Abstract: The invention concerns an apparatus for inspecting a surface, in particular the surface of a mill roll, comprising a housing wherein are arranged means for transmitting and receiving a light beam, and an optical coupling device arranged on the outer surface of a front wall of the housing. The optical coupling device comprises: (a) a component (5), called fluid dispenser, (b) a hollow cylindrical nozzle (11), and (c) a mobile tubular component (16), successively traversed by the light beam. The mobile tubular component (18) is arranged partly inside the cylindrical nozzle (11), so as to be able to slide inside said cylindrical nozzle, and partly exits therefrom in the extension thereof, towards the surface to be inspected (2). Different cross-sections (shoulders 14, 19) are provided in the cylindrical nozzle (11) and in the mobile tubular component (16), in particular for limiting said sliding movement.

Abstract: A method and an apparatus for surface configuration measurement of the present invention use stereoscopic lattice type of moiré optics as testing optics. The moiré optics accurately shifts moiré fringes of particular fringe order by a preselected phase without any shift error. A line sensor camera, which is a specific form of a camera, limits a measurement range to the vicinity of the particular fringe order. The camera outputs at least three moiré image data shifted in phase. A phase shifting method can therefore be easily applied to the stereoscopic lattice type of moiré optics without giving any consideration to the accurate phase shift of the entire fringe orders. The apparatus can measure the surface configuration of a work with high accuracy.

Abstract: A confocal wafer inspection system including: (a) a table to carry a wafer for inspection, the table having two vertical degrees of freedom to enable XY axis movements; (b) a movement device for moving the table along the degrees of freedom; (c) a confocal height measurement system, perpendicular to the table, for measuring the range to a point on a surface of the wafer and for enabling to recognize changes in surface altitude while the wafer moves with the table; and (d) a computer operative for: (i) holding a bumps map of the wafer; (ii) controlling the movement device; (iii) moving the table so that the measuring point of the confocal height measurement system crosses each bump of the wafer; (iv) storing a height profile of each bump; (v) comparing the height profiles or checking each height profile according to predetermined criteria or both; and (vi) enabling a results output. The invention also relates to a method for confocal wafer inspection.

Abstract: Inspection system and method for high-throughput inspection, the system and method is capable to generate and sense transmitted and/or reflected short duration beams. According to one embodiment of the invention the transmitted and reflected short duration beams are generated and sensed simultaneously thus provide a reflected image and a transmitted image simultaneously. The reflected and transmitted short duration radiation beams are manipulated either in the frequency domain or are distinctly polarized such that they are directed to the appropriate area sensors. According to another aspect of the invention the system changes the manipulation of a short duration beam of radiation to selectively direct the short duration beam to distinct area sensors.

Abstract: A monitoring system for detection of defects in an optical fiber coating during production of the fiber has first and second beam generating means which produce planar coherent beams which cross each other at the fiber passing through the system creating one or more diffraction patterns. A first plurality of photodetectors are mounted in a mount, the front face of which is impinged by the planar diffraction pattern, and a second plurality of photodetectors is similarly mounted in position below the impinging pattern. A defect in the fiber coating, regardless of shape or orientation, will cause the pattern or patterns to be tilted or shifted upward, downward, or planarly tilted to impinge one or more of the photodiodes which, as a result, generates a signal which is applied to a comparator and control circuit.

Abstract: An apparatus for inspecting pattern defects on microscopic circuit patterns, with high resolution, comprises: an objective lens for detecting an image of a sample; a UV laser beam illumination arrangement for illuminating onto a pupil of the objective lens; am arrangement for lowering coherency of the UV laser illumination; a detector of integration type; and an arrangement for processing detected signal thereof.

Abstract: Disclosed is a process for the detection of marked components of a composite article. The present invention relates to detecting the presence, position, concentration and/or distribution of one or more components in a composite article, and to registration inspection of a composite article using infrared radiation. In one embodiment of the invention, infrared blockers, such as absorbing infrared blockers, are incorporated into the component of interest in the composite to increase the visibility of the marked component during inspection.

Abstract: A device for inspecting solder connections between a component and a substrate or between two components or substrates, wherein the component is disposed upon the surface of the substrate, the device including an image receiving unit. An image transmitting device, the image transmitting device including a first end and a second end, the first end coupled to the image receiving unit. A tip assembly removably coupled to the second end of the image transmitting device, the tip assembly further including a mirror and an image receiving aperture, the tip assembly configured to transmit an image of the solder connections received by the mirror, through the image transmitting device, to the image receiving unit, and an illumination device, the illumination device including a light source, at least one light transmitting device, and at least one light emitting aperture disposed adjacent the image receiving aperture, the light emitting aperture directed towards the solder connections to be inspected.

