing ease of access. The FTA housing portions are articulatably coupled to each other and are arranged to follow a smooth motion path when traveling from a horizontal position to a vertical position and vice versa when the rear-mountable fan tray assembly is either inserted into or retracted from the equipment chassis, wherein a top FTA housing portion is guided by a top curvilinear tracking path and a bottom FTA housing portion is guided by a bottom curvilinear tracking path.

Abstract: An RF interference suppressor for satellite receivers and more specifically those that employ the MOCA standard is provided. The RF interference suppressor shields the connection point of the center conductor of the F-connector to the PC board from spurious signals emanating from the high speed digital portions of the receiver. In addition, the RF interference suppressor shield includes a tab portion that encompasses the threaded portion of the F-connector and operates to shield the path for RF interference resulting from the gap between the F-connector body and the inner shield wall of the receiver.