Abstract: An electronic component handling apparatus, for handling a DUT having a temperature detection circuit and pressing the DUT against a socket electrically connected to a tester testing the DUT, includes: a temperature adjuster adjusting a temperature of the DUT; a first calculator calculating the temperature of the DUT based on a detection result of the temperature detection circuit; a temperature controller controlling the temperature adjuster; and a first receiver receiving a first signal output from the tester, a temperature control including a first temperature control based on the temperature of the DUT calculated by the first calculator and a second temperature control, and the temperature controller switching the temperature control of the DUT from the first temperature control to the second temperature control when the first receiver receives the first signal after the temperature controller starts the first temperature control.

Abstract: A semiconductor device includes a temperature sensor, a scan control circuit which generates scan chain selection information in accordance with a measurement result of the temperature sensor, a clock control circuit which generates one or more scan chain clock signals based on an external clock signal and the scan chain selection information, a pattern generation circuit which generates a test pattern, and a logic circuit which includes a plurality of scan chains and which receives the scan chain clock signals and the test pattern. The clock control circuit generates the scan chain clock signal in association with each scan chain. During a burn-in test, the logic circuit captures the test pattern into the scan chain associated with the scan chain clock signal.

Abstract: A Rogowski coil is used for determining the magnitude of the electrical current of a conductor of a low-voltage AC circuit, which outputs an analogue voltage which is equivalent to the magnitude of the electrical current of the conductor. The Rogowski coil is connected to an analogue integrator, which is followed by an analogue-digital converter, which converts the integrated analogue voltage into a digital signal which is further processed by a microprocessor in such a way that the phase shift generated by the Rogowski coil and the components connected downstream of the Rogowski coil is compensated such that there are in-phase current values for the detection of error situations in order to protect the low-voltage AC circuit, in particular for a low-voltage power switch or an arc fault detection unit.

Abstract: Heat spreaders for use in semiconductor device testing, such as burn-in testing, are disclosed herein. In one embodiment, a heat spreader is configured to be coupled to a burn-in testing board including a plurality of sockets. The heat spreader includes (i) a frame having a plurality of apertures, and (ii) a plurality of heat sinks movably positioned within corresponding ones of the apertures. When the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to extend into corresponding ones of the sockets to thermally contact semiconductor devices positioned within the sockets. The heat spreader can promote a uniform temperature gradient across the burn-in board during testing of the semiconductor devices.

Abstract: A sensor system in a package, comprising: a package, the package including: a sensor chip comprising sensor array comprising a plurality of sensing elements, wherein each of the plurality of sensing elements are functionalized with a deposited mixture consisting of hybrid nanostructures and a molecular formulation specifically targeting at least one of a plurality of gases, and wherein each of the plurality of sensing elements comprises a resistance and a capacitance, and wherein at least one resistance and capacitance are altered when the interacting with gaseous chemical compounds; and a mixed signal System on a Chip (SoC), comprising an analog signal conditioning and Analog-to-Digital conversion circuit configured to convert the analog signal into a digital signal, and a low-power processor circuit configured to processes the digital signal using a pattern recognition system implementing gas detection and measurement algorithms.

Abstract: A pressing assembly and a chip testing apparatus including a plurality of the pressing assemblies are provided. The pressing assembly is fixedly disposed in a lid that is configured to cover a side of a chip tray kit, and the chip tray kit is configured to carry a plurality of chips. When the lid covers the side of the chip tray kit, a pressing member of each of the pressing assemblies presses a surface of each of the chips, and each of a plurality of elastic members connected to the pressing member is in a pressed state. When the lid covers the side of the chip tray kit, the lid and the chip tray kit define an enclosed space, and an air suction device of the chip testing apparatus can suction away air in the enclosed space, so that the enclosed space is in a negative pressure state.

