Abstract: A conductive contactor unit includes: a signal conductive contactor configured to input or output a signal to or from a predetermined circuit structure, the signal conductive contactor including a first plunger, a second plunger, and a spring member; and a conductive contactor holder configured to house the signal conductive contactor used for inputting and outputting the signal to and from the predetermined circuit structure, the conductive contactor holder having a coaxial structure with the signal conductive contactor, and including a holder substrate including an opening configured to allow the signal conductive contactor to be inserted therethrough, a holding member housed in the opening, and including a holding hole configured to hold one or more of the signal conductive contactors, and a stab configured to form a hollow space extending from the holding hole in a direction perpendicular to a central axis of the holding hole.

Abstract: An electronic component handling apparatus includes: a thermostatic chamber in which a socket disposed, the socket electrically being connectable to a device under test (DUT) including a first antenna; a moving device that moves the DUT and presses the DUT against the socket; an anechoic chamber disposed adjacent to the thermostatic chamber; a second antenna disposed inside the thermostatic chamber; and a first window that transmits radio waves radiated from the first or second antenna. The thermostatic chamber has a first opening on a wall surface of the thermostatic chamber. The anechoic chamber has a radio wave absorber and a second opening that opens toward a transmission direction of the radio waves from or to the second antenna. The thermostatic chamber and the anechoic chamber are connected to each other to make the first opening and the second opening face each other.

Abstract: A method includes detecting a first time, at which a specific partial discharge pulse is detected in an energy transmission cable at a first point at one cable end; detecting a second time, at which the pulse is detected in the cable at a second point at the other cable end; determining a fault location along the in accordance with the first and the second times; determining third and fourth points located in the cable, the third and fourth points delimiting a portion of the cable, including the fault location and none of the other points; detecting a third time, at which a further specific partial discharge pulse is detected in the cable at the third point; detecting a fourth time, at which the further pulse is detected in the cable at the fourth point; correcting the determined fault location in accordance with the third and fourth times.

Abstract: An on-die early lifetime failure detection system with a reliability mechanism isolation circuit provides an early lifetime failure detection. The system measures and monitors reliability at time-0 (t0) and end-of-life. The measurements enable detection of latent reliability or marginality issues during the lifetime of the product. The system includes: a stress controller to adjust voltage for a power supply and voltage for a ground supply in accordance with one or more sensors; and an aging detector circuitry coupled to the stress controller, wherein the aging detector circuitry comprises a ring oscillator having delay stages, wherein each delay stage comprises an aging monitor circuitry, wherein the stress controller to adjust voltage for a power supply and voltage for a ground supply of the delay stage.

Abstract: Disclosed is a magnetic photoacoustic composite non destructive testing device for a power transmission line of a photovoltaic grid based on a corona effect. The device may include a mechanical structure part and a data processing part. The mechanical structure part may include a shielding shell and mounting bases, shielding bodies are mounted on two sides of the shielding shell, a top of the shielding shell is provided with an upper cover, two sides under the upper cover are provided with the mounting base respectively, and the two mounting bases are located above the shielding bodies respectively. The data processing part may include a pair of optical sensing modules, a pair of magnetic sensing modules, an acoustic sensing module, a humidity sensing module, a micro-processor, a signal conditioning and transmission unit and an internal power supply management module.

Abstract: A modulated magnetoresistive sensor consists of a substrate located on a substrate in an XY plane, magnetoresistive sensing elements, a modulator, electrical connectors, an electrical insulating layer, and bonding pads. The sensing direction of the magnetoresistive sensing elements is parallel to the X axis. The magnetoresistive sensing elements are connected in series into a magnetoresistive sensing element string. The modulator is comprised of multiple elongated modulating assemblies. The elongated modulating assemblies consist of three layers—FM1 layer, NM layer, and FM2 layer. The ends of the elongated modulating assemblies are electrically connected to form a serpentine current path. The electrical insulating layer is set between the elongated modulating assemblies and the magnetoresistive sensing elements to separate the elongated modulating assemblies from the magnetoresistive sensing elements.

Abstract: A solar power generation fault diagnosis device includes one or more processors configured to perform the following: receiving signals indicating an electrical quantity output from a solar cell to acquire quantity information indicating the electrical quantity output from the solar cell; calculating a first quantity value relating to the electrical quantity based on the quantity information; implementing a low-pass filter unit so as to output a second quantity value from the first quantity value; determining a state of the solar cell based on a result of comparison between the first quantity value and the second quantity value; and outputting the determined state of the solar cell.

Abstract: A capacitive voltage sensor for estimating voltage on a power line. The sensor includes a dielectric bushing surrounding the line, and an annular conductor formed in the bushing and being capacitively coupled to the line, where a first capacitance is defined between the line and the annular conductor and a second capacitance is defined between the annular conductor and ground. The sensor also includes a capacitance compensation circuit having an amplifier including a first terminal electrical coupled to the annular conductor, and first and second capacitance compensation capacitors electrically coupled to the terminals of the amplifier, where the compensation capacitors are made of different materials having different dielectric constants, and where the materials of the compensation capacitors are selected so as to compensate for changes in the first and second capacitances in response to temperature changes. Also, a thermistor is provided in a resistor compensation circuit to provide resistance compensation.