Abstract: Method and apparatus for inspecting articles, such as training pants, by use of multiple zones of irradiation sources whose intensity can be varied from one zone to another to adjust for different thicknesses of materials and the like to provide a clearer image of the various edges and seams.

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to an etch process. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract: A turn controllable inspection table which have a step between a portion where mount sections on which respective objects being inspected are mounted are formed along a circumference and an inside portion thereof, so that light from a light source illuminating a side face portion of each object being inspected is allowed to be incident on at least a side face region including a bottom portion of a side face of each object being inspected in a direction perpendicular to the side face region is provided. Further, clamps for fixing the respective objects being inspected onto the mount sections by pressing a head portion of each object being inspected with a top board made of a transparent member, so that inspection is possible across an entire region from all directions including directions from above and sideways of each object being inspected are provided.

Abstract: There are provided a measuring head moved along a guide rail, first position detection means for detecting the positions of the measuring head on the guide rail using a predetermined position on the guide rail as a reference position, second position detection means for detecting the position in a world coordinate system of the measuring head on the guide rail, and means for storing in a storage device each of the positions of the measuring head on the guide rail using the predetermined position on the guide rail as the reference position and a corresponding position in the world coordinate system with the positions correlated with each other.

Abstract: An emissivity probe for measuring reflected energy from interior wall surfaces of large scale boilers. The emissivity probe uses a pair of light guides which respectively receive light energy from the interior of the boiler and that reflected off a wall surface. Using appropriate photo detectors sensitive to a desired light wavelength range, a ratio of the reflected and incident radiation is provided. This provides a measure of the reflectivity of the wall surface. The reflectivity values are used to control boiler cleaning systems.

Abstract: A semiconductor wafer inspection apparatus is provided with a rotatable table on which a semiconductor wafer is held by suction, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Abstract: The inventive method and apparatus for detecting defects of a microscopic circuit pattern by imaging the pattern at high resolution comprises an objective lens for imaging the subject pattern, a laser illumination means for illuminating the pupil of the objective lens, means of diminishing the coherency of the laser illumination, an accumulative detector, and means of processing the signal detected by the detector. The method and apparatus are capable of imaging the subject pattern at high sensitivity and high speed based on the illumination by a short wavelength, which is indispensable for the enhancement of resolution, particularly based on a laser light source which is advantageous for practicing, with a resulting image being the same or better in quality as compared with an image resulting from the ordinary discharge tube illumination, whereby it is possible to detect microscopic defects at high sensitivity.

Abstract: Railroad beds require regrading in order to permit for an increased axial load. There are often cables or tubes embedded in the roadbed at the roadbed sides, making regrading difficult. In accordance with the present invention, material is moved by suction to form pits at each side of the track at intervals along the railroad bed, and a laser camera is used to obtain information relating to the profile adjacent to the pits and the positions of the embedded cables or tubes. This information is saved, and used to control a device for mechanically excavating material from the railroad bed sides without damaging the embedded cables or tubes and grading the railroad bed. A laser measuring device is provided for reading the railroad bed profile.

Abstract: An optical reflection sensor emits light and its reflection from a target object is received. A signal processor carries out a measurement on the received reflected light such as the distance to the target object each time the reflected light is received. Repeatability of measured values is calculated and displayed on a display device incorporated into the housing of the sensor. The display device may have two display areas such that the calculated repeatability and the measured value can be displayed simultaneously. The calculated repeatability may be compared with a specified threshold value, with the result of the comparison displayed. The housing may also incorporate an input device through which a required level of accuracy may be set.

Abstract: The present invention provides a method and system for controlling mineral scale deposition from a formation fluid. The rate at which scaling is occurring is measured in real time using an attenuated total reflectance probe and a photometer. The results are then used to determine whether to increase, decrease or leave unchanged addition of anti-scaling additives.

Abstract: A system and process for inspecting an underlying edge of a composite article, such as a disposable absorbent article. The article has first and second panels in at least partially opposed, overlapping engagement with each other. The process and system determine whether the panels of the article are present and/or properly positioned. Also disclosed is a process and system for detecting whether one or more components are present and/or properly positioned in the composite article by use of infrared radiation. Also disclosed is a process and system for defining a window in an image of the article, scanning the defined window to determine a position of the edge and redefining the window in the event that the edge is not located within the defined window during scanning of the defined window.

Abstract: A method and apparatus measure properties of two layers of a damascene structure (e.g. a silicon wafer during fabrication), and use the two measurements to identify a location as having voids. The two measurements may be used in any manner, e.g. compared to one another, and voids are deemed to be present when the two measurements diverge from each other. In response to the detection of voids, a process parameter used in fabrication of the damascene structure may be changed, to reduce or eliminate voids in to-be-formed structures.