Abstract: An optoelectronic arrangement for the detection of relative movements or relative positions of two objects, with the arrangement comprising at least four optoelectronic elements, characterized in that the optoelectronic elements are arranged in at least one first plane and in a second plane different from the first one in such a manner that at least three optoelectronic elements are arranged in the first plane and at least one optoelectronic element is arranged in the second plane. Further, a force and/or moment sensor provided with this arrangement with a first board and a second board, with the first board and the second board being elastically connected with each other and movable relative to one another. Finally, a personal computer keyboard which is provided with such a force and/or moment sensor.

Abstract: The nonlinear system includes a fixed visible input and tunable visible input that are directed to a location on a surface to be interrogated. The fixed visible input and the tunable visible inputs are aligned so that their surface locations of optical illumination overlap on the interrogated location. An output wavelength discriminator receives the reflected difference-frequency generated on the interrogated location. The output wavelength discriminator is substantially non-transmissive at frequencies higher than the difference-frequency, but substantially transmissive at the difference-frequency of the fixed visible input and the tunable visible input. The output of the output wavelength is a microwave output. Signal collection optics receives an output of the output wavelength discriminator and directs the propagation of the output thereof so that a collected microwave light signal is formed after propagation through the signal collection optics.

Abstract: A method of objectively evaluating a surface mark provides an objective test methodology for the optical quantification of surface marks. The method may include the steps of reproducibly producing a surface mark on an object and optically evaluating the surface mark. The surface mark may be reproducibly produced by loading a stylus, contacting a surface on the object with the loaded stylus and moving the object and the surface thereon relative to the loaded stylus so as to thereby produce a mark on the surface. Any surface mark is optically evaluated by optically producing images of the surface mark, electronically capturing the optically produced images and measuring selected parameters of the captured optically produced images.

Abstract: A lighting inspection apparatus is provided which uses a small backlight comprised of a dimmer plate and a xenon lamp or a fluorescent lamp that miniaturizes the inspection apparatus for a display panel. An inspection method is described for a display panel, which uses a dimmer plate autonomously adjusting light. The apparatus for inspecting a display panel includes: a support structure disposing thereon a display panel to be inspected; a light source; and a dimmer plate with a characteristic modulating a light transmission characteristic in accordance with an intensity of light incident thereonto, the dimmer plate being disposed between the support structure and the light source, wherein light emitted from the light source is made to transmit through the dimmer plate, then made incident onto the display panel disposed on the support structure.

Abstract: An infectious disease or disorder in a fluid, such as a mammalian blood sample, is detected by taking a transmission spectrum of a test sample in at least a portion of the ultraviolet visible near-infrared and comparing the spectrum with a standard sample spectrum. From the comparison it is then determined whether the fluid from the test sample contains an infectious disease or disorder, and an identity of the infectious disease or disorder is determined. Spectroscopic and multiwavelength turbidimetry techniques provide a rapid, inexpensive, and convenient means for diagnosis. The comparison and determination steps may be performed visually or by spectral deconvolution.

Abstract: A device for inspecting solder connections between a component and a substrate or between two components or substrates, wherein the component is disposed upon the surface of the substrate, the device including an image receiving unit. An image transmitting device, the image transmitting device including a first end and a second end, the first end coupled to the image receiving unit. A tip assembly removably coupled to the second end of the image transmitting device, the tip assembly further including a mirror and an image receiving aperture, the tip assembly configured to transmit an image of the solder connections received by the mirror, through the image transmitting device, to the image receiving unit, and an illumination device, the illumination device including a light source, at least one light transmitting device, and at least one light emitting aperture disposed adjacent the image receiving aperture, the light emitting aperture directed towards the solder connections to be inspected.

