Abstract: A piezoelectric thin film resonator having a stabilized temperature characteristic of resonant frequency, a method for manufacturing the same, and a communication apparatus using the piezoelectric thin film resonator are provided. The piezoelectric thin film resonator is provided with a substrate having an opening, first and second insulation films which are provided on one surface of the substrate while covering the opening and which primarily include SiO2 and Al2O3, respectively, Al2O3 having oxygen defect and being in an amorphous state, and a piezoelectric thin film which is provided on the second insulation film and is sandwiched between electrodes and which primarily includes ZnO.

Abstract: First, a sheet member which is being unwound and conveyed from a winding body, and in which a conductive film is stuck on a support sheet, is stamped in such a shape that a coil portion, a frame portion defined around the coil portion, and a joining portion connecting the coil portion to the frame portion are left unstamped. Next, a protective sheet which is made sticky, is stuck onto a surface of the stamped structure where the conductive film is stuck, and then the support sheet is peeled off. Next, an insulative support sheet which is being unwound and conveyed from a winding body, is stuck onto a surface of the structure with the protective sheet stuck thereon where the stamped conductive film is stuck, and then the protective sheet is peeled off.

Abstract: A method of stacking a green sheet, where, in rolling up a support sheet on which a multilayer unit including a green sheet and/or electrode layer is formed, the multilayer unit can be easily unrolled without adhering to the back surface of the support sheet, and in stacking the multilayer unit, the support sheet can be easily separated from the multilayer unit. On the surface 20a of the support sheet 20 is stacked a multilayer unit U1 composed of an electrode layer 12a and/or green sheet 10a to form the support sheet with the laminated unit. Then, the support sheet 20 with the laminated unit is rolled up to form a rolled body R. The rolled body R is unrolled, the support sheet 20 with the multilayer unit is placed on a layer on which the support sheet is to be placed, the support sheet 20 is separated from the laminated unit U1, and the laminated unit U1 is stacked.

Abstract: The invention relates to a method for producing a conductive contact part for a detachable electric plug-in connection. Said method provides a contact element comprising a bushing part, sections of which contain longitudinal slits and which has ribs distributed around its periphery. A sleeve part, which can surround the bushing part and cover the ribs, comprises two opposing end faces. The sleeve part is placed and positioned in an approximately coaxial manner in relation to the bushing part, in such a way that it covers the ribs, the positioned sleeve part being locked by one of its two faces on the bushing part. The bushing part is elastically twisted about its central axis, in such a way that the ribs are towards said central axis and the other face of the sleeve part is locked on the bushing part that is held in a twisted position against the elastic restoring force of the ribs.

Abstract: A pattern forming method includes forming a resist pattern for lift off of a first film disposed on a surface side of a base, patterning the first film by dry etching using the resist pattern as a mask, depositing a second film after patterning, removing the resist pattern to remove a portion of the second film on the resist pattern, and etching the surface side of the base after removing the resist pattern. The etching includes dry-etching the surface side of the base using etching particles with a main incident angle of the etching particles to the surface side of the base being set in a range of 60° to 90° relative to a normal direction of the one surface of the base. The dry etching is performed while rotating the base about an axis substantially parallel with the normal direction.

Abstract: Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included.

Abstract: When a magnetic tape material is slit into a plurality of magnetic tapes, projections are formed in edge portions of side surfaces of the magnetic tapes. The projections are removed by pressing cutting tools against the edge portions of the side surfaces of the magnetic tape while transporting the magnetic tape. Thus, product quality of the magnetic tape is improved.

Abstract: The step of forming an electrode for external connection applies a conductive resin (10) to one end portion of each of a plurality of ink chambers (26) within each of the ink chambers (26) and to the top surface of each of a plurality of protrusions over a piezoelectric substrate (60) in one line perpendicular to the direction in which the ink chambers (26) extend. Subsequently, the conductive resin (10) located on the top surface of each of the plurality of ink chamber partitions is removed by polishing or grinding. As a result, the conductive resin (10) filling a space within each ink chamber (26) constitutes an electrode for external connection. This allows the capacitance due to the piezoelectric substrate to be decreased. Further, the driving frequency of the ink jet head can be increased. Thus, an ink jet head and its manufacturing method can be provided with a reduced power consumption, with an increased productivity and reliability and that allows a high speed printing.

Abstract: A manual machine for attaching an insulation displacement connector (10) has housing stoppers (34A,34B) for positioning it on a rest (33), a housing holder (35) for holding the connector on the rest, and a set block (36) disposed near the rest in order to position electric wires (11) at their ends or middle portions. The machine further has a wire holder (37) near the housing holder (35) so as to guide and hold the wires at a given pitch, and a wire stopper (38) pivoted to the set block (36) so as to swivel between an active position close to this block and an idle position remote from it. The wire stopper (38) has a collision portion (61) on which the wire ends (11) will impinge to be aligned one with another, and a biasing portion (63) that will urge the wires' middle portions towards the set block (36).

