Abstract: The invention provides a multi-die stacked package memory and an output synchronization method thereof. The multi-die stacked package memory includes multiple dies (100), and the multiple dies (100) are stacked and packaged together to form a stacked package structure. The multiple dies (100) share a CS #pin, and the CS #pin is configured to turn on or turn off the stacked package structure. The multiple dies (100) also share an IO pin. Each die (100) is provided with a SYNC_PAD pin. The SYNC_PAD pins of the multiple dies (100) are electrically connected together, the SYNC_PAD pins are configured to judge whether the multiple dies (100) are all in an idle status or not. The multi-die stacked package memory and the output synchronization method thereof are simple in structure, easy to realize, stable and reliable.

Abstract: A system includes a memory device and a processing device, operatively coupled with the memory device. The processing device is configured to perform operations that include determining a verify reference voltage associated with a logic state of a memory cell of the memory device, the verify reference voltage defining a target voltage level of a threshold voltage associated with the logic state; determining an amount of voltage compensation based on a thermal profile associated with a heat to be applied to the memory device, the thermal profile comprising a temperature associated with the heat and a period of time the heat is to be applied to the memory device; and updating the verify reference voltage using the amount of voltage compensation for an expected shift in the threshold voltage of the memory cell after the heat is applied to the memory device.

Abstract: A method for regulating the memory includes operations as follows. A mapping relationship among temperatures of a transistor, body bias voltages of the transistor, and data writing time of the memory is acquired, a current temperature of the transistor is acquired, the body bias voltage is regulated based on the current temperature and the mapping relationship, to enable the data writing time corresponding to the regulated body bias voltage to be within a preset writing time.

Abstract: Aspects of a storage device including a memory and a controller are provided which allow for detection of dropped commands based on a die status (ready/busy status) of a command received from a host device. The memory may include dies controlled by chip-enables (CE). After selecting a die using CE, the controller waits between a minimum and maximum time after receiving the command to query the die status, where the minimum time is the time by which the command is expected to begin execution and the maximum time is the shortest time by which the command is expected to complete execution. The controller queries the die status after waiting the time period. If the die status is ready when it should have read busy, the controller detects that the command associated with the data is dropped and requests the host device to reissue the command.

Abstract: A method of manufacturing an array of magnetic random access memory cells includes writing to a magnetic random access memory cell. The writing to a memory cell includes determining an optimum write current for the array of memory cells, and applying the optimum write current to a first memory cell in the array. A first read current is applied to the first memory cell to determine whether a magnetic orientation of the first memory cell has changed in response to applying the optimum write current. A second write current is applied to the first memory cell when the magnetic orientation of the first memory cell has not changed. The second write current is different from the optimum write current. A second read current is applied to the first memory cell to determine whether the magnetic orientation of the first memory cell changed in response to applying the second write current.

Abstract: A nonvolatile memory device includes a first semiconductor layer including an upper substrate in which word-lines extending in a first direction and bit-lines extending in a second direction are disposed and a memory cell array, a second semiconductor layer, a control circuit, and a pad region. The memory cell array includes a vertical structure on the upper substrate, and the vertical structure includes memory blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The vertical structure includes via areas in which one or more through-hole vias are provided, and the via areas are spaced apart in the second direction. The memory cell array includes mats corresponding to different bit-lines of the bit-lines. At least two of the mats include a different number of the via areas according to a distance from the pad region in the first direction.

Abstract: A semiconductor memory device includes a first memory cell, a second memory cell above the first memory cell, a first word line electrically connected to a gate of the first memory cell, a second word line electrically connected to a gate of the second memory cell, and a control unit that performs an erasing operation on the first and second memory cells. During the erasing operation, the control unit applies a first voltage to a first word line and a second voltage higher than the first voltage to a second word line.

Abstract: Techniques disclosed herein cope with temperature effects in non-volatile memory systems. A control circuit is configured to sense a current temperature of the memory system and read, verify, program, and erase data in non-volatile memory cells by modifying one or more read/verify/program/erase parameters based on a temperature compensation value. The control circuit is further configured to read, verify, program, and erase data by accessing a historical temperature value stored in the memory system, the historical temperature value comprising a temperature at which a previous read, verify, program or erase occurred and measuring a current temperature value. The control circuit determines the temperature compensation value by applying a smoothing function.

Abstract: An apparatus may include multiple memory devices. Each memory device may include multiple memory banks. Addresses of accessed word lines for a particular portion of memory and the number of times those word lines are accessed may be tracked by each memory device. When a memory device determines that an accessed word line is an aggressor word line, the memory device alerts other memory devices of the apparatus. The memory devices may then perform targeted refresh operations on victim word lines of the aggressor word line.

Abstract: A method for programming a memory block of a non-volatile memory structure, comprising determining whether a number of programming/erase cycles previously applied to the block exceeds a first programming/erase cycle threshold and, if the first threshold is exceeded, determining whether the number of programming/erase cycles previously applied to the block exceeds an extended programming/erase cycle threshold. Further, if the determination is made that the extended threshold is not exceeded, the method comprises applying a two-pulse per programming loop scheme to each of the outermost strings of the block and applying a single-pulse per programming loop scheme to all other strings of the block. Alternatively, or in addition thereto, relative to a programming/erase cycle threshold, one or more outermost strings of the block may be unpermitted to be further programmed, and a “sub-block” comprised of all valid strings of the block may be defined and permitted for further programming.

