Abstract: Methods of creating an internal channel of a fluid-ejection device are provided. One method includes encapsulating a channel core in an element of the fluid-ejection device that corresponds to the internal channel and dissolving at least a portion of the channel core.

Abstract: A guide for inserting the prepared end of a coaxial cable into the cylindrical post of an end connector of a coaxial cable. The guide is an elongated member that is fabricated of a resilient material having a plurality flat sides that come together at equal angles to form a number of corners. The bisectors of the corner angles all cross at the central axis of the guide with the length of each bisector between the center axis and the corner being substantially equal to or greater than the inside radius of the post. A central slot passes axially through the guide and a slit passes radially through one side wall of the guide to form an entrance that opens into the slot.

Abstract: A portable memory device includes a molded housing and a printed circuit board assembly (PCBA) encased with the molded housing such that a plug connector extends from one end. A lower housing portion is produced by injection molding using a first apparatus, and then the lower housing portion is transferred to a second molding apparatus. The PCBA is mounted onto the lower housing such that the plug connector is received in a protected region. The second molding apparatus is then closed, and an upper housing portion is injected molded over the PBCA and exposed peripheral edges of the lower housing portion such that the upper housing portion becomes fused to the lower housing portion. Multiple lower housing portions connected together by plastic tethers to form a plastic strip, which facilitates efficient transfer to the second molding apparatus as a unit. The tethers are subsequently removed (e.g., singulated) to form individual memory devices.

Abstract: A method for fabricating a drop generator with a uniquely formed nonconductive mandrel, which when encapsulated with electroplated metal, shapes and defines the internal ink channel entails identifying a non-conductive dimensionally stable structure with a shape adapted to define a fluid cavity for the drop generator for an ink jet printer. The ends of the structure are covered with caps. A conductive base is mounted to each structure. Metal from the conductive base is electroformed onto the structure to a thickness at least equivalent to a desired outer dimension. The caps are removed and the structure is removed, thereby leaving a drop generator with a channel adapted to receive fluid and a slot adapted to communicate fluid from the channel to the orifice plate.

Abstract: An apparatus for protecting and merging a head stack assembly with a disc stack of a data storage device. The head stack assembly comprises a cantilevered flexure which supports a transducer at a distal end thereof. A carrier includes a carrier support surface arranged to contactingly support the distal end of the flexure. A merge tool is adapted to merge the transducer with a recording surface of the disc stack. The merge tool includes a merge support surface arranged to contactingly support a medial portion of the flexure while the carrier support surface is disposed between the merge support surface and the transducer. The transducer is merged by aligning the merge support surface with the medial portion of the flexure, and using the merge support surface to displace the distal end of the flexure from the carrier support surface and advance the transducer to a final position.

Abstract: A method for manufacturing a fluid ejection device includes providing a sacrificial structure substantially overlying a semiconductor substrate. The structure has a shape configured to define an ink chamber, ink manifold, and a nozzle. The method also includes providing a first metal adjacent the sacrificial structure and substantially overlying the substrate and removing the sacrificial structure to form the ink chamber and the nozzle. The method further includes removing a portion of the first and second sacrificial materials to form the sacrificial structure.

Abstract: A coil forming apparatus includes a twisting formation unit that twist-forms a predetermined number of U-shaped conductor segments. The twisting formation unit includes a first twisting formation jig composed of a first inside ring and a first outside ring and a second twisting formation jig composed of a second inside ring and a second outside ring. Each of the first and second inside rings has the same number of circumferentially disposed holding slots as the stator slots to hold one of each pair of straight portions. Each of the first and second outside rings has the same number of circumferentially disposed holding slots as the stator slots to hold the other of each pair of straight portions of the U-shaped conductor segments. The first and second inside rings and the first and second outside rings are coaxially coupled to shift relative circumferential position between the inside rings and the outside rings by a predetermined angle to twist the turn portions of the U-shaped conductor segments.

Abstract: The invention describes, in combination, a pin and a pin holding device and discloses a method for electrically and mechanically connecting the stranded center conductor of a microcoaxial cable to the pin without the use of traditional soldering or crimping methods. The invention allows a cable installer to connect an end of a microcoaxial cable having a stranded center conductor to a male coaxial cable connector which requires a solid center conductor such as a pin for greatest reliability. The invention provides a stranded conductor to solid wire adaptor. In a preferred embodiment, the invention utilizes a twist-wirelock section to affix a stranded wire center conductor to a solid pin.

Abstract: A component mounting method and a component mounting apparatus for picking up an electronic component, positioning the electronic component on a circuit substrate and mounting the electronic component to the circuit substrate are adapted to perform an idling operation during a pause of component mounting operation, thereby eliminating any degradation of the component mounting accuracy due to temperature changes.

Abstract: A circuit provides energy to a plurality of piezoelectric diaphragm structures formed in a two-dimensional array. Each piezoelectric diaphragm structure includes a piezoelectric element in operational contact with at least a first side electrode and a second side electrode. A switching system includes a first connection for a first power source, for application of power to the first side electrode and a second connection for a second power source, for application of power to the second side electrode. In a first state, power appropriate for performing a poling operation of the piezoelectric material is available for application to the first electrode, and the second electrode, and in a second state, power appropriate to activate the piezoelectric material to cause operational movement of the poled piezoelectric diaphragm structure is available for application to the first electrode and the second electrode.

