Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.

Abstract: A method of erasing vertical NAND strings from a source side of the vertical NAND strings includes applying a relatively high erase voltage to a source line, applying a relatively low voltage or 0 V to bit lines, applying a first drain-select-level voltage that is less than the erase voltage to one of the first drain-select-level electrically conductive layers, and applying a second drain-select-level voltage that is greater than the first drain-select-level voltage and not greater than the erase voltage to one of the second drain-select-level electrically conductive layers.

Abstract: A storage device includes a power supply circuit that receives a power disable signal from a host device and provides a first internal voltage and a second internal voltage, a non-volatile memory including a memory device, and a storage controller that controls the non-volatile memory and includes a processor that performs a data recovery operation on data stored in the memory device and a host interface that communicates with the host device. When the power disable signal is activated at a power off time, the storage controller is powered off, the power supply circuit interrupts the first internal voltage and the second internal voltage during a reference time following the power off time, and provides the first internal voltage to the processor after the reference time has elapsed following the power off time.

Abstract: Control logic in a memory device identifies a request to execute a memory access operation on the memory cell. A first set of pulses corresponding to a first voltage ramp slope level is caused to be applied to the memory cell during a first time interval of the memory access operation. The control logic causes a second set of pulses corresponding to a second voltage ramp slope level to be applied to the memory cell during a second time interval of the execution of the memory access operation, wherein the first slope level and the second slope level are different.

Abstract: A memory system includes a non-volatile memory, and a controller configured to issue a first command requesting a first operation to the non-volatile memory and a second command to the non-volatile memory. The second command may be for requesting a duration time of the first operation or for requesting an execution stage of the first operation. In accordance with the information returned by the non-volatile memory in response to the second command, the controller issues a third command requesting a completion status of the first operation to the non-volatile memory. The first operation may be a data read operation, a data write operation, or a data erase operation.

Abstract: An integrated memory assembly comprises a memory die and a control die bonded to the memory die. The memory die comprises a three dimensional non-volatile memory structure and a first plurality of sense amplifiers. The first plurality of sense amplifiers are connected to the memory structure and are positioned on a substrate of the memory die between the memory structure and the substrate such that the memory structure is directly above the first plurality of sense amplifiers. The control die comprises a second plurality of sense amplifiers that are connected to the memory structure. The first plurality of sense amplifiers and the second plurality of sense amplifiers are configured to be used to concurrently perform memory operations.

Abstract: A controller for controlling a memory device comprising a plurality of multi-level cell memory blocks, the controller includes: a processor suitable for controlling the memory device to perform a read operation on a target logical page using some of the plurality of read voltages in a selected read voltage set; and an error correction code (ECC) component suitable for determining whether the read operation is successful, by performing error detection and correction on data generated in the read operation and output from the memory device, wherein, when the read operation is determined to be successful, the processor updates the selected read voltage set with the read voltages used in the read operation when it is successful and estimated values of unused read voltages of the selected read voltage set, the estimated values being determined based on the used read voltages.

Abstract: Shift register includes input sub-circuit coupling input terminal to first node responsive to signal of first clock terminal in input stage, control sub-circuit transmitting signal of second clock terminal to intermediate output terminal according to level at first node and controlling potential of third node according to potential of intermediate output terminal and signal of third clock terminal in input, output and reset stages, pull-up sub-circuit coupling second level terminal to final output terminal responsive to potential of intermediate output terminal in output stage, first voltage stabilization sub-circuit stabilizing voltage between final output terminal and third node responsive to signal of next-stage node connection terminal, pull-down transistor having gate electrode coupled to third node, first electrode coupled to first level terminal, and second electrode coupled to final output terminal.

Abstract: The present technology relates to an electronic device. A storage device in which a memory device controls an ODT operation to improve operation performance of the memory device with a small number of pins includes a plurality of memory devices comprising a target memory device in which an operation is performed and non-target memory devices, and a memory controller configured to control the plurality of memory devices. Each of the plurality of memory devices includes an on die termination (ODT) flag generator configured to generate a flag that indicates that an ODT operation is possible for the non-target memory devices, and an ODT performer configured to determine whether the ODT operation is an ODT read operation for a read operation or an ODT write operation for a write operation based on the flag and configured to generate an enable signal that enables the ODT read operation or the ODT write operation.

Abstract: A method for performing memory access management with aid of machine learning in a memory device, the associated memory device and the controller thereof, and the associated electronic device are provided. The method may include: in the memory device, during a training phase, performing machine learning according to a predetermined database regarding threshold voltage distribution, to generate at least one threshold voltage identification model, wherein the at least one threshold voltage identification model is utilized for determining bit information read from a memory cell of the NV memory; and in the memory device, during an identification phase, obtaining representative information of one or more reference voltages when reading the NV memory, for performing machine identification according to the at least one threshold voltage identification model to generate read data, wherein the read data includes the bit information.