Abstract: A word line control method, a word line control circuit device, and a semiconductor memory are provided. The method includes: acquiring a row address input signal; acquiring a test mode signal; performing logical and decoding operations on the row address input signal and the test mode signal to generate a row address control signal, wherein the row address control signal includes at least two valid activation signals; and simultaneously activating at least two non-adjacent word lines based on the at least two valid activation signals. The row address control signal obtained allows simultaneous activation of at least two non-adjacent word lines. Since none of any two non-adjacent word lines share a common contact area, a test will not be affected by the disconnection of a contact area or the presence of high impedance, thus improving test accuracy.

Abstract: Methods, systems, and devices related to domain-based access in a memory device are described. In one example, a memory device in accordance with the described techniques may include a memory array, a sense amplifier array, and a signal development cache configured to store signals (e.g., cache signals, signal states) associated with logic states (e.g., memory states) that may be stored at the memory array (e.g., according to various read or write operations). The memory array may be organized according to domains, which may refer to various configurations or collections of access lines, and selections thereof, of different portions of the memory array. In various examples, a memory device may determine a plurality of domains for a received access command, or an order for accessing a plurality of domains for a received access command, or combinations thereof, based on an availability of the signal development cache.

Abstract: A memory system includes: a memory block including a plurality of pages each comprising a plurality of memory cells connected to bit lines and a word line of word lines, an address manager configured to output addresses corresponding to the plurality of pages, and a system data manager configured to generate index data corresponding to the each of the addresses, the index data indicating whether user data is inverted, and output the index data and information on a memory cell in which the index data is to be stored, respectively. The system data manager is configured to, determine memory cells connected to different bit lines from among memory cells included in adjacent pages corresponding to consecutive addresses of the addresses, as memory cells in which index data corresponding to the consecutive addresses are to be stored.

Abstract: A portion of a memory management operation associated with a first current level that satisfies a condition pertaining to a threshold current level and a second current level that satisfies the condition pertaining to the threshold current level is identified. Mask data associated with the portion of the memory management operation is identified. Based on the mask data, a current management action is performed during execution of a requested memory management operation received from a host system.

Abstract: A memory includes first lines arrayed along a surface of a substrate. Second lines are arrayed along the surface of the substrate either above or below the first lines and intersecting with the first lines. Resistance change memory cells are provided to correspond to intersection regions between the first lines and the second lines, respectively. First switching elements are arranged on a side of first ends of the first lines and transmitting a first voltage for writing or reading data to at least one memory cell among the memory cells. Second switching elements are arranged on a side of second ends of the first lines on an opposite side to the first ends and transmitting the first voltage to at least another one memory cell among the memory cells. The first switching elements and the second switching elements are connected to different ones of the first lines, respectively.

Abstract: According to one embodiment, a semiconductor memory device includes: first and second select transistors; first and second select gate lines; first and second interconnects; first and second memory cell transistors; and first and second word lines. In a write operation, after execution of a verify operation, in a period in which the second select transistor is ON, a voltage of the first word line changes from a first voltage to a second voltage and a voltage of the second word line changes from a third voltage applied in the verify operation to a fourth voltage, and after the voltage of the first word line changes to the second voltage and the voltage of the second word line changes to the fourth voltage, a voltage of the second select gate line changes from a fifth voltage to a sixth voltage.

Abstract: Endurance mechanisms are introduced for memories such as non-volatile memories for broad usage including caches, last-level cache(s), embedded memory, embedded cache, scratchpads, main memory, and storage devices. Here, non-volatile memories (NVMs) include magnetic random-access memory (MRAM), resistive RAM (ReRAM), ferroelectric RAM (FeRAM), phase-change memory (PCM), etc. In some cases, features of endurance mechanisms (e.g., randomizing mechanisms) are applicable to volatile memories such as static random-access memory (SRAM), and dynamic random-access memory (DRAM). The endurance mechanisms include a wear leveling scheme that uses index rotation, outlier compensation to handle weak bits, and random swap injection to mitigate wear out attacks.

Abstract: An integrated circuit die includes a magnetic tunnel junction as a storage element of a MRAM cell. The integrated circuit die includes a top electrode positioned on the magnetic tunnel junction. The integrated circuit die includes a first sidewall spacer laterally surrounding the top electrode. The first sidewall spacer acts as a mask for patterning the magnetic tunnel junction. The integrated circuit die includes a second sidewalls spacer positioned on a lateral surface of the magnetic tunnel junction.

Abstract: A semiconductor device including a substrate that has a first region and a second region, a plurality of lower conductive patterns on the substrate, the plurality of lower conductive patterns including a first conductive pattern in the first region of the substrate and a second conductive pattern in the second region of the substrate, a magnetic tunnel junction on the first conductive pattern, a contact between the magnetic tunnel junction and the first conductive pattern, a through electrode on the second conductive pattern, and a plurality of upper conductive patterns on the magnetic tunnel junction and the through electrode. The contact includes a first contact on the lower conductive patterns, a second contact on the first contact, and a first barrier layer that covers a bottom surface and a lateral surface of the second contact.

Abstract: A data storage device monitors a storage media temperature and adjusts data storage operations of the storage device based on the monitored and/or a predicted future temperature of the storage media. In one approach, data is stored in a first mode (e.g., a TLC mode) in a non-volatile storage media. One or more temperatures associated with the non-volatile storage media are monitored using at least one sensor to collect sensor data. The manner of storage of the data in the storage device is adjusted based on the collected sensor data. The adjusting comprises compressing the data to provide compressed data, and storing the compressed data in a second mode (e.g., an SLC mode) in the non-volatile storage media.