Abstract: An apparatus for mounting semiconductor chips with a transport device that transports the substrates in cycles to a bonding station where a semiconductor chip is deposited comprises a receiving table with a support surface on which the substrates are presented one after the other for transport by the transport device as well as a pusher device with a drive system and a slide for alignment of the substrate on an end stop. In accordance with the invention, the drive system and the slide comprise a first magnet and a second magnet that attract each other, ie, they are magnetically coupled. The drive system is arranged underneath the support surface and moves its magnet back and forth whereby the magnet of the slide is moved with it. One of the two magnets can also be a ferromagnetic body. The drive system is controlled by software.

Abstract: A method for manufacturing a micro-electromechanical printer nozzle arrangement on a substrate having a layer of integrated drive circuitry includes etching a nozzle region through the layer of integrated drive circuitry up to the substrate. Electrical contact regions are etched about the nozzle region. Metal and polytetrafluoroethylene (PTFE) layers are deposited and etched on the layer of integrated drive circuitry so that the metal layer defines heater elements in electrical contact with the drive circuitry and embedded in PTFE structures disposed about the nozzle region. A nozzle chamber is etched in the substrate such that the nozzle chamber is in fluid communication with the nozzle region. The substrate is back-etched to define an ink channel in fluid communication with the nozzle chamber.

Abstract: A method of manufacturing a plurality of printhead modules, at least some of which are capable of being combined in pairs to form bilithic pagewidth printheads, the method comprising the step of laying out each of the plurality of printhead modules on a wafer substrate, wherein at least one of the printhead modules is right-handed and at least another is left-handed.

Abstract: A seal-feeding station includes a seal receiver (21) for receiving a waterproof seal (20) fed through a seal feeding tube (16) and a seal keeper (23) for keeping the waterproof seal (20) transferred from the seal receiver (21) in an electric-wire insertion position. The seal receiver (21) includes a slider board (27) which is supported slidably between a standby position and a transfer position and includes an acceptance hole (27b) in which the waterproof seal (20) is fit in when the slider board (27) is in the standby position, and a push pin (38) which is movable forward and backward, is located so as to face the acceptance hole (27b) of the slider board (27) when the slider board (27) is in the transfer position, and moves forward to push the waterproof seal (20) fit in the acceptance hole (27b) and transfer the waterproof seal (20) to the seal keeper (23).

Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) includes depositing a dielectric layer on a substrate, providing a sacrificial layer on part of the dielectric layer; providing a bottom electrode on part of the sacrificial layer on part of the dielectric layer; providing a piezoelectric layer on the bottom electrode; patterning a top electrode on the piezoelectric layer; and removing the sacrificial layer. The substrate may have a cavity receiving the sacrificial layer. As a result, a cantilevered resonator having an air gap between the bottom electrode and the dielectric layer may be simply fabricated.

Abstract: An electronic package and method of making the electronic package is provided. A layer of dielectric material is positioned on a first surface of a substrate which includes a plurality of conductive contacts. At least one through hole is formed in the layer of dielectric material in alignment with at least one of the plurality of conductive contacts. A conductive material is positioned in the at least one through hole substantially filling the through hole. At least one conductive member is positioned on the conductive material in the through hole and in electrical contact with the conductive material. The electronic package improves field operating life of an assembly which includes a semiconductor chip attached to a second surface of the substrate and a printed wiring board attached to the conductive members.

Abstract: A method of forming a disc pack for use in a disc drive is provided. The method includes forming at least one alignment feature between an inner diameter and an outer diameter of each of a plurality of discs. The at least one alignment feature of a first disc of the plurality of discs and the at least one alignment feature of a second disc of the plurality of discs are utilized to substantially vertically align servo patterns on the first disc with servo patterns on the second disc. A disc pack having discs that include alignment features for aligning servo patterns on the discs is also provided.

Abstract: An object of the present invention is to provide a wiring harness job-order production method and a wiring harness job-order production system, wherein a space for producing a wiring harness is reduced and the production efficiency of the wiring harness is improved. The wiring harness job-order production system 1 has a wiring harness assembling portion 15, an electric wire stock portion 13, and a parts stock portion 14. The wiring harness assembling portion 15 outputs wire amount data DT1 to the electric wire stock portion 13 when the wiring harness assembling portion 15 receives an order from a wiring harness ordering side 38. The wiring harness assembling portion 15 outputs parts amount data DT2 to the parts stock portion 14 when the wiring harness assembling portion 15 receives an order from the wiring harness ordering side 38. The electric wire stock portion 13 conveys a non-colored electric wire toward the wiring harness assembling portion 15.

Abstract: A hard bias (HB) structure for biasing a free layer in a MR sensor within a magnetic read head is comprised of a main biasing layer with a large negative magnetostriction (?S) value. Compressive stress in the device after lapping induces a strong in-plane anisotropy that effectively provides a longitudinal bias to stabilize the sensor. The main biasing layer is formed between two FM layers, and at least one AFM layer is disposed above the upper FM layer or below the lower FM layer. Additionally, there may be a Ta/Ni or Ta/NiFe seed layer as the bottom layer in the HB structure. Compared with a conventional abutted junction exchange bias design, the HB structure described herein results in higher output amplitude under similar asymmetry sigma and significantly decreases sidelobe occurrence. Furthermore, smaller MRWu with a similar track width is achieved since the main biasing layer acts as a side shield.

Abstract: Method for fabricating an acoustical resonator on a substrate having a top surface. First, a depression in said top surface is generated. Next, the depression is filled with a sacrificial material. The filled depression has an upper surface level with said top surface of said substrate. Next, a first electrode is deposited on said upper surface. Then, a layer of piezoelectric material is deposited on said first electrode. A second electrode is deposited on the layer of piezoelectric material using a mass load lift-off process.