Abstract: A method for making a liquid discharge head including liquid discharge openings, a liquid channel having pressure chambers communicating with the liquid discharge openings, and piezoelectric elements corresponding to the pressure chambers and arranged in the form of teeth of a comb includes the steps of filling gaps between the piezoelectric elements with a filler; forming a liquid channel pattern on a flat surface including the end faces of the piezoelectric elements and the filler filling the gaps between the piezoelectric elements; forming a coating layer on the liquid channel pattern; and removing the liquid channel pattern to form the pressure chambers.

Abstract: Provided is technology capable of avoiding complex processes and high costs while securing the protection of the functional unit upon forming a device including a glass substrate. A manufacturing method of a structural body structured with a bonding body formed from a glass substrate and a semiconductor substrate, including a first step of forming a first functional unit as a structural element of the structural body on one face of the glass substrate; a second step of bonding the semiconductor substrate to one face of the glass substrate so as to cover the first functional unit; a third step of forming an affected zone extending in the thickness direction of the glass substrate by irradiating a laser beam from the other face side of the glass substrate and scanning the focal point of the laser beam in the thickness direction of the glass substrate; and a fourth step of forming a hole in the glass substrate by etching the glass substrate and removing the portion along the affected zone.

Abstract: A monolithic ink-jet printhead, and a method of manufacturing the same, includes a substrate having an ink chamber, an ink channel, and a manifold, a nozzle plate formed on the substrate, a nozzle, a heater, and a conductor. The ink chamber includes sidewalls formed to a predetermined depth from the front surface of the substrate for defining side surfaces of the ink chamber and a bottom wall formed parallel to the front surface of the substrate at the predetermined depth from the front surface of the substrate for defining a bottom surface of the ink chamber. The nozzle plate includes a plurality of passivation layers, a heat dissipating layer being stacked on the passivation layers, and the nozzle for ejecting ink out of the printhead. The heater is positioned above the ink chamber and heats ink in the ink chamber and the conductor delivers a current to the heater.

Abstract: A method for producing a solenoid with a center limb and two outer pole shanks that have one pole surface each and one back resting so that it faces away from it. The back is first at least partially freely formed. The solenoid is then elastically tensioned towards the back by a tensioning device. In the tensioned state, the pole surfaces are ground so that the solenoid, when withdrawn from the tensioning device, has a convex support surface constituted by the pole surfaces.

Abstract: A high voltage capacitor design is provided that provides improved performance. The high voltage capacitor includes a stack of mechanically bonded capacitor cells, which in one variant utilize a separator formed of two layers of paper. In one version, the high voltage capacitor may be used as a capacitative voltage divider.

Abstract: A contact member is supported on the support shaft. A force sensor is coupled to the support shaft. A movable member is coupled to the force sensor. The pressure apparatus allows the movable member to cause the axial movement of the support shaft. A first guide serves to guide the axial movement of the support shaft. The first guide is supported on the support member. The support member stands still during the movement of the movable member. Accordingly, the movement of the movable member is restrained in the axial direction. The contact member is thus prevented from suffering from a swinging movement around the force sensor. Servo control of a higher frequency bandwidth can be applied to the movement of the contact member. The contact member moves at a higher velocity. Occurrence of resonance is still avoided in the contact member. The tact time can be shortened.

Abstract: An ink jet head includes a substrate having a flow path construction member constructing a plurality of discharge ports for discharging ink and a plurality of ink flow paths corresponding thereto, and a plurality of energy generating elements corresponding to the plurality of discharge ports. The substrate has an ink supply port for supplying ink to the ink flow paths. The ink supply port includes a first liquid chamber disposed on a plane on which the energy generating elements are formed, and having a grooves with island-shaped columns left, and a second liquid chamber disposed on the opposed plane, and having a plurality of through holes partitioned at positions corresponding to the island-shaped columns. In the ink jet head, the island-shaped columns and a partition wall for the through holes are left as a beam construction section, thereby improving a mechanical strength of a semiconductor substrate.

Abstract: According to the method of manufacturing a surface acoustic wave device of the invention, since a conductor layer is formed on electrode sections in a state where the entire regions of inter digital transducer and reflectors are covered with an insulating film, the inter digital transducer and the reflectors are protected by the insulating film during formation of the conductor layer. As a result, it is possible to obtain a highly efficient surface acoustic wave device with no sticking of foreign matters to the inter digital transducer and the reflectors.