Abstract: The present technology relates to a semiconductor device and a method of operating the same. The semiconductor device includes a sensing voltage generator configured to generate a temperature voltage having a voltage level determined according to an internal temperature of the semiconductor device and a reference voltage having a constant voltage level, a code generator configured to generate a temporary code including a sensing code value corresponding to the internal temperature and a boundary value indicating whether the internal temperature is included in a boundary portion associated with at least one temperature range corresponding to the sensing code value based on the temperature voltage and the reference voltage, and a code correction component configured to generate a correction code for generating an operation voltage of the semiconductor device by correcting the temporary code, based on the temporary code and a previously generated correction code.

Abstract: A novel memory device is provided. The memory device includes a plurality of memory cells, and one memory cell includes a first transistor and a second transistor. One of a source and a drain of the first transistor is electrically connected to a gate of the second transistor through a node SN. Data written through the first transistor is retained at the node SN. When an OS transistor is used as the first transistor, formation of a storage capacitor is not needed. A region with a low dielectric constant is provided outside the memory cell, whereby noise from the outside is reduced and stable operation is achieved.

Abstract: A method of performing an erase operation on non-volatile storage is disclosed. The method comprises: applying, in a first erase loop of a plurality of erase loops of the erase operation, a first erase pulse to a first grouping of non-volatile storage elements; after applying the first erase pulse, determining an upper tail of a threshold voltage distribution of the first grouping of non-volatile storage elements; determining a difference between the upper tail of the first grouping of non-volatile storage elements and an upper tail of a threshold voltage distribution of a second grouping of non-volatile storage elements; and disabling, in a second erase loop of the plurality of erase loops, the erase operation on the first grouping of non-volatile storage elements if the difference is greater than or equal to the threshold amount.

Abstract: Memory devices might include a controller configured to cause the memory device to apply a first plurality of incrementally increasing programming pulses to control gates of a particular plurality of memory cells selected for programming to respective intended data states, determine a first occurrence of a criterion being met, store a representation of a voltage level corresponding to a particular programming pulse in response to the first occurrence of the criterion being met, set a starting programming voltage for a second plurality of incrementally increasing programming pulses in response to the stored representation of the voltage level corresponding to the particular programming pulse, and apply the second plurality of incrementally increasing programming pulses to control gates of a different plurality of memory cells selected for programming to respective intended data states.

Abstract: The present invention provides a magnetoresistance effect element with a high read operation speed, a magnetic memory array, a magnetic memory device, and a write method for a magnetoresistance effect element.

Abstract: Stochastic or near-stochastic physical characteristics of resistive switching devices are utilized for generating data distinct to those resistive switching devices. The distinct data can be utilized for applications related to electronic identification. As one example, data generated from physical characteristics of resistive switching devices on a semiconductor chip can be utilized to form a distinct identifier sequence for that semiconductor chip, utilized for verification applications for communications with the semiconductor chip or utilized for generating cryptographic keys or the like for cryptographic applications.

Abstract: Techniques are described for optimizing the peak current during a program operation by controlling a timing and ramp rate of a program-inhibit voltage signal as a function of a program loop number and/or program progress. A transition voltage between a regulated ramp up rate and an unregulated ramp up rate can also be adjusted. For initial and final sets of program loops in a program operation, the ramp up of the program-inhibit voltage signal can occur early so that it overlaps with operations of sense circuits in updating their latches based on results from a verify test in a previous program loop. For an intermediate set of program loops, the overlap is avoided. The ramp up rate can be larger and the transition voltage smaller for the initial and final sets of program loops compared to the intermediate set of program loops.

Abstract: A phase change memory system comprises a phase change memory device which includes a plurality of memory units including a plurality of memory cells in units of at least one or more codewords and a phase change memory controller which performs a chip refresh operation for refreshing the entire phase change memory device, wherein the phase change memory device includes a setting circuitry which determines one of the plurality of memory units in a desired manner, a refresh controller which refreshes the decided memory unit, a sensing circuitry which senses data of at least one or more codewords included in the refreshed memory unit, and a request circuitry which requests a host for the chip refresh operation on the basis of a result of the sensing operation.

Abstract: Methods, apparatuses, and systems related to managing operations performed in response to refresh management (RFM) commands. A controller generates the RFM command for coordinating a refresh management operation targeted for implementation at an apparatus. The apparatus tracks refresh target set that includes refresh management target locations within the apparatus. According to the tracked refresh management target set, the apparatus selectively implements the targeted refresh management operation and/or a response operation in addition to or as a replacement for the targeted refresh management operation.

Abstract: Methods, systems, and devices for storing and reading data at a memory device are described. A memory device may utilize one or more storage states to store data within a data word. The memory device may exhibit higher data leakage or more power consumption when storing or reading a first storage state compared to storing or reading one or more other storage states. In some cases, the memory device may generate a second data word corresponding to a first data word by modifying each symbol type of the first data word to generate a different symbol type for the second data word. A memory device may reduce the occurrence of a storage state associated with large data leakage, or high-power consumption, or both. Further, the memory device may generate and store an indicator indicating the transformation of a corresponding data word.