Patents Examined by William Leader
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Patent number: 8623193Abstract: A substantially uniform layer of a metal is electroplated onto a work piece having a seed layer thereon. This is accomplished by employing a “high resistance ionic current source,” which solves the terminal problem by placing a highly resistive membrane (e.g., a microporous ceramic or fretted glass element) in close proximity to the wafer, thereby swamping the system's resistance. The membrane thereby approximates a constant current source. By keeping the wafer close to the membrane surface, the ionic resistance from the top of the membrane to the surface is much less than the ionic path resistance to the wafer edge, substantially compensating for the sheet resistance in the thin metal film and directing additional current over the center and middle of the wafer.Type: GrantFiled: May 18, 2011Date of Patent: January 7, 2014Assignee: Novellus Systems, Inc.Inventors: Steven T Mayer, Jonathan D. Reid
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Patent number: 8613847Abstract: The method of applying a polyelectrolyte multilayer film for corrosion control involves chemical and/or electrochemical pretreatment of a metallic substrate for better adherence of the protective film to the substrate. The method includes anodically polarizing the substrate in a solution of an acid for a period from one second to five hundred seconds before multilayer deposition. The acid may be an inorganic acid, such as sulfuric acid, phosphoric acid, hydrochloric acid, nitric acid, etc., or an organic acid, such as oxalic acid, acetic acid, etc. The method may include abrading the substrate and rinsing the substrate with deionized water before polarizing the substrate, and applying the polyelectrolyte multilayers following pretreatment.Type: GrantFiled: November 19, 2008Date of Patent: December 24, 2013Assignee: King Fahd University of Petroleum and MineralsInventors: Mazen M. Khaled, Basel F. Abu-Sharkh, Abdalla Manda
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Patent number: 8613848Abstract: A device for the concurrent oxygen generation and control of carbon dioxide for life support system involves two stages, where a first stage removes CO2 from an exhalent side of a ventilation loop and a second stage employs Ceramic Oxygen Generators (COGs) to convert CO2 into carbon and O2. The first stage includes a plurality of chambers and means to switch the ventilation loop through at least one of the chambers, where CO2 removal is carried out before discharge of the CO2 depleted gas to an inhalant side of the ventilation loop, and to exclude the ventilation loop from the remaining chambers of the first stage, where these chambers are placed in communication with the second stage. The second stage has two portions separated by the COGs such that CO2 and the formed carbon remain on an intake portion from the O2 rich atmosphere on the exhaust side, which is plumbed via a metering valve to introduce the O2 rich atmosphere to the inhalant side of the ventilation loop.Type: GrantFiled: April 30, 2008Date of Patent: December 24, 2013Assignee: University of Florida Research Foundation, Inc.Inventors: Eric D. Wachsman, Keith L. Duncan, Helena Hagelin-Weaver
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Patent number: 8574417Abstract: The invention relates to a method for two-step separation of water, salt and particles from a hydraulic fluid by the use of a control unit. The hydraulic fluid is carried into a return oil tank with an electrostatic coalescer provided with a high-voltage transformer with direct current to two electric grids whose electrostatic field gathers water into drops which settle into a collecting tank. The hydraulic fluid is circulated to a filter module for removing any remaining water, salt and particles in filter elements connected in parallel, having hygroscopic cellulose fibers which swell until saturation, the swelling being measured by a sensor measuring the degree of saturation, alternatively conductivity.Type: GrantFiled: August 7, 2009Date of Patent: November 5, 2013Assignee: Tool-Tech ASInventor: Egil Eriksen
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Patent number: 8551317Abstract: Disclosed are a method and an apparatus for forming an oxide coating film with excellent corrosion resistance and adhesiveness on a cathode made of a metal plate by a simple process at low cost. A direct current voltage is applied between an anode (12) and a cathode (13) in an electrolyte solution which cathode (13) is made of a metal plate to be coated with oxide and arranged opposite to the anode (12), while supplying oxygen or a gas containing oxygen into the electrolyte solution, so that the metal plate cathode (13) is coated with oxide, thereby being formed into a oxide-coated metal plate.Type: GrantFiled: November 9, 2004Date of Patent: October 8, 2013Assignees: Toyo Seikan Kaisha, Ltd., Toyo Kohan Co., Ltd.Inventors: Wataru Kurokawa, Hiroshi Matsubayashi, Mitsuhide Aihara, Masanobu Matsubara, Masatoki Ishida, Norimasa Maida
