Abstract: An endoscope including: a shaft; a main body arranged at a proximal end of the shaft; an eyepiece arranged at a proximal end of the main body; an eyepiece system tube, in which the eyepiece is arranged; an eyepiece cone arranged at a proximal end of the eyepiece, wherein the eyepiece cone comprises at least two parts; and an electronic component arranged between the at least two parts of the eyepiece cone; wherein the electronic component is connected to an electronic circuit arranged inside the endoscope and outside the eyepiece system tube.

Abstract: An observation instrument includes an instrument shaft having a distal end and a proximal end, and an optical arrangement extending at least sectionally through the instrument shaft. The optical arrangement includes at least one optical component that is accommodated in a support shaft. The support shaft is arranged in the instrument shaft in an at least sectionally axially displaceable manner and is preloaded distally.

Abstract: A semiconductor memory cell includes a floating body region configured to be charged to a level indicative of a state of the memory cell; a first region in electrical contact with said floating body region; a second region in electrical contact with said floating body region and spaced apart from said first region; and a gate positioned between said first and second regions. The cell may be a multi-level cell. Arrays of memory cells are disclosed for making a memory device. Methods of operating memory cells are also provided.

Abstract: Disclosed are methods, systems and devices for operation of memory device. In one aspect, volatile memory bitcells and non-volatile memory bitcells may be integrated to facilitate transfer of stored values between the volatile and non-volatile memory bitcells.

Abstract: An endoscope system includes an insertion portion receiving a first force from an enteric canal and applying a second force, which is a reaction, to the enteric canal, a detection device detecting a position of the insertion portion, and a processor. The processor calculates a position of a point of application, a direction, and a magnitude of the first force, performs an arithmetic operation of a shape/position of the insertion portion based on an output from the detection device, determines a reaction position at which the second force is received, based on position information of the insertion portion and on position information of the point of application of the first force, sets two fixed points where the enteric canal is fixed, and calculates information of a third force and a fourth force directed toward the two fixed points from the reaction position with respect to the second force.

Abstract: An ECC decoder includes: a memory comprising a memory region; a first converter configured to transmit a hard bit, received from a channel, to the memory to store the hard bit in a first area of the memory region; a second converter configured to receive the hard bit read from the first area and output a reliability value corresponding to the hard bit, whenever a hard decoding operation on the hard bit is iterated; and a variable node configured to perform the hard decoding operation using the reliability value.

Abstract: A read/write method and a memory are provided. The read/write method includes: issuing a read command to a memory, wherein the read command points to an address; reading to-be-read data from a storage unit corresponding to the address to which the read command points; and in response to an error occurring in the to-be-read data, marking the address to which the read command points as disabled. When executing a read/write operation on the memory, the address of the storage unit is marked to distinguish an enabled storage unit from a failed storage unit in real time. A data error or a data loss can be avoided, thereby greatly improving the reliability and the service life of the memory.

Abstract: A memory device can include multiple memory cells and a processing device operatively coupled with the memory device to perform operations including grouping the memory cells into a groups based on a metric reflecting an electrical distance of a memory cell from a voltage source, and determining, for each group, a respective share of write operations, wherein the share of write operations is related to an aggregate value of the metric for memory cells of the group. The operations can also include distributing the write operations to each group according to the share of write operations determined for the group.

Abstract: Apparatuses, systems, and methods for counter based read clocks in stacked memory devices. An interface die provides a read command to a core die, which reads data with timing based on the read command provides that data to a read FIFO circuit of the core die. A delay time after providing the read command, the interface die begins providing a counter-based clock signal which operates an output of the read FIFO. The counter-based clock signal operates on a different time domain (e.g., a faster frequency) than the timing of the read command.

Abstract: A memory device includes a cell array including cells, an address transition detector outputting a transition detection signal as to whether an address of a write command is changed, and a control logic circuit generating one of word-line-on signals for performing a write operation on the cell array in response to the write command, and terminating the write operation in accordance with the transition detection signal. The word-line-on signals include a long-kept word-line-on signal that stays active before the address is changed and a divided word-line-on signal that is, before the address is changed, divided into sub-word-line-on signals.

Abstract: A memory device includes a memory cell and a controller. The memory cell includes: (a) an array of molecule chains, at least one molecule chain includes: (i) first and second binding sites positioned at first and second ends of the molecule chain, respectively, and (ii) a chain of one or more fullerene derivatives, chemically connecting between the first and second binding sites, (b) source and drain electrodes, electrically connected to the first and second binding sites, respectively, and configured to apply to the array a source-drain voltage (VSD) along a first axis, and (c) a gate electrode, configured to apply to the array a gate voltage (VG) along a second different axis. The controller is configured to perform a data storage operation in the memory cell by (i) applying to the gate electrode a signal for producing the VG, and (ii) applying the VSD between the source and drain electrodes.