Abstract: A method for detecting a deterioration state in an elevator suspension member including electrically conductive cords uses a multiplexing unit (MU) to apply first and second alternating voltages to proximal ends of first and second groups of the cords respectively and connect the proximal end of a third group of the cords to a voltage measurement arrangement connected to a reference potential. Distal ends of the groups are connected together. A first neutral point voltage between the third proximal end and the reference potential is determined. The MU is switched to apply the first alternating voltage to the second proximal end, apply the second alternating voltage to the third proximal end and determine a second neutral point voltage between the first proximal end and the reference potential. The deterioration state of the suspension member arrangement is determined based on the first and second neutral point voltages.

Abstract: A system comprising: a magnetic transmitter configured to generate magnetic fields; a magnetic sensor configured to generate signals based on characteristics of the magnetic fields received at the magnetic sensor; and one or more computer systems configured to: receive the signals from the magnetic sensor; determine, based on the signals received from the magnetic sensor, an electromagnetic (EM) pose of the magnetic sensor relative to the magnetic transmitter; determine one or both of: i) an inertial pose of the magnetic sensor relative to the magnetic transmitter based on inertial data associated with the magnetic transmitter and the magnetic sensor, or ii) an optical pose of the magnetic sensor relative to the magnetic transmitter based on optical data associated with the magnetic transmitter and the magnetic sensor; determine an estimated pose of the magnetic sensor relative to the magnetic transmitter based on the EM pose and the one or both of the inertial pose or the optical pose; determine distorted ma

Abstract: A method for detecting the position of the mass center of a passing-through beam of electric charges in a duct, having a passage section with a plurality of detection faces directed thereto is presented. The method includes: arranging couples of detecting elements, so that each couple detects a space area divided into two half-areas by an intermediate plane between the detecting elements of the respective couple; obtaining, from each detecting element, a signal thereby produced representing the distance thereof from the mass center to be detected; comparing the signals produced by each detecting element, by obtaining a digital signal showing the greater proximity of the mass center to one of the detecting element of the couple; and composing the digital signals produced by the couples of detecting elements, by identifying the cross-section of the beam of electric charges to which the mass center of the beam electric charges belongs.

Abstract: A contactor includes a temperature adjustment mechanism, a cover and a path. The temperature adjustment mechanism increases and decreases temperature of an electronic component via a contact portion. The cover externally covers the temperature adjustment mechanism and includes an aperture portion. The path is allowed to supply gas to inside of the cover. The cover is configured to change a distance from the aperture portion to the contact portion.

Abstract: A current sensor diagnosing apparatus for diagnosing an error of a plurality of current sensors connected to a secondary battery cell. The current sensor diagnosing apparatus may diagnose an error of a current sensor in the same way regardless of the type of a system using the current sensor, the type of a current source, a voltage characteristic, or the like by diagnosing an error of current sensors using offset deviations and current values of two current sensors and may be particularly applied to various systems including a plurality of current sensors.

Abstract: A testing system includes: a substrate having a probe pad and having a supply input; driver circuitry having a driver output; a transistor having a gate, a source, and a drain; and a field effect transistor (FET) engager. The gate of the transistor is coupled to the driver output, and the drain of the transistor is coupled to the supply input. The FET engager is configured to couple the probe pad to the gate of the transistor and provide test instrument measurement of gate current of the transistor without test instrument probe capacitance impacting operation of the transistor.

Abstract: An integrated device provides a measure of a quantity dependent on current through an electrical conductor, having: a sensing and processing sub-system; an electrical conductor conducting current; an insulating material encapsulates the sensing and processing sub-system and maintains the electrical conductor in a fixed and spaced relationship to the sensing and processing sub-system. The insulating material insulates the electrical conductor from the sensing and processing sub-system. Sensing and processing sub-system sensing circuitry includes magnetic field sensing elements adjacent the electrical conductor. The sensing circuitry provides a measure of the quantity as a weighted sum and/or difference of magnetic field sensing elements outputs caused by current through the electrical conductor adjacent the magnetic field sensing elements. A voltage sensing input senses a measure of voltage associated with the current conductor.

