Abstract: A shunt-resistance type current detector includes a flat-plate shaped shunt resistor joined between a flat-plate shaped first bus bar and a flat-plate shaped second bus bar. Each of the bus bars includes respective detection conductors connected to a current detector. The shunt resistor and each of the bus bars are joined via weld parts. A gap for mounting the shunt resistor is formed between the first bus bar and the second bus bar, and projected parts are formed each being projected toward the gap from opposing faces opposing to each other in the gap. The shunt resistor comes an contact with each of the projected parts in a top-and-bottom direction.

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense loop can be fabricated on a wiring plane of the PCB to encircle a current supply via that supplies current to an IC mounted on the BGA package. A MUX/Sequencer can sequentially connect wires of the current sense loop to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Abstract: An example test system includes a device interface board (DIB) having one or more signal transmission paths and an interface for connecting to one or more other components of the test system. Test circuitry is configured to inject test signals into the one or more signal transmission paths and to measure transmitted versions of the test signals at the interface to obtain measurement signals. One or more processing devices are configured to generate calibration factors based on differences between the injected test signals and the measurement signals, and to store the calibration factors in computer memory. The calibration factors are for correcting for effects on the test signals of the one or more signal transmission paths.

Abstract: There is provided a prober provided with a plurality of inspection chambers. Each inspection chambers includes: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a cleaning wafer thereon; an aligner configured to drive the chuck top in a vertical direction when the probe card is cleaned using the cleaning wafer; a seal mechanism configured to allow a sealed space to be provided between the probe card holder and the chuck top; a pressure sensor configured to detect an internal pressure of the sealed space, which fluctuates with an operation of the chuck top driven by the aligner; and an electro-pneumatic regulator configured to control the internal pressure of the sealed space by performing an intake or exhaust operation with respect to the sealed space based on the internal pressure detected by the pressure sensor.

Abstract: An apparatus includes an integrated circuit that includes an in-circuit power switch coupled to a power supply node, a functional circuit coupled between the in-circuit power switch and a ground node, a test circuit, and a test power switch coupled to the test circuit, wherein the test power switch is a replica of the in-circuit power switch. The test circuit is configured to determine characteristics of the test power switch, and to measure a voltage difference across the in-circuit power switch. The test circuit is also configured to use the characteristics of the test power switch and the voltage difference to determine a power consumption of the functional circuit.

Abstract: A pressure cell system includes a pressure cell configured to house a sample within inner walls of the pressure cell. An injection system is configured to inject an injectable medium into the pressure cell in a gap between the sample and the inner walls. A heating element is configured to provide heat to the injectable medium in the pressure cell. A pressure gauge is configured to measure pressure inside the pressure cell. A temperature gauge is configured to measure temperature in the pressure cell. A top is configured to provide a pressure resistant lid on the pressure cell. A coaxial resonator system is configured to capture microwave measurements of the sample at different temperatures and pressures after the sample is placed inside of the pressure cell, a top of the pressure cell is closed, and after the injectable medium is injected into the pressure cell in the gap.

Abstract: An illustrative parametric testing system includes a motherboard disposable over a wafer prober chuck. First electrical connectors are disposed on and electrically connected to the motherboard. At least one parametric testing cards is disposable in physical and electrical contact with an associated one of the first electrical connectors proximal a pad of a device under test. The parametric testing card includes electronic circuitry configured to receive a digital signal indicative of test plan instructions, generate an analog stimulus signal for a device under test responsive to the test plan instructions, perform an analog measurement of a stimulated device under test, and transmit a digital signal indicative of the measurement of a device under test. The system includes an interface to a computing system. The interface is electrically connectable to the motherboard. The system includes at least one power supply electrically connectable to the motherboard.

Abstract: An arrangement includes a conductor, forming the primary side of a transformer, the secondary side being connected to a rectifier circuit. The rectifier output is connected to a voltage stabilizing circuit for an electronic unit and to a first series circuit formed by a first switching component and a first resistor. In the event of a first voltage value being reached at the first input of the voltage stabilizing circuit, the first switching component is switched to be conductive. The secondary current of the transformer flows via the first resistor to drop an electrical voltage across the first resistor. The electric current of conductor is determinable from the voltage. The use of just one transformer used both for energy generation and for current measurement makes it possible to realize a very compact and small design of a current measuring device having a simple construction.

Abstract: An inductive current transformer for transforming a primary current into a secondary current, has a secondary winding with two terminals, an electronic device for transmitting information to an external measuring device, a first inductive coupling device connected to the secondary winding, and a power supply device which is coupled to the secondary winding via the first inductive coupling device and which is adapted to generate a supply voltage for the electronic device from the secondary electric current of the secondary winding.

Abstract: A current sensor that outputs an output signal according to a signal magnetic field that is generated by a current to be measured is provided. The current sensor includes at least one magnetic sensor, a temperature sensor, an amplifier, and an offset adjusting circuit. The magnetic sensor generates a sensor signal commensurate with the signal magnetic field. The temperature sensor detects an ambient temperature. The amplifier amplifies the sensor signal at an amplification rate commensurate with the detected temperature and generates the output signal. The offset adjusting circuit adjusts an offset of the output signal. The offset adjusting circuit adjusts an offset in accordance with a relationship (mathematical expression) that holds between an output signal under no signal magnetic field and an amplification rate corresponding to the temperature.