Abstract: Disclosed is a system including a memory device having a plurality of physical cells and a processing device, operatively coupled with the memory device. The processing device maintains association of block families with a first (second, etc.) bin of a plurality of bins, each of the plurality of bins associated with one or more read voltage offsets. The read voltage offsets are used to compensate for a temporal read voltage shift caused by a charge loss by memory cells of the block families. Responsive to an occurrence of a power event, the processing device performs diagnostics of one or more blocks of various block families and determines whether to maintain association of the block families with current bins of the respective block families or to associate the block families with different bins.

Abstract: A driver circuit for operating a memory cell, adapted to be coupled to at least one memory cell through a respective output node, said driver circuit including: a first circuit for supplying the memory cell with a first read reference voltage through the output node; a second circuit for supplying the memory cell with a second read reference voltage through the output node; and a third circuit for controlling an operation of the second circuit, wherein a range of the second read reference voltage at the output node is wider than a range of the first read reference voltage at the output node during a read operation on the memory cell.

Abstract: A sense amplifier is biased to reduce leakage current equalize matched transistor bias during an idle state. A first read select transistor couples a true bit line and a sense amplifier true (SAT) signal line and a second read select transistor couples a complement bit line and a sense amplifier complement (SAC) signal line. The SAT and SAC signal lines are precharged during a precharge state. An equalization circuit shorts the SAT and SAC signal lines during the precharge state. A differential sense amplifier circuit for latching the memory cell value is coupled to the SAT signal line and the SAC signal line. The precharge circuit and the differential sense amplifier circuit are turned off during a sleep state to cause the SAT and SAC signal lines to float. A sleep circuit shorts the SAT and SAC signal lines during the sleep state.

Abstract: Methods, systems, and devices for read threshold adjustment techniques for memory are described. A memory device may read a codeword from a memory array of the memory device using a read threshold having a first value. The memory device may increment one or more counters of the memory device based on reading the codeword. The counter may indicate a quantity of bits of the codeword that correspond to a first logic value. The memory device may detect an error, such as an uncorrectable error, in the codeword based on reading the codeword. The memory device may adjust the read threshold from the first value to the second value based on the quantity of bits indicated by the counter. The memory device may read the codeword using the read threshold having the second value.

Abstract: A system can include a voltage generator configured to generate a reference voltage, a power-up voltage, and a replicated voltage based on a power supply voltage. The system can further include a logic sub-component coupled to the voltage generator and configured to output a reset signal based on a comparison of the reference voltage to the power-up voltage and an indication that the reference voltage that has entered a steady state and is reliable as a measurement with respect to a voltage level of the power supply voltage. The indication can be determined based on a comparison of the replicated voltage to a particular threshold voltage level.

Abstract: A memory device includes: a plurality of channels, each including a memory cell array, the memory cell array including a normal cell array, the normal cell array including normal memory cells, and each of the normal memory cells being a volatile memory cell; a testing control circuit, configured to control testing of the normal cell array in the plurality of channels in response to a testing instruction, and to determine an access address of a normal memory cell failing the testing in the normal cell array in the plurality of channels to be a failure address; and a non-volatile memory cell array which includes a plurality of non-volatile memory cells and is configured to receive and store the failure address from the testing control circuit.

Abstract: A memory test method includes: testing a first memory to acquire defect information of the first memory; acquiring repair information of the first memory according to the defect information of the first memory; and storing the repair information of the first memory in a second memory. In the technical solutions provided in the embodiments of the present disclosure, other memories may be used to store the repair information of the currently tested memory, so that the storage space can be increased and the test efficiency can be improved.

Abstract: An apparatus including a test validation circuit and associated systems and methods are disclosed herein. The apparatus may include a self-test circuit configured to implement at least a portion of a self-test process that determines operating conditions of the apparatus. The test validation circuit may be configured to generate a flag based on comparing (1) an input stream or a portion thereof associated with the self-test to (2) test data associated with the self-test. The flag may represent a validity associated with the implementation of the self-test process or the portion thereof.

Abstract: A method for testing a memory chip including: performing an electrical die sorting (EDS) test on the memory chip; performing a package test when the EDS test is passed; performing a module test when the package test is passed; performing a mounting test when the module test is passed; and setting the memory chip to a mirroring mode through a fusing operation when the EDS test, the package test, the module test or the mounting test is failed.