Abstract: A method for testing a device under test, the device under test being a measuring instrument to measure a physical parameter of a fluid, includes: performing a plurality of valid test runs, wherein a valid test run includes: exposing the device under test and a reference measuring instrument to the fluid under a set of influences, the set of influences being defined by influence parameters; monitoring the influence parameters; obtaining a reference value for the physical parameter from the reference measuring instrument; and obtaining a test value for the physical parameter from the device under test, wherein a test run is invalidated if influence parameters do not meet specified test requirements for the influence parameters; and then evaluating a plurality of test values originating from the plurality of valid test runs with respect to at least one of accuracy, repeatability and reproducibility.

Abstract: Provided is a current sensing device including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided with respect to the current sensing element via an interlayer insulating layer; a plurality of current vias configured to connect the current sensing element and the current wire so as to penetrate through the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.

Abstract: A sensor relating to the present invention includes: a first electrode; a second electrode; a first attracting portion positioned between the first electrode and the second electrode and configured to receive conductive abrasion powder contained in a detection region and attracted onto the first attracting portion; a sensing unit for sensing a change in electrical resistance between the first electrode and the second electrode caused by the conductive abrasion powder; and at least one second attracting portion positioned within the detection region and configured to attract the conductive abrasion powder contained in the detection region.

Abstract: According to various examples, a method for non-destructive detection of defects in a semiconductor die is described. The method may include positioning an emitter above the semiconductor die. The method may include generating an emitted wave using the emitter that is directed to a focal point on a surface of the die. The method may include generating a reflected wave from the focal point. The focal point may act as a point source reflecting the emitted wave. The method may include positioning a receiver above the die to receive the reflected wave. The method may also include measuring the reflected wave to detect modulations in amplitude in the reflected wave.

Abstract: A fast-response direct-current current transformer based on multi-sensor fusion is provided and includes: a magnetic modulator, a current correction module, an excitation transformer, an alternating current detection and filtering circuit, a phase-sensitive demodulation and filtering system, a PI controller, and a power amplifier. The current correction module measures a primary current and obtain a feed-forward signal, outputs a false balance state configured to control a magnetic core to quickly exit or avoid entering magnetic saturation after amplifying the feed-forward signal and a PI control signal, and keeps output of the magnetic modulator stable. The magnetic modulator and Hall current sensors are fused in the disclosure, such that the possibility of failure due to a false balance problem caused by saturation of a magnetic core is reduced. After the false balance is generated, the magnetic core may be controlled to quickly exit a magnetic saturation state through a feed-forward output current.

Abstract: A system for analyzing a state of a thermoset material is disclosed. In various embodiments, the system includes a source of electromagnetic energy configured to expose a sample of the thermoset material to an electric field; a detector configured to determine at least one of a dielectric permittivity or a complex admittance of the sample over a range of frequencies in response to a frequency sweep over the electric field; and an analyzer configured to assess the state of the thermoset material by comparing the at least one of the dielectric permittivity or the complex admittance of the sample against an acceptability map. In various embodiments, the acceptability map comprises a series of acceptability bands that represent a decrease in effective relaxation time from a baseline fresh batch of the thermoset material.

Abstract: A force-sense system for providing signals to, or receiving signals from, a device under test (DUT) at a first DUT node. The system can include an interface coupling first and second portions of a first force-sense measurement device, such as a parametric measurement unit. The first and second portions of the first force-sense measurement device can be provided using respective different integrated circuits, such as can comprise different semiconductor dies of different die types. In a first test mode, the interface can be configured to communicate a first DUT force signal from the first portion to the second portion of the first force-sense measurement device, and in a second test mode the interface can be configured to communicate DUT sense information, received from the DUT at the first DUT node, from the second portion to the first portion of the first force-sense measurement device.