Abstract: Prober for a test system for testing a device under test is disclosed. In one example, the prober comprises a busbar mechanism for transporting electric signals to and away from the device under test.

Abstract: Various examples of a high frequency, inductor and transformer core loss characterization and measurement method and system for arbitrary waveforms are disclosed herein. A system and method for determining core loss of a magnetic core can include generating a waveform to excite a first test circuit which comprises an excitation circuit, a circuit under test (CUT) comprising the magnetic core, and an inductance circuit having an inductor connected in parallel to the CUT. The method includes measuring a first current, when the first test circuit is excited. The method includes disconnecting the CUT from the first test circuit to form a second test circuit. The method includes generating the waveform to excite the second test circuit, and measuring a second current, when the second test circuit is excited. The power loss for the magnetic core is calculated based on an input voltage and the first and second measured current.

Abstract: The present application discloses a method for characterizing a resistance state of a programmable element of an integrated circuit. The method includes the steps of setting a first programming voltage of a first polarity to program the programmable element of the integrated circuit, setting a first read voltage of the first polarity to the integrated circuit at a first temperature to obtain a first read current, and a first resistance is derived from the first read current, setting the first read voltage of the first polarity to the integrated circuit at a second temperature to obtain a second read current, the second temperature is at least 50° C. higher than the first temperature, and a second resistance is derived from the second read current, and comparing the first resistance and the second resistance to characterize the resistance state of the programmable element.

Abstract: A testing device includes a measuring unit, a testing board supporting the measuring unit and connected to the measuring unit, and a connecting interface coupled to the testing board. The connecting interface includes connecting terminals protruding in a direction away from the testing board, and is connected to a device under test (DUT) via the connecting terminals. When the DUT is connected to the connecting interface, the measuring unit supplies a constant electric current via the testing board and the connecting interface to the DUT for a preset duration to result in a voltage, measures the voltage, and determines, based on a result of measurement of the voltage, an electrical connection status of the DUT.

Abstract: Apparatus, systems, articles of manufacture, and methods to provide an adaptive connection of a resistive element and a temperature-dependent resistive element are disclosed. An example apparatus includes a temperature-dependent resistive element. The example apparatus further includes a resistive element. The example apparatus further includes a switch coupled to the temperature-dependent resistive element and the resistive element. The example apparatus further includes a current sensor to measure a current through the temperature-dependent resistive element. The example apparatus further includes a processor to control the switch to, based on the measured current, (A) couple the temperature-dependent resistive element in parallel to the resistive element or (B) couple the temperature-dependent resistive element in series with the resistive element.

Abstract: An integrated circuit, a crack status detector and a crack status detection method are provided. The crack status detector includes a detection ring, multiple switches, and a current measuring circuit. The detection ring is formed by multiple conductive wire segments coupled in series. The detection ring is disposed adjacent to a side of at least one guard ring in the integrated circuit. The detection ring has a first endpoint and a second endpoint to respectively receive a first reference voltage and a second reference voltage. Each of the switches is disposed between two adjacent conductive wire segments. The switches are respectively turned on or cut off according to multiple control signals. The current measuring circuit transmits the control signals and measures a current on the detection ring according to a turned-on or cut-off status of each of the switches, so as to detect a crack status of the integrated circuit.

Abstract: A sensor probe. The probe includes a central loop and a plurality of peripheral loops disposed peripherally relative to the central loop. To maximize far-field suppression, current flows in a first direction through the central loop and in a second direction through each one of the plurality of peripheral loops, the first direction opposite to the second direction, and current through the central loop equals current through the plurality of peripheral loops.

Abstract: An electronic component presser is included in an electronic component testing apparatus used to test a device under test (DUT). The electronic component testing apparatus includes an electronic component handler, an electronic component tester, and a first socket. The electronic component presser connects to the electronic component handler and to the electronic component tester. The electronic component presser includes: a holding plate that holds the DUT that has been carried to the holding plate by a contact arm of the electronic component handler; a transport unit that moves the DUT between the holding plate and the first socket; a pusher that presses the DUT that has been disposed on the first socket; and an antenna unit comprising a measurement antenna that faces a device antenna of the DUT disposed on the first socket.

Abstract: The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.

Abstract: Systems and methods for locating and/or mapping buried utilities are disclosed. In one embodiment, one or more magnetic field sensing locating devices include antenna node(s) to sense magnetic field signals emitted from a buried utility and a processing unit to receive the sensed magnetic field signals may be mounted on a vehicle. The received magnetic field signals may be processed in conjunction with sensed vehicle velocity data to determine information associated with location of the buried utility such as depth and position.

Abstract: A system and a method for correcting a current value of a shunt resistor, which calculate a change amount of a resistance value by using a variable temperature value of a shunt resistor and calculate a real-time current value flowing in the corresponding shunt resistor based on the calculated change amount of the resistance value and voltage values of both terminals of the shunt resistor, so that even though the temperature value of the shunt resistor is continuously changed, an accurate current value may be obtained by reflecting all the changes.