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Patent number: 8551316Abstract: This invention relates to a method for producing a metallic coating layer comprising nickel and molybdenum on an electrically conductive substrate by electrodeposition from an aqueous solution including nickel salts, gluconate anions and citrate anions wherein the substrate acts as the cathode and wherein molybdate is added and wherein the pH of the aqueous solution is adjusted between 5.0 and 8.5. The invention also relates to an electrically conductive substrate provided with such a metallic coating layer electrodeposited from the aqueous solution.Type: GrantFiled: July 11, 2008Date of Patent: October 8, 2013Assignee: Hille & Muller GmbHInventors: Jacques Hubert Olga Joseph Wijenberg, Daniël Adriaan De Vreugd, Ilja Portegies Zwart
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Patent number: 8512543Abstract: A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.Type: GrantFiled: December 9, 2010Date of Patent: August 20, 2013Assignee: Tel Nexx, Inc.Inventors: Arthur Keigler, John Harrell, Zhenqiu Liu, Qunwei Wu
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Patent number: 8506786Abstract: A method for recovery of residual actinide element from chloride molten salts that are formed after electro-refining and/or electro-winning of a spent nuclear fuel and include actinide elements and rare-earth elements is provided. The method comprises conducting electrolysis using a liquid cadmium cathode (LCC) in the chloride molten salt that is formed after electro-refining and/or electro-winning of a spent nuclear fuel and contains rare-earth elements and actinide elements; electro-depositing the actinide elements contained in the chloride molten salt on the LCC in order to reduce a concentration of the actinide elements; and adding a CdCl2 oxidant to the chloride molten salt containing the LCC-metal alloy in order to oxidize the rare-earth elements co-deposited on the LCC, thereby forming the rare-earth chlorides in the chloride molten salt.Type: GrantFiled: April 20, 2010Date of Patent: August 13, 2013Assignees: Korea Atomic Energy Research Institute, Korea Hydro & Nuclear Power Co., Ltd.Inventors: Joon-Bo Shim, Do-Hee Ahn, Seung-Woo Paek, Si-Hyung Kim, Sang-Woon Kwon, Kwang-Rag Kim, Han-Soo Lee
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Patent number: 8500983Abstract: A plating protocol is employed to control plating of metal onto a wafer comprising a conductive seed layer. Initially, the protocol employs cathodic protection as the wafer is immersed in the plating solution. In certain embodiments, the current density of the wafer is constant during immersion. In a specific example, potentiostatic control is employed to produce a current density in the range of about 1.5 to 20 mA/cm2. The immersion step is followed by a high current pulse step. During bottom up fill inside the features of the wafer, a constant current or a current with a micropulse may be used. This protocol may protect the seed from corrosion while enhancing nucleation during the initial stages of plating.Type: GrantFiled: May 24, 2010Date of Patent: August 6, 2013Assignee: Novellus Systems, Inc.Inventors: Thomas A. Ponnuswamy, Bryan Pennington, Clifford Berry, Bryan L. Buckalew, Steven T. Mayer
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Patent number: 8491772Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: August 21, 2009Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8486250Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: February 1, 2002Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8475643Abstract: To provide an anodic oxidation method, a titanium oxide film manufacturing method and a catalyst carrying method which is suitable, for example, for anodic oxidation of aluminum, titanium and catalyst carrying on the surface of alumite (registered trademark), capable of generating an oxide film at a low cost and rapidly by eliminating the use of a strongly acid or strongly basic electrolytic solution and using a carbonated water as an electrolytic solution, capable of controlling the sealing treatment of oxide film through a simple method, capable of effecting the oxide film dyeing and catalyst carrying rationally and easily, and capable of effecting the catalyst carrying safely and surely without eroding a base material. An object (3) to be treated is electrolyzed in an electrolytic solution received in a treatment vessel (1) serving the object (3) as an anodic electrode. It is an anodic oxidation method in which an oxide film is generated on the surface of the object (3).Type: GrantFiled: April 27, 2004Date of Patent: July 2, 2013Inventors: Hideo Yoshida, Kentaro Abe, Kiyohito Sakon
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Patent number: 8475644Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.Type: GrantFiled: October 26, 2009Date of Patent: July 2, 2013Assignee: Novellus Systems, Inc.Inventors: Steven Mayer, Jingbin Feng, Zhian He, Jonathan Reid, Seshasayee Varadarajan
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Patent number: 8475636Abstract: An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.Type: GrantFiled: June 9, 2009Date of Patent: July 2, 2013Assignee: Novellus Systems, Inc.Inventors: Steven Mayer, Jingbin Feng, Zhian He, Jonathan Reid, Seshasayee Varadarajan
