Abstract: A method for forming a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Abstract: A method for manufacturing a piezoelectric oscillator. The method having the step of preparing a master substrate partitioned into plural substrate regions. Mounting on each of the substrate regions a piezoelectric vibrator and an IC for controlling an oscillation output of the piezoelectric vibrator. The master substrate is then divided into individual substrate regions by cutting the master substrate on the outside circumferences of the individual substrate regions, thereby obtaining a plurality of piezoelectric oscillators.

Abstract: A method of manufacturing a bubble-jet type ink jet printhead. The method includes forming resistive heater elements on a substrate, forming a patterned electrode layer on the resultant structure, forming an insulating layer over the resultant structure, forming barrier walls on the resultant structure and attaching a nozzle plate on the resultant structure. The method may further include etching a hole in the insulating layer, forming a second electrode layer over the etched insulating layer to contact the resistive heater elements and forming a second insulating layer thereon, where the barrier walls and then the nozzle plate are formed on top of the second insulating layer. The barrier walls group together resistive heater elements in pairs and form barriers between different pairs of resistive heater elements.

Abstract: A method for reducing plated pole height loss in the formation of a write pole for a magnetic write head is disclosed. The method includes forming a conductive layer on a thin film substrate, forming a photoresist layer on the conductive layer and forming a trench in the photoresist layer. A thick seed layer is then placed on the trench and on the photoresist layer surface using a collimator. Moreover, the process includes plating while applying a voltage to the thin film substrate where the electrically isolated seed layer is removed and the trench is filled with plating material, removing the photoresist layer, and removing the exposed portions of the conductive layer on the thin film substrate.

Abstract: A keypad assembly including a substrate, a metal layer, a patterned light-shielding layer, a light-transparent material layer and a keypad circuit module is provided. Said substrate has a first surface and a second surface and the metal layer is disposed on the first surface of the substrate. In addition, the patterned light-shielding layer is disposed on the metal layer to define a light-transparent area and a light-shielding area, wherein the patterned light-shielding layer corresponds to the light-transparent area. In the meantime, the light-transparent material layer is disposed on the second surface of the substrate and corresponds to the light-transparent area. Further, the keypad circuit module is disposed on the patterned light-shielding layer.

Abstract: Embodiments of the present invention pertain to a method of manufacturing a disk drive coupling apparatus for rigidly coupling a disk drive to a chassis of a computer. In one embodiment, a disk drive to chassis coupler is formed and a disk drive to chassis coupler engaging mechanism is created. One end of the disk drive to chassis coupler can be coupled to the chassis. The disk drive to chassis coupler engaging mechanism can be used to cause the second end of the disk drive to chassis coupler to apply pressure to the disk drive, thus, the disk drive can be rigidly coupled to the chassis.

Abstract: Embodiments of the invention provide a clamping mechanism capable of clamping a magnetic disk by an accurate fastening force. In one embodiment, a magnetic disk fastening method includes the steps of: mounting a magnetic disk on a hub structure, setting a thin plate spring having a pressure-bearing part, a flexible part and a disk holding part at a predetermined position relative to the magnetic disk with the disk holding part in contact with a surface of the magnetic disk; pressing the pressure-bearing part by screwing a fastening screw in a threaded hole formed in the hub structure; measuring a deflection by which the flexible part is deflected in the pressure-bearing part pressing step; and stopping pressing the magnetic disk upon the increase of the deflection to a predetermined value.

Abstract: A method of manufacturing a wiring board, including: providing a resin substrate on which is formed a metal layer including a first layer and a second layer formed on the first layer; forming an interconnecting pattern by etching the metal layer so that the interconnecting pattern includes the patterned first layer and second layer and a part of the first layer remains outside the second layer as a residue of the first layer; electroless plating the interconnecting pattern and the residue of the first layer; and then washing the resin substrate. The washing of the resin substrate is performed by using at least one of an acidic solution used for dissolving and removing the residue of the first layer and a metal deposited on the residue of the first layer by the electroless plating and an alkaline solution used for dissolving the resin substrate to remove an area which supports the residue of the first layer.

Abstract: A method for assembling electrical windings about an axis, the windings being strips and wound in alternating strata with their widths parallel with the axis, includes the steps: (a) Winding a first-wound winding in a winding path about the axis establishing a first stratum. (b) Arranging the first-wound winding to clear the winding path. (c) Winding one or more next windings to establish next-wound windings in the winding path until at least one next stratum is established. (d) Interleaving earlier-wound windings to establish the plurality of strata; the interleaving including the steps of: (1) rearranging a next-to-be-wound winding to realign with the winding path; (2) winding the next-to-be-wound winding in the winding path until a next stratum is established; (3) arranging the next-to-be-wound winding to clear the winding path; and (4) repeating steps (d)(1) through (d)(3) until the assembling is complete.