Abstract: A current sensor includes three bus bars, each of which has recesses. The third bus bar is between the first and second bus bars. The recesses of the first and second bus bars are symmetrical about a virtual line that passes through the center of the third bus bar. The third bus bar has two recesses that are symmetrical about the same virtual line.

Abstract: A display panel includes: a pixel region comprising a plurality of pixels; an open/short test region comprising a plurality of open/short test pads; a dummy stage configured to generate a carry signal in response to a scan start signal; and a plurality of stages configured to sequentially provide a plurality of scan signals to the plurality of pixels in response to the carry signal, wherein the plurality of stages is spaced apart by a first distance from the pixel region, and the dummy stage is spaced apart by a second distance greater than the first distance from the open/short test region.

Abstract: An Electron Paramagnetic resonance (EPR) system and method allows the measurement paramagnetic characteristics of materials in real-time, such as heavy oil, hydrocarbons, asphaltenes, heptane, vanadium, resins, drilling fluid, mud, wax deposits or the like. The EPR systems and methods discussed herein are low cost, small and light weight, making them usable in flow-assurance or logging applications. The EPR sensor is capable of measuring paramagnetic properties of materials from a distance of several inches. In some embodiments, a window will be used to separate the EPR sensor from the materials in a pipeline or wellbore. Since the sensor does need to be in direct contact with the materials, it can operate at a lower temperature or pressure. In other embodiments, the EPR sensor may be placed in the materials.

Abstract: A method of detecting electrical failures in a wind turbine generator control system is described. The method comprises sending a test pulse through a signal path within the control system and detecting the test pulse once it has passed through the signal path, measuring a current through the signal path, and determining an input status and/or an output status of the signal path. Then, the nature of the electrical failure is identified based on a combination of the detected test pulse, the measured current and the determined input status and/or output status of the signal path.

Abstract: A structural health monitoring method is provided that utilizes self-sensing printed polymer structures. The method is based on resistivity properties of conductive materials, which can be integrated to a 3D printed polymer structure during additive manufacturing. An article to be monitored has at least one 3D printed polymer structure including a circuit comprising at least one conductive pathway extending through a non-conductive material. The resistance across the circuit is measured during or after loading of the article to determine a resistance value. The measured resistance value is compared to a known resistance value, and based on the comparison, a defect can be detected in the 3D printed polymer structure. Structural health monitoring systems and articles with integrated structural health monitoring are also provided.

Abstract: A wafer testing system and a method of testing a wafer include placing a wafer on a vacuum chuck containing a plurality of vacuum zones, determining a warpage of the wafer, providing a different magnitude of vacuum suction to different vacuum zones at the same time based on the determined warpage of the wafer to reduce the warpage of the wafer, and testing the wafer.

Abstract: A prober includes a plurality of inspection chambers, each of the plurality of inspection chambers including: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a wafer on the chuck top; a seal mechanism configured to form a sealed space between the probe card holder and the chuck top; a temperature adjustor configured to adjust a temperature of the chuck top; and a gas supplier configured to supply a dry gas to the sealed space, and wherein, in a state in which no wafer is placed on the chuck top, the sealed space is purged with the dry gas, and precooling of the probe card is performed by cold heat of the chuck top having a temperature adjusted by the temperature adjustor.

Abstract: Embodiments of the invention provide an electric meter assembly including a meter support platform or base able to reversibly electrically couple to a transformer providing inputs including an AC power supply, phase voltage, and/or a phase current. Output of the meter support platform or base can be DC power, AC phase voltage signals and/or AC phase current. Further, a removable or portable meter can couple to the meter support platform or base and to an electric meter system including a meter core coupled to a wireless transmitter, an antenna, an integrated power sensor, and data meter front end. The system includes a data manager configured for electric service analysis including energy usage, and/or interval temperature, phase voltage, current and phase angle in real time, electric energy kWh and kVARh values in a user-specified period, wrong meter base installation detection, physical location of the removable or portable meter, and tamper detection.

Abstract: A display device includes a defect inspection circuit, and a display panel having a display area and a peripheral area positioned outside the display area. The display panel includes a sensing wire positioned in the peripheral area and connected to the defect inspection circuit. The defect inspection circuit includes a resistance detection circuit that detects a resistance of the sensing wire based on an output signal corresponding to the sensing wire, a memory that stores first resistance information related to the resistance of the sensing wire detected in a first inspection operation, and a comparator circuit including a first comparator that compares the first resistance information with second resistance information. The second resistance information is related to the resistance of the sensing wire detected in a second inspection operation that is performed at a different time than the first inspection operation.

Abstract: A test apparatus includes a probe card and a tester. The probe card has a plurality of regions corresponding to dies of a wafer, respectively. The probe card includes a tray having a first region with a lens and a second region without a lens. The tester is configured to generate a drive control signal for moving the tray in a first direction or a second direction to locate the first region or the second region at a position facing the dies.