Abstract: A method and apparatus for rapid measurements of far-field radiation profiles having a large dynamic range from an optical source is disclosed. Some embodiments of the apparatus include a collector coupled to a rotating hub so that the rotation of an entrance to the collector defines a plane, a detector coupled to receive light captured at the entrance to the collector, and detector electronics having a programmable gain coupled to receive a signal from the detector, Some embodiments may include a rotatable entrance mirror for reflecting light from the optical source into the plane of the entrance of the collector. In some embodiments, the optical source is fixed relative to the plane of the entrance of the collector. In some embodiments, the optical source is rotatable in the plane defined by the entrance of the collector. In some embodiments, the source can be an optical fiber. In some embodiments, the source can be a material irradiated by a laser.

Abstract: First and second laser inputs are directed to a location on a semiconductor wafer to be interrogated. A first signal analyzer receives a first light signal at a first second-harmonic wavelength generated by the first laser input and converts the signal to a first electronic signal, thus monitoring the intensity of the first second-harmonic wavelength as a function of contamination. A second surface optical signal analyzer provides a similar function at a second second-harmonic wavelength generated by the second laser input and provides a second electronic signal. A third surface optical signal analyzer receives a third light signal at a sum-frequency wavelength generated by the first laser input and the second laser input on the semiconductor wafer to be interrogated and converts the light signal to a third electronic signal. An electronic signal analyzer compares the first, second and third electronic signals for determining the level of semiconductor wafer contamination.

Abstract: Two laser inputs having pulse durations of about 50-100 femtoseconds are directed to an area of a surface to be interrogated. The lasers are aligned so that their surface areas of optical illumination overlap on the interrogated surface. An optical delay line temporarily synchronizes the two inputs. An output wavelength discriminator receives reflections of the inputs from the interrogated surface and is substantially non-transmissive at the frequencies of the first laser input and the second laser input, but is substantially transmissive at the sum-frequency of the first input and the second input. Imaging optics direct the propagation of the output so that a real image is formed. A position sensitive detector monitors the intensity of the real image at the sum-frequency and an electronic signal equivalent to the real image is provided.

Abstract: A non-contact gauging system and method profiles a workpiece to accurately determine cylindrical surface profiles. The system includes a sensor head for performing reflected light measurements. The sensor head couples to a sensor arm that is movable in longitudinal, lateral, and transverse directions. A computer controls operation of the sensor head and arm to perform various proximity measurements of the workpiece. Proximity measurements are made along at least three parallel, lateral tracks that extend along a longitudinal length of the workpiece surface. The sensor head takes proximity measurements as it is moved continuously along each lateral track. The computer determines the diameters of the workpiece along the longitudinal length based on the proximity measurements and generates a profile.

Abstract: The optical system of the present invention includes a lens system assembly, a spectral filter material and a pixel array configured such that small, distant, light sources can be reliably detected. The optical system of the present invention provides accurate measurement of the brightness of the detected light sources and identification of the peak wavelength and dominant wavelength of the detected light sources. Use of the optical system of the present invention provides the ability to distinguish headlights of oncoming vehicles and taillights of leading vehicles from one another, as well as, from other light sources.

Abstract: In a method for detecting impurities in a transparent material, the material (2) is scanned line by line and the light transmission through the material is measured and compared with a reference value. If the transmission value at one point of the material is in a predetermined relation to said reference value, indicating the occurrence of impurities, the light transmission is studied in an area around the measured point for this transmission value in order to determine the extent and shape of the impurity, the light transmission values in the central area of the impurity being compared with transmission values measured in surrounding parts of the impurity to determine whether the impurity is of gel type or an impurity of some other type.

Abstract: A system for inspecting a component, such as a die formed on a silicon wafer, is provided. The system includes a two dimensional inspection system that can locate one or more features, such as bump contacts on the die, and which can also generate feature coordinate data. The system also includes a three dimensional inspection system that is connected to the two dimensional inspection system, such as through an operating system of a processor. The three dimensional inspection system receives the feature coordinate data and generates inspection control data.