Abstract: The present invention discloses an AC impedance measurement circuit with a calibration function, which is characterized in that only one calibration impedance is needed, associated with a switch circuit. Based on the measurement results of the two calibration modes, an equivalent impedance of the switch circuit, circuit gain and phase offset can be calculated. Based on the above results, the equivalent impedance of the internal circuit is deducted from the measurement result of the measurement mode to accurately calculate an AC conductance and a phase of the AC conductance for impedance to be measured. In addition, by adjusting a phase difference between an input sine wave signal and a sampling clock signal, impedance of the same phase and impedance of the quadrature phase can be obtained, respectively, and the AC impedance and phase angle of the impedance to be measured can be calculated.

Abstract: Disclosed is a plurality of through-silicon vias (TSVs) and related systems, methods, and devices. An electronic device includes a stack of chips, a first TSV, and a second TSV. The stack of chips includes one or more side edges at a perimeter of the stack of chips. A TSV zone of the stack of chips is within a predetermined distance from the one or more side edges. The first TSV is within the TSV zone of the stack of chips at a first distance from the one or more side edges. The second TSV is within the TSV zone of the stack of chips at a second distance from the one or more side edges. The second distance is shorter than the first distance.

Abstract: A test device according to an embodiment of the present invention includes: a first measurement terminal connected to one end of a first coil to be tested; a second measurement terminal connected to another end of the first coil; a direct-current power source connected to the first measurement terminal; a first semiconductor switch connected between the second measurement terminal and a ground; and a drive unit for turning on and off the first semiconductor switch.

Abstract: An electrical current measurement circuit is provided. The electrical current measurement circuit is configured to receive a sense current proportionally related to an electrical current of interest to continuously charge a capacitor to a sense voltage. The electrical current measurement circuit is configured to determine whether the sense voltage reaches a predefined voltage threshold and reduce the sense voltage to below the predefined voltage threshold in response to the sense voltage reaching the predefined voltage threshold. The electrical current measurement circuit counts each occurrence of the sense voltage reaching the predefined voltage threshold and quantifies the electrical current based on a total count of the sense voltage reaching the predefined voltage threshold during the predefined measurement period.

Abstract: A detection substrate 150 has a body film 1a having a through hole 91; a winding wire part 10 provided on a surface of one side of the body film 1a, on a surface of another side of the body film 1a and in the through hole 91, and disposed so as to surround a current to be detected; and a winding return wire part 50, provided on the body film 1a, connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side.

Abstract: Provided is a wafer prober. The wafer probing stage of the wafer prober includes: a lower plate; a plurality of lifting pillars mounted on an upper surface of the lower plate; and an upper plate mounted on upper ends of the plurality of lifting pillars, wherein the plurality of lifting pillars are located between the upper plate and the lower plate and ends of the lifting pillars are configured to lift up and down in a vertical direction, and wherein a height and a slope of the upper plate are adjusted according to heights of the lifting pillars. The wafer probing stage can adjust a height of the chuck arranged on the upper plate and a slope or flatness of the chuck by adjusting a height of each lifting pillar according to a weight applied to each lifting pillar.

Abstract: Provided is a method for inspecting a piezoelectric element in which voltage is applied to a piezoelectric element and evaluation of the electrical characteristics of the piezoelectric element is performed. The method includes a first step in which the piezoelectric element is held on a flat plate-shaped slightly adhesive sheet and a second step in which voltage is applied to the piezoelectric element held on the slightly adhesive sheet and evaluation of the electrical characteristics of the piezoelectric element is performed.

Abstract: Provided are a method, an apparatus and a device for detecting abnormity of an energy metering chip. The method includes: inputting a target self-test signal to a to-be-tested component of a target energy metering chip in response to the target energy metering chip beginning to run under driving of a power signal; acquiring a first output signal from an output terminal of the to-be-tested component, and inputting the first output signal to a notch filter; inputting a second output signal from an output terminal of the notch filter to a signal correlator, and acquiring a third output signal from an output terminal of the signal correlator; and detecting a running state of the to-be-tested component based on the third output signal, to determine whether the target energy metering chip is abnormal.

Abstract: A device to measure the voltage at a test point, also referred to as a test point voltage sensor, comprises a housing formed from a first material and a second material, wherein the first material comprises an insulating material and the second material comprises a conductive or semiconductive material. The housing includes an opening configured to cover a test point of a cable accessory. The device further includes a pressure pad, disposed in the housing, having a conductive mating surface configured to contact a test point of the basic insulation plug or end plug. The device further includes a low side capacitor embedded in the housing and electrically coupled to the conductive mating surface. The device further includes a signal wire electrically coupled to the low side capacitor.

Abstract: A method for testing a device under test at a specific channel condition is provided. The method comprises the steps of initiating a communication with the device under test and receiving a transmission frame from the device under test with a header portion comprising a specific transmission rate information. It also comprises analyzing the header portion of the transmission frame in order to determine whether the device under test is transmitting with the specific transmission rate information.

Abstract: A load estimating device measures a voltage and a current supplied to a plurality of loads connected with a power supply, and obtains feature amounts of the plurality of loads from measurement values of the voltage and the current. A storage device stores a feature amount of each combination of two or more loads in advance. The load estimating device estimates what the plurality of loads connected with the power supply device are, on the basis of the obtained feature amounts and the feature amounts stored in the storage device. The feature amount includes a combination of an apparent power and a power factor.

Abstract: A method for vehicle electrical system diagnosis by means of a regulator, which is configured to regulate the voltage supplied by a generator via a converter for a vehicle electrical system of a vehicle by outputting an output signal, wherein the method comprises the following steps: detecting an output signal by way of a control device, ascertaining an instantaneous power output at the vehicle electrical system on the basis of the detected output signal, and analyzing the ascertained power output for diagnosis of the vehicle electrical system and at least one electrical consumer which is connected to the vehicle electrical system.