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Patent number: 8460534Abstract: The invention relates to a treatment solution for producing substantially chromium(VI) free black conversion layers on alloy layers containing zinc, the solution comprising the following: (i) at least one first carboxylic acid having 1 to 8 carbon atoms, the acid containing no polar groups with exception of the carboxyl group and being a monocarboxylic acid, (ii) at least one second carboxylic acid having 1 to 8 carbon atoms, comprising at least one further polar group that is selected from —OH, —SO3H, —NH2, —NHR, —NR2, —NR3+, and —COOH (wherein R is a C1-C6 alkyl group), (iii) 20 to 400 mmol/l Cr3+ and (iv) 50 to 2000 mmol/l NO3?. The invention further provides a method for the black passivation of surfaces containing zinc, wherein the surface to be treated is immersed into such a treatment solution.Type: GrantFiled: January 15, 2008Date of Patent: June 11, 2013Assignee: Atotech Deutschland GmbHInventors: Jaroslava Krizova, Vaclav Kriz, Jiri Kloubek, Björn Dingwerth
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Patent number: 8444852Abstract: A magnetic water activator resistant to corrosion such as rusting while soft on the outside, and exhibiting excellent portability also from the view point of a profile. The magnetic water activator comprises a pair of magnetic circuit constituting members formed of a high magnetic permeability material and forming a partial annular shape in which one end of each member is coupled to each other rotatably with each recess side facing each other, a permanent magnet arranged along the recess side of each magnetic circuit constituting member, and a substantially annular elastic resin shell partially provided with a slit extending in the radial direction, and internally burying and holding the magnetic circuit constituting member and the permanent magnet in an airtight state.Type: GrantFiled: November 20, 2006Date of Patent: May 21, 2013Assignee: Clavis Japan Co.Inventor: Yuko Ito
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Patent number: 8444840Abstract: Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.Type: GrantFiled: June 30, 2011Date of Patent: May 21, 2013Assignee: Eveready Battery Company, Inc.Inventors: Jason L. Stimits, Jeffrey S. Dreger
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Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
Patent number: 8425753Abstract: The present invention provides a method and precursor structure to form a solar cell absorber layer. The method includes electrodepositing a first layer including a film stack including at least a first film comprising copper, a second film comprising indium and a third film comprising gallium, wherein the first layer includes a first amount of copper, electrodepositing a second layer onto the first layer, the second layer including at least one of a second copper-indium-gallium-ternary alloy film, a copper-indium binary alloy film, a copper-gallium binary alloy film and a copper-selenium binary alloy film, wherein the second layer includes a second amount of copper, which is higher than the first amount of copper, and electrodepositing a third layer onto the second layer, the third layer including selenium; and reacting the precursor stack to form an absorber layer on the base.Type: GrantFiled: December 18, 2009Date of Patent: April 23, 2013Assignee: SoloPower, Inc.Inventors: Serdar Aksu, Mustafa Pinarbasi -
Patent number: 8425751Abstract: Systems and methods for electrodepositing a nickel-cobalt alloy using a rotating cylinder electrode assembly with a plating surface and an electrical contact. The assembly is placed within a plating bath and rotated while running a plating cycle. Nickel-cobalt alloy deposition is selectively controlled by controlling current density distribution and/or cobalt content in the plating bath while running the plating cycle to deposit an alloy of a desired yield strength onto the plating surface in a single plating cycle. In various embodiments, the rotating cylinder may be used as an insitu monitoring method to assist in obtaining the properties desired.Type: GrantFiled: February 3, 2011Date of Patent: April 23, 2013Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Nance Jo Ogozalek, Richard E. Wistrand
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Patent number: 8414860Abstract: Methods and apparatus for controlling a catalytic layer deposition process are provided. A feed stream comprising a carbon source is provided to a catalyst layer. An asymmetrical alternating current is applied to the catalyst layer. A polarization impedance of the catalyst layer is monitored. The polarization impedance can be controlled by varying the asymmetrical alternating current. The controlling of the polarization impedance provides control over the structure and amount of carbon particles deposited on the catalyst layer. The carbon particles may be in the form of nanotubes, fullerenes, and/or nanoparticles.Type: GrantFiled: May 11, 2009Date of Patent: April 9, 2013Assignee: Catelectric Corp.Inventor: Victor Stancovski