Abstract: A film-thickness measurement apparatus of the present invention includes a lifter, a support mount, a light-emitting device, and a light-receiving device. With the center of a wafer staying in alignment with that of the support mount, the lifter places the wafer onto the surface of the support mount to determine the center of the wafer. While the wafer is being rotated about the center of the wafer, the light-emitting device irradiates the circumferential portion of the wafer with a laser beam, thereby allowing the position of a notch to be detected depending on whether or not the laser beam passes through the notch. This makes it possible to detect the positions of the notch and the center of the wafer to determine the center axis line of the surface of the wafer, thereby allowing the coordinates of a given position on the surface of the wafer to be defined in accordance with the center axis line and the center of the wafer.

Abstract: In a displacement sensor (10) comprising a sensor head (1) and a controller (2) either integrally or separately, the sensor head comprises a measurement light emitting optical system (113), an image acquiring optical system (127a, 127b) and a two dimensional imaging device (122). The controller can control the imaging condition associated with the brightness of the image in the form of a video signal both under a measurement mode and an observation mode. Under the measurement mode, with a light source (112) for measurement turned on, the imaging condition is adjusted in such a manner that a measurement light radiated light image (83) can be imaged at an appropriate brightness but a surrounding part (71) of the measurement object is substantially darker than the appropriate brightness, and a desired displacement is computed according the video signal obtained by the two dimensional imaging device (122).

Abstract: An optical inspection system and method which uses a procedure for determining an offset between a field of view and a center or rotation of an R-theta stage, or polar coordinate stage. Determining this offset allows the precise location of a site being inspected on a wafer to be determined. The system and method take advantage of the fact that in a R-theta system there can be only two positions for the R-theta stage that will position a particular site under the lens of the imaging system of the optical inspection system. By moving the stage from a first position where a particular site is positioned in the field of view, to the second position where the particular site is positioned in the field of view, the offset can be determined.

Abstract: Time-divisionally-multiplexed light receiving signals are sampled at a predetermined time interval as they are, and then converted into digital data. Then, address is determined based on an index signal as a standard of the time-divisional multiplexing, and the data are sequentially stored in a data memory. When the data are sequentially read out, change of quantity of the data is obtained to determine a period having the smallest change in quantity as an effective period. Then, the data included in the effective period are selected and separated to a sample side beam, reference side beam and cutoff period. Thus, the multiplexed light receiving signals are accurately separated by the digital data.

Abstract: An apparatus for flash photolysis has a light source and an optical fiber for directing light from the light source and through a sample. A laser or other such device is provided for initiating a chemical change within the sample. Additionally, a device is provided for determining the change in absorption of light by the sample during the chemical change.

Abstract: A method and apparatus for measuring and calibrating the measurement of small volumes of liquids. The small volumes of liquid are typically dispensed from liquid delivery devices, the delivery device often having multiple channels to analyze many samples at once. The liquid samples are delivered to one or more cells, typically in a multi-well plate, and positioned in a spectrophotometer for determining an absorbance of a chromophore in the liquid sample. Based upon an absorbance measurement and the concentration of the chromophore, a path length of the liquid sample is determined, from which a volume of the sample may be calculated. The method and apparatus provide various means for correcting for differences in the dimensions and/or other factors causing a non-linear deviation from the Beer-Lambert law. A system or kit may be provided including sets of sample solutions of varying dilution ranges for calibrating different liquid volumes.

Abstract: An inspection method and an inspection system of a terminal metal fitting which can securely judge the good or bad of the fastening condition of an electric wire by a crimping piece of the terminal metal fitting is provided. The inspection system 1 of the terminal metal fitting has an illuminating lamp 4, a CCD camera 5, a dark box 6, and a control unit 7. The CCD camera 5 is arranged at a position of the light thrown from the illuminating lamp 4 and reflected by crimping pieces 212a,212b of a pressure welding terminal 200 not entering the CCD camera 5. The dark box 6 covers the illuminating lamp 4, an object side 5a of the CCD camera 5, and the pressure welding terminal 200. The control unit 7 makes a binary processing on an image of a wire connecting portion 204 taken by the CCD camera 5.