Abstract: A method of manufacturing a liquid jet head includes the steps of: forming a piezoelectric element on one plane of a passage-forming substrate with a vibration plate interposed therebetween, and removing the vibration plate in an area where a communicating portion is formed, thus forming a penetrated hole; forming a predetermined metal layer on the one plane of the passage-forming substrate on which the piezoelectric element is formed to seal the penetrated hole with the metal layer, and patterning the metal layer in an area corresponding to the piezoelectric element, thus forming a lead electrode; adhering a reservoir-forming plate, in which a reservoir portion is formed, to the one plane of the passage-forming substrate; wet-etching the passage-forming substrate from the other plane thereof until the vibration plate and the metal layer are exposed, thus forming a pressure generating chamber and the communicating portion; and removing the metal layer by etching to allow the reservoir portion and the communic

Abstract: A method for producing center-tapped and non-center-tapped full wave bridge rectifiers suitable for low-voltage high-current operation by simultaneously winding a plurality of identical secondary coil sections around a primary coil using on a prearranged secondary foil conductor and insulation ensemble and equivalent circuit connections.

Abstract: A coaxial cable stripper, which includes a hollow cylindrical body, which has two transverse through holes and two longitudinal sliding slots, a spring member fixedly mounted inside the hollow cylindrical body, and two movable cutter holders respectively supported on the spring member at two sides and axially movably coupled to the longitudinal sliding slots of the hollow cylindrical body, each movable cutter holder having a transverse through hole corresponding to the transverse through holes of the hollow cylindrical body for the insertion of a coaxial cable and two cutters for stripping off the outer and inner insulative layers of the inserted coaxial cable.

Abstract: An optimization apparatus capable of efficiently placing an electronic component. An optimization unit (203) determines a first assignment to the placement apparatus and calculates a first placement time required for placing all the electronic components assigned to the placement apparatus by the first assignment onto a circuit board by the placement apparatus. The optimization unit selects two placement apparatuses among a plurality of placement apparatuses, selects a type of an electronic component assigned for the selected placement apparatus, determines a second assignment by interchanging two selected times assigned, calculates a second placement time required for placing all the electronic components assigned to the placement apparatus by the second assignment onto the circuit board by the placement apparatus, and employs the one of the first assignment and the second assignment which has a smaller placement time.

Abstract: A method is provided for effectively manufacturing a piezoelectric device equipped with a piezoelectric film with a crystal orientation that is aligned in a desired direction. An interlayer which partially has a layer formed by an ion beam assisted laser ablation method while controlling a temperature rise accompanied by an ion beam irradiation by a cooling device and is bi-axially oriented as a whole, is formed on a surface of a substrate. A lower electrode is formed on the interlayer. A piezoelectric film is formed on the lower electrode. An upper electrode is formed on the piezoelectric film. The lower electrode and the piezoelectric film are formed by epitaxial growth.

Abstract: A potassium niobate deposited body includes a substrate, an electrode layer formed above the substrate, and a potassium niobate layer formed above the electrode layer. The potassium niobate layer can include a domain that epitaxially grows in a (110) or (001) orientation, when a lattice constant of orthorhombic potassium niobate is 21/2 c<a<b, and a b-axis is a polarization axis.

Abstract: A method of fabricating an inductive coil having inner and outer winding portions formed from one or more metal sheets. The method includes wrapping a fiber strand around an outer surface of the inner winding portion, positioning the outer winding portion around the inner winding portion, and electrically coupling the inner winding portion to the outer winding portion to form an electric circuit.

Abstract: A piezoelectric ceramic compound expressed by a basic formula of Pb(Zn1/3Nb2/3)aZrxTiyO3 (where 0.90<a+x+y<1.00) is provided. The starting materials for the piezoelectric ceramic compound are calcined. The calcined material is milled to provide powder. A formed body containing the powder is provided. The formed body is degreased at a temperature having the formed body not sintered. A sintered body is provided by sintering the degreased body. The sintered body is heated to subject the sintered body to predetermined heat treatment. The sintered body subjected to the predetermined heat treatment is polarized to provide the sintered body with a piezoelectric property, thus providing a piezoelectric ceramic device. This piezoelectric ceramic composition can be sintered together with an electrode consisting mainly of Ag at a low temperature. Even after the sintering, the composition has its insulation resistance not decrease and has its piezoelectric properties not decline.

Abstract: Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.

Abstract: A method that involves establishing the performance level of a proposed acoustic transducer array. Deriving a geometric shape for the array based on the established performance level. Selecting piezoceramic materials based on considerations related to the performance level and derived geometry. Forming small primary shapes of the selected piezoceramic materials for use as the basic elements of the larger derived geometric shape of the array. Arranging the basic elements into a mosaic of the larger derived geometric shape. Filling the interstices between the basic elements with urethane to bind the mosaic of basic elements thereby fabricating the completed piezoceramic transducer array.

Abstract: A process comprising, in a vacuum, depositing a bottom electrode layer and a piezoelectric layer over a cavity in a substrate, the cavity being filled with a sacrificial material, patterning and etching the piezoelectric layer and the bottom electrode layer to expose one or more edges of the bottom electrode layer and the piezoelectric layer, treating some or all of the one or more edges to prevent electrical contact between the bottom electrode layer and a top electrode layer, and depositing and etching the top electrode layer.

Abstract: Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.