Abstract: The present invention discloses an automatic laser calibration kit for calibrating the distance between a test device of a wireless charging system and a device under test (DUT). The calibration kit may be located in a wireless charging test system. The test system may comprise a test plane for controlling the DUT and a gripping arm for controlling the test device. The calibration kit may comprise: a laser pointer, configured to emit a laser beam; a mirror, positioned on the gripping arm and configured to reflect the laser beam to form a spot on the test plane; and a camera, configured to monitor the position of the spot.

Abstract: The present invention relates to a method and a system to measure the specific surface area of a conductive material through electrochemical impedance spectroscopy.

Abstract: A conductive contactor unit includes: a signal conductive contactor configured to input or output a signal to or from a predetermined circuit structure, the signal conductive contactor including a first plunger, a second plunger, and a spring member; and a conductive contactor holder configured to house the signal conductive contactor used for inputting and outputting the signal to and from the predetermined circuit structure, the conductive contactor holder having a coaxial structure with the signal conductive contactor, and including a holder substrate including an opening configured to allow the signal conductive contactor to be inserted therethrough, a holding member housed in the opening, and including a holding hole configured to hold one or more of the signal conductive contactors, and a stab configured to form a hollow space extending from the holding hole in a direction perpendicular to a central axis of the holding hole.

Abstract: An electronic component handling apparatus includes: a thermostatic chamber in which a socket disposed, the socket electrically being connectable to a device under test (DUT) including a first antenna; a moving device that moves the DUT and presses the DUT against the socket; an anechoic chamber disposed adjacent to the thermostatic chamber; a second antenna disposed inside the thermostatic chamber; and a first window that transmits radio waves radiated from the first or second antenna. The thermostatic chamber has a first opening on a wall surface of the thermostatic chamber. The anechoic chamber has a radio wave absorber and a second opening that opens toward a transmission direction of the radio waves from or to the second antenna. The thermostatic chamber and the anechoic chamber are connected to each other to make the first opening and the second opening face each other.

Abstract: A method includes detecting a first time, at which a specific partial discharge pulse is detected in an energy transmission cable at a first point at one cable end; detecting a second time, at which the pulse is detected in the cable at a second point at the other cable end; determining a fault location along the in accordance with the first and the second times; determining third and fourth points located in the cable, the third and fourth points delimiting a portion of the cable, including the fault location and none of the other points; detecting a third time, at which a further specific partial discharge pulse is detected in the cable at the third point; detecting a fourth time, at which the further pulse is detected in the cable at the fourth point; correcting the determined fault location in accordance with the third and fourth times.

Abstract: An on-die early lifetime failure detection system with a reliability mechanism isolation circuit provides an early lifetime failure detection. The system measures and monitors reliability at time-0 (t0) and end-of-life. The measurements enable detection of latent reliability or marginality issues during the lifetime of the product. The system includes: a stress controller to adjust voltage for a power supply and voltage for a ground supply in accordance with one or more sensors; and an aging detector circuitry coupled to the stress controller, wherein the aging detector circuitry comprises a ring oscillator having delay stages, wherein each delay stage comprises an aging monitor circuitry, wherein the stress controller to adjust voltage for a power supply and voltage for a ground supply of the delay stage.

Abstract: Disclosed is a magnetic photoacoustic composite non destructive testing device for a power transmission line of a photovoltaic grid based on a corona effect. The device may include a mechanical structure part and a data processing part. The mechanical structure part may include a shielding shell and mounting bases, shielding bodies are mounted on two sides of the shielding shell, a top of the shielding shell is provided with an upper cover, two sides under the upper cover are provided with the mounting base respectively, and the two mounting bases are located above the shielding bodies respectively. The data processing part may include a pair of optical sensing modules, a pair of magnetic sensing modules, an acoustic sensing module, a humidity sensing module, a micro-processor, a signal conditioning and transmission unit and an internal power supply management module.

Abstract: A modulated magnetoresistive sensor consists of a substrate located on a substrate in an XY plane, magnetoresistive sensing elements, a modulator, electrical connectors, an electrical insulating layer, and bonding pads. The sensing direction of the magnetoresistive sensing elements is parallel to the X axis. The magnetoresistive sensing elements are connected in series into a magnetoresistive sensing element string. The modulator is comprised of multiple elongated modulating assemblies. The elongated modulating assemblies consist of three layers—FM1 layer, NM layer, and FM2 layer. The ends of the elongated modulating assemblies are electrically connected to form a serpentine current path. The electrical insulating layer is set between the elongated modulating assemblies and the magnetoresistive sensing elements to separate the elongated modulating assemblies from the magnetoresistive sensing elements.

Abstract: A solar power generation fault diagnosis device includes one or more processors configured to perform the following: receiving signals indicating an electrical quantity output from a solar cell to acquire quantity information indicating the electrical quantity output from the solar cell; calculating a first quantity value relating to the electrical quantity based on the quantity information; implementing a low-pass filter unit so as to output a second quantity value from the first quantity value; determining a state of the solar cell based on a result of comparison between the first quantity value and the second quantity value; and outputting the determined state of the solar cell.