Abstract: A method of assembly of a disk drive including providing a disk drive base. The method further includes providing a first VCM plate with an attached first magnet. The method further includes applying a holding force against the first VCM plate for holding the first VCM plate against the disk drive base. The method further includes providing a second VCM plate with an attached second magnet. The first and second VCM plates being cooperatively formed to engage each other with the first and second magnets facing towards each other with a magnetic attractive force. The method further includes engaging the second VCM plate with the first VCM plate while maintaining the holding force against the first VCM plate greater than the magnetic attractive force between the first and second magnets.

Abstract: The present invention is directed to a load/unload ramp assembly which is interconnectable with a base plate of a dynamic load/unload-type disk drive. The load/unload ramp assembly generally includes a load/unload ramp and at least one base plate attachment cantilever. A fastener shaft is directed past each of the base plate attachment cantilevers and into a fastener receptacle on the base plate. A fastener head simultaneously exerts a force on each of the base plate attachment cantilevers that are engaged by the head to deflect such base plate attachment cantilevers toward the base plate, to in turn dispose the load/unload ramp assembly in forcible engagement with the base plate.

Abstract: A microelectromechanical fluid ejection device is formed upon a wafer upon which an interconnect layer is disposed. The fluid ejection device includes a number of fluid passageways that are produced by firstly forming a bore through the interconnect layer, from the interconnect layer side, to a depth that is greater than the interface. A second bore is back-etched through the underside of the wafer. The first and second bores meet to form the fluid passageway. Fabricating the ejection device in accordance with the disclosed method avoids etchant traveling along the interface and potentially damaging CMOS circuits located at the interface.

Abstract: Exemplary techniques for tuning the effective capacitance provided by an embedded capacitor are disclosed. The techniques may be realized by modifying one or more conductive features of one or more vias connected to the embedded capacitor to adjust the capacitance contributed by the one or more vias. One technique preferably includes altering the conductive surface area of a pad of one or more vias to which the embedded capacitor is electrically connected to increase or decrease the contributed capacitance. Another technique provides for bore drilling or tap drilling one or more vias connected to the embedded capacitor to increase the surface area of plated interior surfaces of the vias, thereby increasing their capacitive effect. An additional technique includes forming a number of vias having various capacitive effects and electrically connecting the embedded capacitor to one or more of these vias to increase the capacitance.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: A method of producing an ink-jet printing head, the method including: forming a pre-unit in which nozzles and a common ink chamber are formed; forming pressure chambers in a cavity plate through its thickness; forming a piezoelectric actuator by stacking piezoelectric sheets each having a size substantially covering the pressure chambers, with at least one electrode being interposed between adjacent two of the sheets; a step of forming an integral body by stacking and bonding the actuator and the cavity plate such that one of opposite openings of each of the pressure chambers is closed by the actuator; and a step of bonding the integral body to the pre-unit, such that the pressure chambers respectively communicate with the nozzles and the at least one common ink chamber and such that the other of the opposite openings of each of the pressure chambers is closed by the pre-unit.

Abstract: A method for forming a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit such as a microprocessor, that may need a closely coupled capacitor supplying and moderating power to the microprocessor in order to quickly respond to instantaneous power demands that may be found in high clock rate devices. The method may supply a lower voltage power supply level for minimum sized transistors in the fast core logic portions of the microprocessor, and a higher voltage power supply level for the cache memory and I/O transistors.

Abstract: A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.

Abstract: A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component.

Abstract: A method for producing an ink jet head including, on a substrate, a piezoelectric element for discharging an ink from a discharge port, and an ink flow path communicating with the discharge port so as to correspond to the piezoelectric element, the method comprising in this order a step of providing, on the substrate, a mold material corresponding to the ink flow path, a step of providing a wall material of the ink flow path so as to cover the mold material, a step of eliminating a portion of the substrate corresponding to the piezoelectric element thereby forming a space in the substrate, and a step of eliminating the mold material thereby forming the ink flow path.

Abstract: A method for fabricating a charge plate for an ink jet printhead entails removing portions of conductive material from a dimensionally stable dielectric substrate with a coating of conductive material to form at least a first and second electrode on a first face with a first space between the first and second electrodes, removing portions of conductive material from the dimensionally stable dielectric substrate with a coating of conductive material to form a first electrode extension that engages the first electrode on the conductive charging face, and a second electrode extension that engages the second electrode on the conductive charging face, whereby the first and second electrode extensions are electrically isolated from each other, additionally forming a first space between the electrode extensions, which connects with the first space between the electrode extensions.