Abstract: Embodiments of the invention provide a method for easily and reliably neutralizing charge in an assembly process for an actuator head suspension assembly used in a magnetic disk device. In one embodiment, a head suspension assembly includes a wire trace that includes a laminated structure of a metal layer, a first dielectric layer, a conductor layer, and a second dielectric layer. The conductor layer includes an exposed portion exposed from the second dielectric layer. The suspension assembly also includes a head/slider supported by the metal layer. An actuator assembly includes an actuator arm and a flexible printed circuit board. The exposed portion of the conductor layer is immersed in a charge neutralizing solvent. The head suspension assembly is mounted to the actuator arm. A terminal of the wire trace is connected to a terminal of the flexible printed circuit board.

Abstract: A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.

Abstract: A piezoelectric element with stable and excellent piezoelectric properties is made by: a step of forming a diaphragm 30 (31, 32) on a substrate 20 (S1); a step of forming a bottom electrode 33 on the diaphragm 30 (S2); a step of forming a first piezoelectric layer 43a on the bottom electrode 33 (S3); a step of patterning both the piezoelectric layer 43a and the bottom electrode 33 (S4); a step of forming a second piezoelectric layer on the piezoelectric layer 43a and on the diaphragm 30 to mature a piezoelectric film 43 (S5); and a step of forming a top electrode 44 on the piezoelectric film 43 (S6).

Abstract: A piezoelectric resonator is assembled so that a gap is formed between a resonator element and a plug using a connecting layer formed with a conductive resin, with flattened leads having leading end portions opening in a U-shape. This piezoelectric resonator permits absorption of an impact by elasticity of the leading end portions. Further, operability can be increased by forming a temporary fixing layer using a UV-setting type resin between the leading end portions and the resonator element, or coating a silver past on one of the leading end portions and the resonator element prior to forming a connecting layer. It is thus possible to mass-produce a piezoelectric resonator unit high in impact resistance and reliability with only slight variations of frequency when exposed to high temperatures.

Abstract: A chip package is formed which has an array of leads, wherein successive leads are staggered in all three dimensions (X, Y, and Z) relative to one another to permit a large number of leads available in a confined space while maintaining the minimum separation necessary between adjacent leads. The leads are formed by placing asymmetric top and bottom masks on a lead frame, and partially etching the top of the lead frame, while partially and over etching the bottom of the lead frame. Although the resulting leads are staggered in three dimensions, no additional processing steps are needed beyond those used to fabricate conventional packages.

Abstract: A method of manufacturing an ink jet printing head includes: forming a first laminated structure by laminating at least two metal plates having a hole formed thereon and fixing the metal plates to one another by metal-metal junction, and by laminating a plurality of thin plate members having a hole formed thereon, the thin plate members including the metal plates, and fixing the thin plate members to one another; forming a second laminated structure that includes at least a part of a common ink chamber, by laminating a plurality of thin plate members having a hole formed thereon and fixing the thin plate members to one another; and fixing the first laminated structure and the second laminated structure to each other while laminating the first laminated structure and the second laminated structure on each other.

Abstract: A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin.

Abstract: A method for mounting a coil onto a stator for a rotary electric machine. The method includes forming a coil piece by winding wire having a flat cross section into a single row lamination state including wire layers that are aligned along a line that is perpendicular to flat surfaces of the wire. The coil piece is formed so that a first portion to be inserted in the slot and a second portion that is not inserted in the slot appear alternately along the coil piece. The method also includes displacing the wire layers at the first portion from one another to change the single row lamination state to a connectively laminated stat e in which the wire layers at the portion to be inserted in the slot each adjacent pair of the wire layers partially overlap with respect to a direction perpendicular to the flat surfaces of the wire.

Abstract: A method for protecting a write head coil during write pole notching using ion mill resistant mask formed by reactive ion etching is disclosed. Ion mill shaping of the write pole is performed after depositing an ion mill-resistant material to protect the coil.

Abstract: A slider includes a slider main body and a thin-film magnetic head element. The slider main body has an air bearing surface, an air inflow end, and an air outflow end. The air bearing surface has a first part closer to the air outflow end, a second part closer to the air inflow end, and a border part between the first part and the second part. The second part is slanted against the first part so that the entire air bearing surface has a convex shape bent at the border part.

Abstract: A method for fabricating a thermal inkjet head equipped with a symmetrical heater and the head fabricated by the method are provided. The method incorporates two thick photoresist deposition processes and a nickel electroplating process. The first thick photoresist deposition process is carried out to form an ink chamber in fluid communication with a funnel-shaped manifold and an injector orifice. The second thick photoresist deposition process forms a mold for forming an injector passageway that leads to the injector orifice. The nickel electroplating process provides an orifice plate on top of the inkjet head through which an injector passageway that leads to the injector orifice is provided for injecting ink droplets.